UGPCB

2-PCB a strati FR-4 | 1.6mm di spessore, HASL senza piombo | Prototipo & Production – UGPCB

High-Performance FR-4 Double-Sided PCB Panoramica del prodotto & Definizione

Questo 2-Layer Rigid Circuito stampato (PCB) from UGPCB is a fundamental and widely used electronic interconnect solution. It features a standard 1.6mm board thickness, dimensions of 224.02mm x 189mm, and utilizes high-grade KB FR-4 laminate. This double-sided PCB serves as the essential “backbone” for electronic designs, providing reliable electrical connections and mechanical support for components. It is an ideal, cost-effective choice for a vast range of industrial control, elettronica di consumo, and power supply applications.

2-Layer Rigid Printed Circuit Board

Considerazioni critiche sulla progettazione

Successful design of a double-sided PCB requires balancing electrical performance with manufacturability. Le considerazioni chiave includono:

Principio di lavoro & Struttura

The functionality of this double-layer circuit board stems from its layered structure:

  1. Costruzione: The core consists of an FR-4 insulating dielectric layer, clad with copper foil (in genere 1 oz) on both sides. The unwanted copper is etched away during Fabbricazione di PCB, forming the desired circuit traces.

  2. Electrical Interconnection: Circuits on the two layers are connected vertically via Plated Through-Holes (PTHS), created through mechanical drilling followed by electroless and electrolytic copper deposition.

  3. Surface Protection: IL Livellamento per saldatura ad aria calda senza piombo (Sanguinare) finish applied to exposed copper pads prevents oxidation and ensures excellent solderability for component assembly.

Product Classification & Materiali

Per the provided specifications, this product is accurately classified as follows:

Prestazione & Caratteristiche chiave

Leveraging the specified materials and processes, this PCB delivers the following core performance benefits:

Detailed Manufacturing Process

UGPCB adheres to a stringent, high-standard PCB manufacturing process:

  1. Engineering & CAM: Gerber file analysis, DFM check, and photoplot generation.

  2. Panelization: Cutting the large FR-4 laminato rivestito di rame into production panels.

  3. Perforazione: CNC drilling of component holes and PCB vias.

  4. Hole Metallization: Desmear, chemical copper deposition, and electrolytic copper plating to form conductive Plated Through-Holes (PTHS).

  5. Modellazione: Applying photoresist, esposizione, development to transfer the circuit image.

  6. Incisione: Removing unwanted copper to form precise circuit traces.

  7. Maschera di saldatura & Silkscreen: Applying LPI solder mask (typically green) and legend printing.

  8. Finitura superficiale: Applying HASL senza piombo coating to exposed pads.

  9. Routing & Test elettrici: Profiling to final board outline and performing Electrical Test (Sonda volante or Fixture Test).

  10. Ispezione finale & Confezione: Comprehensive Ispezione ottica automatizzata (AOI), dimensional verification, and vacuum-sealed, moisture-proof packaging.

Applicazioni primarie & Casi d'uso

This specification of double-sided FR-4 PCB is widely deployed in reliable and cost-sensitive applicazioni:

Why Choose UGPCB for Your Double-Sided PCB Needs?

Partnering with UGPCB guarantees:

Ready to start your project? Contact UGPCB today for a competitive quote and expert support. Let us be your trusted Produttore di PCB and partner for success.

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