Precision Circuit Imaging & Etching Technology
UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:
- レーザー直接イメージング (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
- Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
- Expertise in handling various copper thicknesses (1oz-6oz) with minimized side-etching
High-Precision Drilling & Hole Metallization
Our drilling capabilities cover:
- Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
- レーザー掘削 down to 0.1mm microvias
- Hole metallization 達成 >20μm uniform copper plating through advanced chemical deposition and electroplating
- Special processes for 8:1 に 10:1 aspect ratio requirements
Multilayer Lamination & Interlayer Alignment
- Up to 100-layer PCB fabrication using FR-4 Grade A materials
- Precision lamination with ±0.05mm layer-to-layer alignment
- Temperature/pressure/time-controlled processes preventing delamination
- Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm
はんだマスク & Surface Finish Options
- Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
- 表面仕上げ:
- 出血 (熱気はんだレベリング)
- 同意する (エレクトロレスニッケルイマージョンゴールド)
- Immersion Tin/Silver
- OSP (有機はんだ付け性防腐剤)
Comprehensive QC & Testing Systems
- AOI検査: High-resolution defect detection for line/space, パッド, shorts/opens
- インピーダンス制御: ±10% tolerance for high-speed/RF applications
- 電気テスト: 飛行プローブ & fixture-based continuity verification
- Reliability Testing: サーマルショック, humidity resistance, flexural testing
Process Capability & 安定性
- CPK >1.33 (4a) across critical processes, 到達 1.67 (5a) in key areas
- Line width control within ±15% (vs industry 20% 標準)
- Statistical process control (SPC) ensuring consistent production quality
PCBA One-Stop Services
- SMTアセンブリ: 01005 component handling with ±0.03mm placement accuracy
- 高度なパッケージ: BGA/Micro BGA/PoP support with X-ray inspection
- DFM Support: Impedance calculation, stack-up design, manufacturability analysis
業界アプリケーション & 接触
Serving consumer electronics, 産業用制御, 通信, 医療機器, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.