UGPCB

2-طبقة FR-4 ثنائي الفينيل متعدد الكلور | 1.6مم سميكة, Lead-Free HASL | النموذج الأولي & Production – UGPCB

High-Performance FR-4 Double-Sided PCB Product Overview & Definition

هذا 2-Layer Rigid لوحة الدوائر المطبوعة (ثنائي الفينيل متعدد الكلور) from UGPCB is a fundamental and widely used electronic interconnect solution. It features a standard 1.6mm board thickness, dimensions of 224.02mm x 189mm, and utilizes high-grade KB FR-4 laminate. This double-sided PCB serves as the essential “backbone” for electronic designs, providing reliable electrical connections and mechanical support for components. It is an ideal, cost-effective choice for a vast range of industrial control, الالكترونيات الاستهلاكية, and power supply applications.

2-Layer Rigid Printed Circuit Board

اعتبارات التصميم الحرجة

Successful design of a double-sided PCB requires balancing electrical performance with manufacturability. Key considerations include:

مبدأ العمل & Structure

The functionality of this double-layer circuit board stems from its layered structure:

  1. بناء: The core consists of an FR-4 insulating dielectric layer, clad with copper foil (typically 1 أوقية) on both sides. The unwanted copper is etched away during تصنيع ثنائي الفينيل متعدد الكلور, forming the desired circuit traces.

  2. Electrical Interconnection: Circuits on the two layers are connected vertically via Plated Through-Holes (PTHs), created through mechanical drilling followed by electroless and electrolytic copper deposition.

  3. Surface Protection: ال Lead-Free Hot Air Solder Leveling (ينزف) finish applied to exposed copper pads prevents oxidation and ensures excellent solderability for component assembly.

Product Classification & مواد

Per the provided specifications, this product is accurately classified as follows:

Performance & الميزات الرئيسية

Leveraging the specified materials and processes, this PCB delivers the following core performance benefits:

Detailed Manufacturing Process

UGPCB adheres to a stringent, high-standard PCB manufacturing process:

  1. Engineering & CAM: Gerber file analysis, DFM check, and photoplot generation.

  2. Panelization: Cutting the large FR-4 copper-clad laminate into production panels.

  3. حفر: CNC drilling of component holes and PCB vias.

  4. Hole Metallization: Desmear, chemical copper deposition, and electrolytic copper plating to form conductive Plated Through-Holes (PTHs).

  5. Patterning: Applying photoresist, exposure, development to transfer the circuit image.

  6. النقش: Removing unwanted copper to form precise circuit traces.

  7. قناع اللحام & Silkscreen: Applying LPI solder mask (typically green) and legend printing.

  8. الانتهاء من السطح: Applying Lead-Free HASL coating to exposed pads.

  9. Routing & Electrical Testing: Profiling to final board outline and performing Electrical Test (مسبار الطيران or Fixture Test).

  10. التفتيش النهائي & Packaging: Comprehensive الفحص البصري الآلي (الهيئة العربية للتصنيع), dimensional verification, and vacuum-sealed, moisture-proof packaging.

التطبيقات الأولية & Use Cases

This specification of double-sided FR-4 PCB is widely deployed in reliable and cost-sensitive التطبيقات:

Why Choose UGPCB for Your Double-Sided PCB Needs?

Partnering with UGPCB guarantees:

Ready to start your project? Contact UGPCB today for a competitive quote and expert support. Let us be your trusted الشركة المصنعة لثنائي الفينيل متعدد الكلور and partner for success.

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