Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview
The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.
Definizione
A High-Density Interconnect (ISU) module refers to a circuito stampato (PCB) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.
Requisiti di progettazione
The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:
- Strati: Four layers with a specific stack-up of 1+N+1.
- Materiale: Made from high-quality Materiale FR-4.
- Spessore: The overall finished thickness of the module is 1.0mm.
- Spessore del rame: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
- Trattamento superficiale: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
- Min Trace/Space: Supports minimal trace and space widths of 4mil.
- Foro minimo: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.
Principio di lavoro
The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.
Applicazioni
This versatile module is suitable for a wide range of applications including but not limited to:
- Attrezzatura industriale: Automation systems, control panels.
- Communication Devices: Router, access points, set-top boxes.
Classificazione
The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.
Composizione materiale
Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.
Caratteristiche delle prestazioni
- Integrità del segnale: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
- Gestione termica: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
- Durata: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.
Caratteristiche strutturali
- Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
- Scalandati di livello: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.
Processo di produzione
The manufacturing process involves several key steps:
- Preparazione del materiale: Cutting and preparing the FR-4 substrate.
- Copper Lamination: Applying copper layers on both sides and inner layers as per design.
- Incisione: Removing excess copper to form the desired circuit patterns.
- Allineamento dei livelli: Stacking and aligning the layers accurately.
- Bonding: Using heat and pressure to bond the layers together.
- Trattamento superficiale: Applying immersion gold and OSP finishes.
- Controllo di qualità: Conducting thorough inspections and tests to ensure product quality
Usa scenari di case
Elettronica di consumo
In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.
Attrezzatura industriale
For automation systems, the module provides dependable communication links in harsh industrial environments.
Communication Devices
In routers and access points, the module enhances network performance with its superior signal handling capabilities.
By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.