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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4TG150, 1.6mm, HASL sans plomb - UGPCB

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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4TG150, 1.6mm, HASL sans plomb

Nombre de couches: 2 Couches PCB rigide

Épaisseur du panneau: 1.60mm

Matériel: FR-4TG150

Finition de surface: Lead-Free Hot Air Solder Leveling (HASL), White Solder Mask, Black Legend

  • Détails du produit

Introduction

UGPCB‘s 2-Layer Rigid PCB is a fundamental, haute fiabilité circuit imprimé solution engineered for demanding applications. Built on a robust FR-4 TG150 substrate with a standard 1.60mm thickness, it delivers an optimal balance of performance, durabilité, et la rentabilité. The board features a reliable lead-free Hot Air Solder Leveling (HASL) finition de surface, a protective black solder mask, and clear white silkscreen legends for identification.

UGPCB‘s 2-Layer Rigid PCB

Présentation du produit & Classification

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a PCB rigide (by construction), un 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (Classe CIB 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

Conception & Operational Principle

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (par ex., 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: le FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, le masque de soudure is a protective coating, et le écran à soigneux provides navigation.

Construction, Matériels & Performance

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

  • Cœur: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.

  • Cuivre: Standard 1oz (35µm) electrodeposited copper foil.

  • Finitions: Black LPI solder mask and white epoxy silkscreen.

  • Finition de surface: Lead-Free HASL for excellent solderability.

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

Processus de fabrication & Contrôle de qualité

Our production follows Normes IPC, encompassing CAM engineering, precision drilling, électroplaste, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and Inspection optique automatisée (Zone d'intérêt) to meet stringent quality criteria.

Applications

This versatile PCB is ideal for:

  • Industrial Control Systems: PLCs, entraînements à moteur, sensor interfaces.

  • Électronique de puissance: Switch-mode power supplies (SMPS), UPS boards, LED drivers.

  • Automobile & Electronique grand public: Auxiliary control modules, amplificateurs audio, appliance controllers.

LED driver power supply is one of the primary application scenarios for 2-layer PCBs.

Key Specifications Table

Paramètre Spécification
Calques 2
Épaisseur du panneau 1.60 mm (Standard)
Matériau de base FR-4, Tg ≥ 150°C
Poids du cuivre 1 once (35 µm) Standard
Masque de soudure Noir, LPI
Écran à soigneux Blanc
Finition de surface HASL sans plomb
Min.. Trace/Espacement ≥ 0.15 mm (6 mil)
Standard Compliance IPC-A-600, Classe CIB 2

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