--- title: "F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates" id: "5607" type: "post" slug: "f4t-1-2-insulative-teflon-woven-glass-fabric-copper-clad-laminates" published_at: "2024-12-24T06:27:09+00:00" modified_at: "2024-12-24T06:27:09+00:00" url: "https://www.ugpcb.com/why-us/pcb-material-list/f4t-1-2-insulative-teflon-woven-glass-fabric-copper-clad-laminates/" markdown_url: "https://www.ugpcb.com/why-us/pcb-material-list/f4t-1-2-insulative-teflon-woven-glass-fabric-copper-clad-laminates.md" excerpt: "F4T-1/2: A High-Performance Circuit Baseplate for Microwave PCBs F4T-1/2 is a specialized circuit baseplate constructed from insulative Teflon PCB, featuring electrolytic copper foil on both sides. The material undergoes high-temperature and high-pressure treatment to ensure optimal performance. This product boasts..." taxonomy_category: - "PCB Material" --- ## F4T-1/2: A High-Performance Circuit Baseplate for Microwave PCBs F4T-1/2 is a specialized circuit baseplate constructed from insulative Teflon PCB, featuring electrolytic copper foil on both sides. The material undergoes high-temperature and high-pressure treatment to ensure optimal performance. This product boasts superior electrical properties, such as low dielectric constant and minimal loss, coupled with excellent mechanical strength, making it an ideal choice for Microwave PCB applications. ### Technical Specifications #### **Appearance** - Adheres to the general requirements for microwave PCB baseplates. #### **Dimensions (mm)** - Standard sizes include 150*150, 220*160, 250*250, and 200*300. - Custom dimensions are available upon request. #### **Thickness and Tolerance** - Available thicknesses: 0.5±0.05, 1±0.1, 1.5±0.15, 2±0.2, 3±0.3 mm. - Plate thickness includes copper layer; custom laminations are possible for special requirements. #### **Mechanical Properties** - **Angularity:** 0.02mm/mm for double-layer boards. - **Cutting/Punching Property:** No burrs post-cutting; minimum hole spacing of 0.55mm. - **Peel Strength:** ≥18N/cm normally; ≥6 N/cm under constant humidity and temperature conditions. #### **Chemical Properties** - Suitable for standard PCB chemical etching processes without altering material dielectric properties. ## Electrical Properties | Name | Test Conditions | Unit | Specification | | --- | --- | --- | --- | | Gravity | Normal state | g/cm³ | 2.2–2.3 | | Water absorption rate | Dip in distilled water at 20±2°C for 24h | % | ≤0.01 | | Operating temperature | High-low temp chamber | °C | -100～+150 | | Thermal conductivity coefficient | | Kcal/m.h.°C | 0.4 | | Coefficient of thermal expansion | Temp rise 96°C/hr | *1 | 9.8–10*10^-5 | | Shrinkage factor | 2 hours boiling water | % | 0.0005 | | Surface insulation resistance | 500V DC, normal state | MΩ | ≥1*10⁷ | | Constant humidity and temperature | | MΩ | ≥1*10⁵ | | Volume resistance | Normal state | MΩ.cm | ≥1*10¹⁰ | | Constant humidity and temperature | | MΩ.cm | ≥1*10⁷ | | Pin resistance | 500V DC, normal state | MΩ | ≥1*10⁵ | | Constant humidity and temperature | | MΩ | ≥1*10⁵ | | Surface dielectric strength | Normal state | δ=1mm(kV/mm) | ≥1.5 | | Constant humidity and temperature | | δ=1mm(kV/mm) | ≥1.4 | | Permittivity | 10GHZ | εr | 2.2(±2%) | | Dielectric loss angle tangent | 10GHZ | tgδ | ≤1*10^-3 | This comprehensive overview highlights F4T-1/2’s technical prowess, ensuring it meets stringent industry standards for microwave PCB baseplates. 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