標準のPCB製造機能

Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

• レーザー直接イメージング (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
• Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
• Expertise in handling various copper thicknesses (1oz-6oz) with minimized side-etching

High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

• Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
• レーザー掘削 down to 0.1mm microvias
• Hole metallization 達成 >20μm uniform copper plating through advanced chemical deposition and electroplating
• Special processes for 8:1 に 10:1 aspect ratio requirements

Multilayer Lamination & Interlayer Alignment

• Up to 100-layer PCB fabrication using FR-4 Grade A materials
• Precision lamination with ±0.05mm layer-to-layer alignment
• Temperature/pressure/time-controlled processes preventing delamination
• Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

はんだマスク & Surface Finish Options

• Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
• Surface finishes:
  1. 出血 (熱気はんだレベリング)
  2. 同意する (エレクトロレスニッケルイマージョンゴールド)
  3. Immersion Tin/Silver
  4. OSP (有機はんだ付け性防腐剤)

Comprehensive QC & Testing Systems

• AOI検査: High-resolution defect detection for line/space, パッド, shorts/opens
• インピーダンス制御: ±10% tolerance for high-speed/RF applications
• 電気テスト: 飛行プローブ & fixture-based continuity verification
• Reliability Testing: サーマルショック, humidity resistance, flexural testing

Process Capability & 安定性

• CPK >1.33 (4a) across critical processes, 到達 1.67 (5a) in key areas
• Line width control within ±15% (vs industry 20% 標準)
• Statistical process control (SPC) ensuring consistent production quality

PCBA One-Stop Services

• SMTアセンブリ: 01005 component handling with ±0.03mm placement accuracy
• 高度なパッケージ: BGA/Micro BGA/PoP support with X-ray inspection
• DFM Support: Impedance calculation, stack-up design, manufacturability analysis

業界アプリケーション & 接触

Serving consumer electronics, 産業用制御, 通信, 医療機器, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.