Produktübersicht
The 6L 1+N+1 HDI mobile mainboard is a high-density interconnect (HDI) Leiterplatte (Leiterplatte) designed for use in mobile devices. With its advanced design and construction, this mainboard offers superior performance and reliability for demanding mobile applications.
Definition
HDI stands for High-Density Interconnect, which refers to PCBs that have higher wiring density than traditional PCBs. The “1+N+1” designation indicates the layer structure of the PCB, with one power layer, N Signalschichten, and one ground layer.
Entwurfsanforderungen
The design of the 6L 1+N+1 HDI mobile mainboard must meet several key requirements:
- High signal integrity to support fast data transfer rates
- Low crosstalk and interference to ensure reliable communication
- Robust mechanical properties to withstand the stresses of daily use
- Thermal management to dissipate heat effectively
Arbeitsprinzip
The 6L 1+N+1 HDI mobile mainboard operates by connecting various electronic components through a network of conductive pathways. These pathways are created using copper traces on the PCB layers, which are insulated from each other by layers of dielectric material. Electrical signals travel along these traces to perform the device’s functions.
Zweck und Anwendungen
This type of mobile mainboard is commonly used in smartphones, Tabletten, and other portable electronic devices where space is limited but performance requirements are high. Its compact size and high functionality make it ideal for modern mobile technology.
Einstufung
The 6L 1+N+1 HDI mobile mainboard falls under the category of high-end mobile mainboards due to its advanced features and construction. It is designed specifically for mobile applications requiring high performance and reliability.
Materialien verwendet
The main material used for this mainboard is FR-4, a flame-resistant glass-epoxy laminate composite. This material provides excellent thermal stability and mechanical strength, making it suitable for high-performance mobile applications.
Leistungseigenschaften
- Hohe Signalintegrität: Ensures fast data transfer rates without loss or distortion.
- Low Crosstalk: Minimizes interference between adjacent signal traces.
- Robust Mechanical Properties: Withstands the physical stresses of daily use.
- Effective Thermal Management: Dissipates heat efficiently to prevent overheating.
Struktur und Merkmale
- Layer Structure: Consists of six layers with a configuration of 1+N+1, where N represents the number of signal layers.
- Kupferdicke: Inner layers have a thickness of 1 oz (Unze), while outer layers are 0.5 oz.
- Oberflächenbehandlung: Immersionsgold, Dies bietet hervorragende Lötlichkeit und Korrosionsbeständigkeit.
- Minimum Trace/Space: Capable of producing fine details with minimum trace widths and spaces of 3 Mil.
- Hole Types: Mechanically drilled holes as small as 0.2 mm and laser-drilled holes as fine as 0.1 mm.
Produktionsprozess
The manufacturing process for the 6L 1+N+1 HDI mobile mainboard involves several stages:
- Materialvorbereitung: Selection of high-quality FR-4 substrates.
- Schichtstapel: Arranging the layers in the desired order.
- Radierung: Removing excess copper to create the desired circuit pattern.
- Überzug: Applying a thin layer of metal to the exposed copper areas.
- Oberflächenbehandlung: Applying immersion gold for enhanced solderability.
- Montage: Mounting components onto the mainboard.
- Testen: Conducting thorough electrical and functional tests to ensure quality.
- Endinspektion: Visual and automated optical inspection to check for defects.
- Verpackung: Safely packaging the finished product for shipment.
Anwendungskoffer -Szenarien
- Unterhaltungselektronik: Smartphones, Tabletten, Smartwatches, usw.
- Tragbare Geräte: Fitness -Tracker, health monitors, usw.
- Kfz -Elektronik: In-car entertainment systems, navigation units, usw.
- Industrielle Anwendungen: Bedienfelder, sensor interfaces, usw.
Zusammenfassend, the 6L 1+N+1 HDI mobile mainboard is an advanced PCB designed specifically for high-performance mobile applications. Its robust construction, superior signal integrity, and efficient thermal management make it an ideal choice for modern mobile technology.