F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates
F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.
Technical Specifications
รูปร่าง
The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.
Types
- F4B255
- F4B265
ค่าคงที่ไดอิเล็กตริก
- 2.55
- 2.65
Available Dimensions (มม)
- 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
- 840×840, 1200×1000, 1500×1000
- Custom dimensions are available upon request.
ความหนาของทองแดง
- 0.035μm, 0.018μm
Thickness and Tolerance (มม)
| Laminate Thickness | Tolerance |
|---|---|
| 0.17, 0.25 | ±0.025 |
| 0.5, 0.8, 1.0 | ±0.05 |
| 1.5, 2.0 | ±0.05 |
| 3.0, 4.0, 5.0 | ±0.09 |
The laminate thickness includes the copper thickness. Custom dimensions are available upon request.
ความแข็งแรงเชิงกล
| ความหนา (มม) | Maximum Warp | Single Side | Double Side |
|---|---|---|---|
| 0.25～0.5 | 0.030 | 0.050 | 0.025 |
| 0.8～1.0 | 0.025 | 0.030 | 0.020 |
| 1.5～2.0 | 0.020 | 0.025 | 0.015 |
| 3.0～5.0 | 0.015 | 0.020 | 0.010 |
Cutting/Punching Strength:
- Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, ไม่มีการปราบปราม.
- ความหนา >1มม: No burrs after cutting, minimum space between punching holes is 1.10mm, ไม่มีการปราบปราม.
ความแข็งแรงของเปลือก (1oz copper)
- Normal State: ≥15N/cm; No bubbles or delamination.
- After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 ไม่กี่วินาที).
Chemical Properties
These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.
Electrical Properties
| ชื่อ | Test Condition | หน่วย | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.2～2.3 |
| การดูดซับความชื้น | Dip in distilled water 20±2°C for 24 ชั่วโมง | % | ≤0.1 |
| Operating Temperature | High-low temperature chamber | องศาเซลเซียส | -50～+260 |
| การนำความร้อน | W/m/k | 0.3 | |
| ซีทีอี (typical) | 0～100°C | ppm/° C | x:16, y:21 z:186 |
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| ความต้านทานพื้นผิว | 500V DC, Normal state | M·Ω | ≥1*10⁴ |
| Constant humidity and temperature | ≥5*10³ | ||
| ความต้านทานระดับเสียง | Normal state | MΩ.cm | ≥1*10⁶ |
| Constant humidity and temperature | ≥9*10⁴ | ||
| Pin Resistance | 500VDC, Normal state | MΩ | ≥5*10⁴ |
| Constant humidity and temperature | ≥5*102 | ||
| Surface Dielectric Strength | Normal state, d=1mm (Kv/mm) | ≥1.2 | |
| Constant humidity and temperature | ≥1.1 | ||
| ค่าคงที่ไดอิเล็กตริก | 10GHZ, | εr | 2.55/2.65 (±2%) |
| Dissipation Factor | 10GHZ, | tgδ | ≤1*10⁻³ |