Standard PCB Manufacturing Capabilities

Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

Imaging diretto laser (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
Expertise in handling various copper thicknesses (1Oz-6oz) with minimized side-etching

High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
Perforazione laser down to 0.1mm microvias
Hole metallization achieving >20μm uniform copper plating through advanced chemical deposition and electroplating
Special processes for 8:1 A 10:1 aspect ratio requirements

Multilayer Lamination & Interlayer Alignment

Up to 100-layer PCB fabrication using FR-4 Grade A materials
Precision lamination with ±0.05mm layer-to-layer alignment
Temperature/pressure/time-controlled processes preventing delamination
Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

Maschera di saldatura & Surface Finish Options

Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
Surface finishes:
1. Sanguinare (Hot Air Solder Leveling)
2. Essere d'accordo (Electroless Nickel Immersion Gold)
3. Immersion Tin/Silver
4. OSP (Organic Solderability Preservative)

PCBs with Multiple Solder Mask Color Options

Comprehensive QC & Testing Systems

Ispezione AOI: High-resolution defect detection for line/space, pad, shorts/opens
Controllo dell'impedenza: ±10% tolerance for high-speed/RF applications
Test elettrici: Sonda volante & fixture-based continuity verification
Reliability Testing: Shock termico, humidity resistance, flexural testing

Process Capability & Stabilità

Cpk >1.33 (4σ) across critical processes, reaching 1.67 (5σ) in key areas
Line width control within ±15% (vs industry 20% standard)
Statistical process control (Spc) ensuring consistent production quality

PCBA One-Stop Services

SMT Assembly: 01005 component handling with ±0.03mm placement accuracy
Imballaggio avanzato: BGA/Micro BGA/PoP support with X-ray inspection
DFM Support: Impedance calculation, stack-up design, manufacturability analysis

Applicazioni del settore & Contatto

Serving consumer electronics, industrial controls, telecommunications, dispositivi medici, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.