Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview
The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.
Definition
A High-Density Interconnect (HDI) module refers to a Leiterplatte (Leiterplatte) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.
Entwurfsanforderungen
The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:
- Schichten: Four layers with a specific stack-up of 1+N+1.
- Material: Made from high-quality FR-4 material.
- Dicke: The overall finished thickness of the module is 1.0mm.
- Kupferdicke: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
- Oberflächenbehandlung: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
- Min Trace/Raum: Supports minimal trace and space widths of 4mil.
- Min -Loch: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.
Arbeitsprinzip
The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.
Anwendungen
This versatile module is suitable for a wide range of applications including but not limited to:
- Industrieausrüstung: Automation systems, control panels.
- Communication Devices: Router, access points, Set-Top-Boxen.
Einstufung
The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.
Materialzusammensetzung
Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.
Leistungseigenschaften
- Signalintegrität: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
- Thermalmanagement: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
- Haltbarkeit: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.
Strukturelle Merkmale
- Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
- Layer Stack-Up: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.
Produktionsprozess
The manufacturing process involves several key steps:
- Materialvorbereitung: Cutting and preparing the FR-4 substrate.
- Kupferlaminierung: Applying copper layers on both sides and inner layers as per design.
- Radierung: Removing excess copper to form the desired circuit patterns.
- Schichtausrichtung: Stacking and aligning the layers accurately.
- Bonding: Using heat and pressure to bond the layers together.
- Oberflächenbehandlung: Applying immersion gold and OSP finishes.
- Qualitätskontrolle: Conducting thorough inspections and tests to ensure product quality
Anwendungskoffer -Szenarien
Unterhaltungselektronik
In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.
Industrieausrüstung
Für Automatisierungssysteme, the module provides dependable communication links in harsh industrial environments.
Communication Devices
In routers and access points, the module enhances network performance with its superior signal handling capabilities.
By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.