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PCB Fabrication capability - UGPCB

PCB Fabrication capability

PCB Fabrication capability

UGPCB: World-Leading PCB Manufacturer – High-Precision Circuit Board Production, Quick-Turn Prototyping & Stencil Solutions

Core Value of PCB Manufacturing & Industry Challenges

As the “skeleton” of electronic devices, PCBs directly impact product performance and cost. Industry statistics indicate PCBs account for 12%-18% of total electronic product costs, and quality defects can increase post-production repair costs by 300% (IPC standards data). UGPCB leverages its 28,000 m² modern facility and 1300-person professional team (35% technical experts) to specialize in solving high-end manufacturing challenges like high-frequency microwave PCBs, HDI boards, and IC substrates.

Three Core Capabilities: UGPCB’s Manufacturing Advantages

1. Scalable PCB Production Capacity

  • Precision Equipment: Utilizes fully automated LDI exposure machines (±1.5μm accuracy) and vacuum etching lines (1.5/1.5 mil line width/spacing).

  • Multilayer PCB Technology: Supports 1-100 layer boards with interlayer alignment tolerance ≤15μm (Formula: δ = k√(n), where n = layer count, k = process constant).

  • Material Versatility: Rogers, FR4, aluminum-based PCBs, etc., meeting high-temperature demands (Tg 180°C-220°C) for automotive/aerospace applications.

Automated PCB Manufacturing Line

2. 24-Hour Rapid PCB Prototyping Service

  • Global Fastest Delivery: 24 hours for 2-layer, 72 hours for 6-layer boards (industry average: 5-7 days).

  • Zero Startup Cost: Accepts orders from 1 piece with free DFM engineering review.

  • Success Story: Reduced new product development cycle by 60% for a German industrial client.

HDI PCB Structure

3. Laser Stencil Core Technology

  • Tension Control: 35±5 N/cm² (IPC-7525 compliant).

  • Nano Coating: Extends lifespan to 500,000 print cycles.

  • Smart Inspection: AOI systems detect aperture defects ≥15μm.

HDI PCB Structure

Scientific Manufacturing: Data-Driven PCB Process Innovation

Key Process Control Points (Real Data)

Parameter UGPCB Standard Industry Benchmark
Copper Thickness Uniformity ±1.5μm ±5μm
Impedance Control ±5% ±10%
Hole Position Accuracy ±25μm ±50μm

Defect Prevention (Solving User Pain Points)

  • Pad Overlap Issues: Dynamic drilling compensation algorithm used (Compensation Δd = 0.85 × Tool Wear Rate).

  • Silkscreen Imperfections: Enforced DFM rule checks (Font ≥40mil, Distance to Pad >10mil).

Cross-Sectional Structure Diagram of Multilayer PCB

End-to-End Service: From Design to Delivery

File Specifications (Improving First-Pass Yield)

Quality Certification System

  • Dual-Standard Inspection: UGPCB Level 2 + IPC Class 3.

  • Testing Equipment: Flying Probe Tester (0.1mm min. pitch), 3D X-ray (BGA inspection).

PCB Quality Inspection Flowchart

Take Action Now: Get Your Custom PCB Solution

Limited-Time Offer: Submit Gerber files → Receive Quote + Free Stencil Design within 24 hours.

  • Contact: sales@ugpcb.com / Online Quotation System

  • Key Solutions: PCB Bulk Manufacturing Supplier | Rush Prototype Service | High-Precision Stencil Fabrication

*”UGPCB Level 2 certified 6-layer boards achieved a 0.02% customer return rate (industry average: 0.8%).” – 2024 Client Audit Report*

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