6-Layer High-Frequency Hybrid PCB | Core Blind/Buried Vias & Resin Filling | UGPCB Advanced Manufacturing

Professional Definition: What is a 6-Layer High-Frequency Hybrid PCB?

In the fields of 5G communications, เรดาร์ยานยนต์, and high-end computing, มาตรฐาน FR-4 PCBs often fall short in meeting the demands for high-frequency, ความเร็วสูง, and high-stability signal transmission. This is where the ความถี่สูง PCB ไฮบริด becomes critical.

A 6-layer high-frequency hybrid PCB is a multilayer circuit board that integrates different performance-grade high-frequency laminate วัสดุ (such as Rogers) with standard or specialized materials through precision lamination. นี้ hybrid construction strategically places materials to optimize electrical, ความร้อน, and cost performance across different circuit layers. It serves as the core hardware foundation for complex RF microwave circuits and high-speed digital designs.

Product Deep Dive: UGPCB’s High-Performance 6-Layer Hybrid Board

1. Core Specifications & วิทยาศาสตร์วัสดุ

• ชั้น & การก่อสร้าง: 6 เลเยอร์. This represents an optimal balance between complexity, ผลงาน, และค่าใช้จ่าย, suitable for integrating digital control and RF front-end circuits.

• Material Stack-up (Hybrid Core): Rogers 4350B + Rogers 4450F + IT180A. This is the essence of the design.

  • Rogers 4350b: An industry-standard high-frequency circuit board material known for its stable ค่าคงที่ไดอิเล็กตริก (ดีเค) and low ปัจจัยการกระจาย (ฟ), making it ideal for RF signal layers.

  • Rogers 4450F: A prepreg (PP) with high glass transition temperature (ทีจี) and excellent thermal stability, used for bonding layers and ensuring reliability of the hybrid stack-up under thermal stress.

  • IT180A: A high-performance, mid-loss thermoset material often used for inner signal or power plane layers where good signal integrity is required at a managed cost. This hybrid approach applies the best material where it’s needed most.

• ความหนา & Copper Weight: มาตรฐาน 1.6มม thickness for good mechanical rigidity. Copper weight is 1/H/H/H/H/1 oz, indicating 1 oz copper foil for outer layers และ 0.5 ออนซ์ (H oz) copper for inner layers. This facilitates fine-line etching and optimized impedance control.

• พื้นผิวเสร็จสิ้น: อิเล็กโทรไลต์นิกเกิลอิเล็กโทรไลเซิลแพลเลเดียม (เกี่ยวกับ enepic): 120 μin Ni, 2 μin Pd, 2 μin Au. This is a premium finish offering excellent solderability, wire-bond capability, and corrosion resistance. It is particularly suited for พื้นผิว IC and assemblies requiring multiple reflow cycles or gold wire bonding.

2. ข้อควรพิจารณาในการออกแบบ & Operational Principle

• ข้อควรพิจารณาในการออกแบบ:

  1. การควบคุมความต้านทาน & ความสมบูรณ์ของสัญญาณ: Utilizing the stable Dk of Rogers materials, combined with precise stack-up design and trace width/spacing control, enables tight PCB impedance control (เช่น, 50Ω single-ended, 100Ω differential), which is crucial for high-speed PCB signal integrity.

  2. Stack-up Planning: High-speed RF traces are typically routed on the Rogers material layers, while power, พื้น, and lower-frequency digital signals are placed on IT180A layers. A symmetrical stack-up (as in this design) helps prevent warpage.

  3. การจัดการความร้อน: The superior thermal conductivity of Rogers materials, combined with strategic ground vias and thermal relief designs, aids in dissipating heat from high-power RF components.

• Operational Principle: This PCB acts as the “skeleton” and “highway system” of an electronic device. Its core function is to mount and interconnect components (RF chips, ซีพียู, ตัวเก็บประจุ, ฯลฯ). High-frequency signals travel via ไมโครเวฟ PCB transmission lines on the Rogers layers with minimal loss and distortion; power is distributed stably through inner-layer copper planes; and complex interconnections are achieved via blind and buried vias, shortening paths and enhancing electrical performance.

3. Four Advanced Processes: Ensuring Reliability & ผลงาน

1. Core Blind/Buried Vias: These vias connect adjacent layers within a core (เช่น, Rogers laminate) without penetrating the entire board. This significantly increases routing density in การเชื่อมต่อระหว่างกันที่มีความหนาแน่นสูง (HDI) PCBS, reduces parasitic effects, and improves high-frequency performance.

2. Resin Filled Vias: After plating, through-holes or blind/buried vias are filled with epoxy resin. This prevents chemical entrapment, provides a flat surface for fine-line patterning of subsequent layers, and enhances via reliability.

3. ผ่านแผ่น (VIP): A via is placed directly within a component pad, then filled and planarized with resin and copper. This is a hallmark of advanced HDI PCBS, enabling further miniaturization and higher component density.

4. Metalized Edge (Edge Plating): A continuous metal layer (โดยทั่วไปแล้วทองแดง) is plated along the board edge. This provides excellent EMI shielding, protects internal circuits, and strengthens the edge for connector mating and mechanical wear.

4. Key Performance Characteristics

• Superior High-Frequency Performance: การสูญเสียต่ำ, stable Dk for pristine signal transmission in RF PCB.

• ความสมบูรณ์ของสัญญาณที่ยอดเยี่ยม: Precision impedance control meets การออกแบบ PCB ความเร็วสูง ความต้องการ.

• การเชื่อมต่อระหว่างกันที่มีความหนาแน่นสูง (HDI): Blind/buried vias and VIP technology support high-density PCB layouts.

• ความน่าเชื่อถือที่เพิ่มขึ้น: Robust hybrid construction, ENEPIG finish, and metalized edges suit demanding environments.

• Improved Thermal & Shielding Performance: Good thermal conductivity and effective EMI suppression.

5. Scientific Classification

• โดยการนับเลเยอร์: PCB หลายชั้น

• By Material Type: ลูกผสม / Mixed Material PCB

• โดยเทคโนโลยี: Advanced HDI PCB

• โดยการสมัคร: RF Microwave PCB / High-Speed Digital PCB

6. Standard Production Flow

Engineering Design → Material Prep & Shearing → Rogers Material Laser Drilling (Blind Vias) → เดสเมียร์ & Metallization → Inner Layer Imaging & Etching → Core Lamination (Hybrid Bonding) → Mechanical Drilling → Resin Filling & Curing → Outer Layer Imaging → ENEPIG Surface Finish → Metalized Edge Plating → Solder Mask & Silkscreen → Electrical Test & การตรวจสอบขั้นสุดท้าย.

7. แอปพลิเคชันหลัก (ใช้เคส)

This product is ideal for high-reliability electronic projects with stringent demands:

• 5โครงสร้างพื้นฐานการสื่อสาร: RF PCB within AAUs (Active Antenna Units) and remote radio units.

• อุปกรณ์อิเล็กทรอนิกส์ยานยนต์: Radar PCBs for ADAS and autonomous vehicles (เช่น, 77GHz radar).

• การบินและอวกาศ & การป้องกัน: High-Reliability PCBs in radar systems, satellite comms, and EW equipment.

• High-End Test & Measurement: Core boards for network analyzers and spectrum analyzers.

• High-Performance Computing & Data Centers: Backplanes or motherboards for high-speed servers/switches.

Why Choose UGPCB for Your 6-Layer High-Frequency Hybrid PCB?

In advanced การผลิต PCB, consistency and attention to detail determine success. UGPCB possesses deep expertise across the entire complex process chain—from Rogers material processing และ laser drilling ถึง resin filling และ ENEPIG plating. We deliver not just boards that meet specifications, but robust PCB solutions that ensure your product’s successful volume production.

Contact us today for dedicated technical support and a competitive quote for your 5G PCB, automotive radar PCB, หรือ high-frequency module PCB project. Let UGPCB be your trusted partner for ความถี่สูง, high-speed PCB fabrication.