High-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-768; Prepreg: TU-768P
TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.
Main Applications
- Consumer Electronics
- Server, workstation
- Automotive
Key Features
- Lead Free process compatible
- Excellent coefficient of thermal expansion
- Anti-CAF property
- Superior chemical and thermal resistance
- Fluorescence for AOI
- Moisture resistance
Property
| Typical Values | Specifications |
|---|---|
| Tg (DMA) | 190°C |
| Tg (DSC) | 180°C |
| Tg (TMA) | 170°C |
| Td (TGA) | 340°C |
| CTE z-axis (50 to 260 °C) | 2.7% |
| T-260/ T288 | >60 min/ >15 min |
| Permittivity @1GHz(RC 50%) | 4.3 |
| Loss Tangent @1GHz(RC 50%) | 0.018 |
Industry Approvals
- IPC-4101E Type Designation: /98, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL Designation – ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability
- Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
- Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
- Prepregs: Available in roll or panel form
- Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.