TG150 PCB | High-Tg 4-Layer Immersion Gold Circuit Board | 0.08mm Fine Line Specialist

TG150 PCB Circuit Board Introduction: Meeting the Thermal Challenge in Modern Electronics

In high-speed communications, automobile, aérospatial, and advanced industrial controls, electronic devices face increasingly harsh operating environments. Elevated temperatures can cause standard PCB substrates (par ex., standard FR-4) to reach their glass transition, leading to softening, deformation, and critical performance loss, jeopardizing system reliability. Selecting a haute Tg circuit imprimé is essential for ensuring long-term stability in these demanding applications.

1. Présentation du produit: What is a TG150 PCB?

UN TG150 PCB is a circuit imprimé fabricated using a laminate material with a glass transition temperature (Tg) of 150°C. The Tg is a crucial metric for a PCB substrate’s thermal endurance. Compared to common TG130 PCB laminates, TG150 material maintains superior physical rigidity and stable electrical properties under high temperatures. UGPCB 4-layer TG150 circuit board combines this high-performance material with an Immersion Or (ACCEPTER) finition de surface and supports 0.08mm fine-line circuitry et 0.2mm micro-drilling, making it a high-reliability carte PCB multicouche solution for advanced applications.

2. Core Material and Enhanced Performance of TG150 PCB

• Matériau de base: A high-performance epoxy or modified FR-4 formulation, specially engineered to consistently achieve a Tg of 150°C or higher.

• Key Performance Advantages (contre. TG130 PCBs):

  • Exceptional Thermal Stability: The increase from 130°C to 150°C Tg significantly enhances the board’s resistance to deformation at high temperatures, improving its ability to withstand high-temperature assembly processes like lead-free soldering.

  • Superior Moisture and Chemical Resistance: A denser molecular structure reduces moisture absorption in humid environments, minimizing losses in insulation resistance (IR) et l'intégrité du signal, while offering better resistance to chemical exposure.

  • Improved Mechanical Strength and Dimensional Stability: High Tg PCBs exhibit lower Z-axis expansion coefficients and stronger bond strength during thermal cycling, reducing risks like via cracking and delamination.

  • Stable Electrical Characteristics: Constante diélectrique (Ne sait pas) et facteur de dissipation (Df) remain more stable at elevated operating temperatures, ensuring higher signal integrity for PCB haute fréquence.

3. Structure and Design Specifications of Our TG150 PCB

PCB Stack-up

This product is a standard 4-couche Carte PCB. A typical stack-up is Signal Layer – Ground Plane – Power Plane – Signal Layer, providing a complete return path for high-speed signals and effective EMI control.

Key Design Capabilities & Specifications

Minimum Trace Width/Space: 0.08mm / 0.1mm. This represents advanced fine-line Fabrication de PCB capability, essential for routing high-density ICs (par ex., BGA packages).

Drill Diameter: 0.2mm. Soutien micro-via drilling, facilitating higher density interconnects and saving board space.

Finition de surface: Immersion Or (ACCEPTER). Provides a flat surface, excellent solderability, and long shelf life, idéal pour les composants à pas fin (par ex., CFP, BGA).

4. Manufacturing Process and Quality Control

UGPCB TG150 PCB manufacturing process strictly adheres to international standards like IPC-6012 (Qualification and Performance Specification for Rigid PCBs). The process includes:
Material Preparation → Inner Layer Imaging → Etching → Lamination → Drilling (0.2mm) → Desmear & Plating → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing → Electrical Testing → Final Inspection.
At each stage, we employ advanced equipment (par ex., LDI imaging, Inspection de la zone d'intérêt) and rigorous reliability testing (par ex., contrainte thermique, ionic contamination) to ensure the quality of every high-Tg circuit board.

5. Product Classification and Typical Applications

1. Technical Classification:

   • By Tg: Mid-High Tg PCB (Tg ≥ 150°C).

   • Par nombre de couches: PCB multicouche (4-Layer Board).

   • By Technology: Precision PCB (IDH-ready capability).

   • By Finish: ENIG PCB, Fine-Line PCB.

2. Ideal Application Scenarios:

   • Électronique automobile: Unités de commande du moteur (COUVERTURE), systèmes d'infodivertissement, power management modules – requiring tolerance under-hood temperatures.

   • Telecommunications Equipment: 5G base station PAs, optical modules, network switches – where high power generates sustained heat.

   • Commandes industrielles: Servomade, PLCs, industrial PCs – for reliable operation in hot factory environments.

   • Électronique de puissance: High-power switch-mode power supplies (SMPS), inverters – where power components generate significant heat.

   • Aérospatial & Défense: Electronic systems with extreme demands for reliability and environmental resilience.

6. Why Choose UGPCB for Your TG150 PCBs?

• Matériaux certifiés: We use verified, traceable TG150 PCB laminates from reputable suppliers.

• Precision Manufacturing: Our expertise in multilayer PCB fabrication et ENIG processing ensures high yield for 0.08mm fine-line designs.

• Guaranteed Specifications: All technical parameters (Tg 150°C, 0.2mm drills) are rigorously validated against datasheets.

• Support de bout en bout: We provide full technical support from Conception de circuits imprimés revoir et contrôle d'impédance to rapid prototyping and volume production.

7. Passez à l'action: Secure Your Design with a Robust Foundation

Don’t let thermal limitations hinder your product innovation. Choosing UGPCB’s high-reliability TG150 PCB means investing in exceptional stability, durabilité, et les performances.

Appel à l'action

*(Image Suggestion: High-quality close-up photo of a populated TG150 PCB used in a telecom orautomotive application.)*
Alt Tag: High-density assembled 4-layer TG150 PCB with ENIG finish for automotive or telecom applications

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