What is a 10Layers ENIG Board?
A 10-layer ENIG (Oro de inmersión de níquel químico) board is an advanced multilayer printed circuit board (tarjeta de circuito impreso) with ten layers of conductive material, typically copper, separados por capas aislantes. The “ENIG” refers to the surface treatment applied to the copper traces, which involves electroless nickel and immersion gold plating. Este tipo de tarjeta de circuito impreso is designed for high-density and complex electronic applications.
Requisitos de diseño
Designing a 10-layer ENIG board involves several key considerations:
- Material: Made from TU-768, a high-performance composite material known for its excellent electrical properties and durability.
- Recuento de capas: Consists of ten layers, allowing for intricate and dense circuit designs.
- Espesor de cobre: Ranges from 2OZ to 3OZ, providing robust conductivity for high-power applications.
- Tratamiento superficial: Features immersion gold plating, which offers excellent solderability and corrosion resistance.
- Trace and Space: Minimum trace and space are set at 3mil (0.075milímetros), enabling fine details in the circuit design.
How Does it Work?
The 10-layer ENIG board functions by providing multiple layers of conductive pathways, separados por capas aislantes, to interconnect electronic components. The immersion gold surface treatment ensures reliable soldering and long-term protection against oxidation and wear.
Aplicaciones
Due to their complexity and reliability, 10-layer ENIG boards are widely used in various high-end electronic applications including:
- Sistemas aeroespaciales y de defensa.
- High-speed networking equipment
- Advanced telecommunication devices
- Equipo de imágenes médicas
Clasificación
10-layer ENIG boards can be classified based on several factors:
- Por material: Most commonly made from TU-768 due to its balance of cost, fortaleza, y propiedades electricas.
- By Copper Thickness: Varies from lightweight (2ONZ) to heavyweight (3ONZ) depending on the application’s needs.
- By Surface Treatment: Features immersion gold plating, which provides excellent solderability and corrosion resistance.
Materials Used
The primary materials used in manufacturing 10-layer ENIG boards include:
- TU-768: A glass-reinforced epoxy laminate that provides excellent mechanical strength and thermal stability.
- Cobre: Used for the conductive layers, with thickness varying based on design requirements.
- Máscara de soldadura: Typically green or white, it protects the copper traces from oxidation and accidental short circuits.
- Oro de inmersión: Applied as a surface treatment to improve solderability and protect against corrosion.
Características de rendimiento
Key performance attributes of a 10-layer ENIG board include:
- Densidad alta: Allows for more componentes to be packed into a smaller area.
- Fiabilidad: The use of multiple layers reduces the risk of electrical shorts and improves signal integrity.
- Integridad de señal: Improved due to shorter signal paths and reduced crosstalk.
Structural Composition
Estructuralmente, a 10-layer ENIG board comprises:
- Conductive Layers: Made of copper, etched into the desired circuit patterns.
- Insulating Layers: Prevent electrical shorts between conductive layers.
- Plated Through-Hole Vias: Facilitate connections between different layers.
Distinctive Features
Some notable features of a 10-layer ENIG board are:
- Fine Pitch: Allows for high-density interconnects making it ideal for compact devices.
- Robustness: The use of multiple layers provides a strong mechanical bond between the board and components.
- Versatilidad: Suitable for a wide range of applications due to customizable layer counts and material choices.
Proceso de producción
The manufacturing process of a 10-layer ENIG board involves several steps:
- Diseño y diseño: Using specialized software to create the circuit pattern.
- Preparación de material: Cutting base materials to size and cleaning surfaces.
- Laminación: Stacking and bonding individual layers under heat and pressure.
- Aguafuerte: Removing excess copper to form the desired circuit paths.
- Enchapado: Adding a thin layer of metal to vias and exposed copper areas.
- Aplicación de máscara de soldadura: Applying the green or white coating to protect traces.
- Tratamiento superficial: Applying immersion gold for solderability and corrosion resistance.
- Inspección final: Ensuring quality and functionality before shipment.
Casos de uso
Common scenarios where a 10-layer ENIG board might be employed include:
- High-density interconnect applications in aerospace and defense systems.
- Advanced communication systems requiring low signal loss.
- Portable medical instruments needing reliable performance in harsh environments.
- Automotive electronics demanding robustness and longevity.
En resumen, the 10-layer ENIG board represents a significant advancement in printed circuit board technology offering unparalleled complexity and performance for modern electronic applications Its design flexibility combined with superior signal integrity and durability makes it an essential component in the development of next-generation high-end electronics and beyond