Introduction
UGPCB‘s 2-Layer Rigid PCB is a fundamental, haute fiabilité circuit imprimé solution engineered for demanding applications. Built on a robust Substrat FR-4 TG150 with a standard 1.60mm thickness, it delivers an optimal balance of performance, durabilité, et la rentabilité. The board features a reliable lead-free Hot Air Solder Leveling (HASL) finition de surface, a protective black solder mask, and clear white silkscreen legends for identification.

Présentation du produit & Classification
This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a PCB rigide (by construction), un 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (Classe CIB 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.
Conception & Principe opérationnel
Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (par ex., 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: le FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, trous traversants plaqués are interlayer connectors, le masque de soudure is a protective coating, et le écran à soigneux provides navigation.
Construction, Matériels & Performance
The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:
-
Cœur: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.
-
Cuivre: Norme 1 once (35µm) electrodeposited copper foil.
-
Finitions: Black LPI solder mask and white epoxy silkscreen.
-
Finition de surface: Lead-Free HASL for excellent solderability.
This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.
Processus de fabrication & Contrôle de qualité
Our production follows Normes IPC, encompassing CAM engineering, precision drilling, électroplaste, LPI solder mask application, legend printing, lead-free HASL surface finishing, et tests électriques. Every board undergoes 100% electrical testing and Inspection optique automatisée (Zone d'intérêt) to meet stringent quality criteria.
Applications
This versatile PCB is ideal for:
-
Systèmes de contrôle industriels: Automates, entraînements à moteur, sensor interfaces.
-
Électronique de puissance: Alimentations à découpage (SMPS), UPS boards, LED drivers.
-
Automobile & Electronique grand public: Auxiliary control modules, amplificateurs audio, appliance controllers.
Key Specifications Table
| Paramètre | Spécification |
|---|---|
| Calques | 2 |
| Épaisseur du panneau | 1.60 mm (Standard) |
| Matériau de base | FR-4, Tg ≥ 150°C |
| Poids du cuivre | 1 once (35 µm) Standard |
| Masque de soudure | Noir, IPV |
| Écran à soigneux | Blanc |
| Finition de surface | HASL sans plomb |
| Min.. Trace/Espacement | ≥ 0.15 mm (6 mil) |
| Standard Compliance | IPC-A-600, Classe CIB 2 |