Fabricant de circuits imprimés haute fréquence hybrides en céramique RO4350B | 4Carte de circuit micro-ondes L RF | UGPCB

Engineer Superior RF Performance: The UGPCB RO4350B Ceramic Hybrid High Frequency PCB Solution

In the era of 5G, radar, et communications satellites, the performance of your PCB haute fréquence is critical to system success. Selecting a PCB laminate that offers exceptional RF characteristics, fiabilité, and cost-effectiveness is paramount for every RF engineer and procurement specialist. UGPCB, un leader Fabricant de PCB et PCBA service provider, presents its advanced Ceramic Hybrid High Frequency PCB utilizing Rogers RO4350B and FR4 lamination technology. We deliver a complete solution from Conception de circuits imprimés à Assemblage de circuits imprimés (PCB).

1. Présentation du produit & Définition

Le RO4350B Ceramic Hybrid High Frequency PCB is a high-performance circuit imprimé engineered for radio frequency (RF) and microwave applications. It innovatively combines Rogers RO4350B ceramic-filled hydrocarbon laminate with standard FR4 epoxy glass material through PCB multicouche lamination technology. This “hybrid” approach allows critical RF circuits (par ex., antennes, filtres, amplifiers) to be routed on the low-loss RO4350B areas, while cost-sensitive digital control and power management circuits reside on the FR4 areas, achieving an optimal balance between performance and cost.

2. Core Material & Construction

• Matériels: This product features a Rogers RO4350B + FR4 mixed laminate construction. RO4350B is a ceramic-filled thermoset polymer material known for its stable dielectric constant (Ne sait pas) et un faible facteur de dissipation (Df). FR4 is a standard epoxy glass weave laminate, valued for its economy and versatility.

• Construction: This model is a standard 4-couche PCB. Typiquement, the outer layers (L1 & L4), which host RF circuitry, use RO4350B dielectric, bonded to the inner FR4 core using prepreg. This structure ensures signal integrity in RF paths while reducing overall material cost.

• Key Specifications & Conformité:

  • Constante diélectrique (Ne sait pas): 3.48 @ 10 GHz. This stable value minimizes phase shift and impedance variance, crucial pour controlled impedance PCB design.

  • Conductivité thermique: 0.69 W / m · k. Superior to standard FR4, aiding heat dissipation from active RF components and improving long-term reliability.

  • Cote d'inflammabilité: UL 94 V-0. Meets the highest standard for flame retardancy.

  • Finition de surface: Immersion Or (ACCEPTER). Provides a flat, solderable surface, excellent oxidation resistance, and long shelf life, idéal pour high-frequency SMT assembly et PCBA processes.

  • Épaisseur finie: 1.0 mm

  • Poids du cuivre: 1 once (35 µm)

3. Critical Design Considerations & Operational Principle

1. Contrôle de l'impédance: RF transmission lines (par ex., microstrip, stripline) require precise impedance control (typically 50Ω or 75Ω). Designers must calculate trace width using the stable Dk of RO4350B (3.48) and dielectric thickness (0.762mm) to ensure minimal signal reflection.

2. Hybrid Zone Transition: Signal transitions between RO4350B and FR4 areas cause impedance discontinuities due to Dk mismatch. Optimal Disposition des circuits imprimés requires mitigation techniques like tapered traces, matching networks, or optimized via transitions.

3. Gestion thermique: Despite its improved thermal conductivity (0.69 W / m · k), high-power RF designs may still require thermal vias, heatsinks, or metal-core substrates for effective PCB thermal management.

4. Operational Principle: Ce circuit imprimé acts as the physical substrate and transmission medium for RF signals. Its core function is to utilize the low-loss, low-dispersion properties of RO4350B to transmit electromagnetic signals with high efficiency and minimal distortion across target frequency bands (from hundreds of MHz to tens of GHz), while integrating control logic via the hybrid structure for complete system functionality.

4. Caractéristiques clés & Avantages

• Exceptional High-Frequency Performance: Low loss and stable Dk/Df ensure superior Intégrité du signal.

• Optimized System Cost: Hybrid construction significantly reduces the use of premium material, offering a cost-effective PCB solution.

• Haute fiabilité & Durabilité: V-0 flammability rating and robust thermal performance ensure stability in demanding environments.

• Conception & Assembly Friendly: Compatible with standard Fabrication de circuits imprimés et SMT assembly processes, streamlining Production de PCBA.

5. Processus de fabrication

UGPCB adheres to a strict contrôle de qualité regime for high frequency PCB manufacturing:
Material Prep & Inner Layer Imaging → Hybrid Lamination & Registration → Precision Drilling & Plating → Pattern Imaging & Etching → Impedance Control Testing → Solder Mask & Finition de surface (ACCEPTER) → Electrical Testing & Final Audit → Shipping. Each step is specially controlled for high-frequency characteristics.

6. Applications principales & Cas d'utilisation

This product is ideal for applications demanding high frequency and signal fidelity:

• Wireless Communications: 5G base station antennas/RF modules, microwave backhaul, satellite communication terminals.

• Électronique automobile: Millimeter-wave radar (77 GHz), V2X telematics modules.

• Aérospatial & Défense: Radar systems, electronic warfare (EW) équipement, guidance systems.

• Test & Measurement: Cœur RF circuit boards in network analyzers, spectrum analyzers, and high-frequency signal sources.

Partner with UGPCB for Your High-Frequency Projects

Whether you are an engineer engaged in RF PCB layout or a sourcing professional seeking a reliable circuit board supplier, UGPCB’s RO4350B Hybrid High Frequency PCB is your ideal solution. We provide not only high-quality Fabrication de circuits imprimés but also full-spectrum support from PCB design review to end-to-end PCBA services, accelerating your time-to-market.

Contactez-nous today for a free design consultation and a competitive quote. Power your next RF innovation with UGPCB.