12-レイヤー高速高信頼性PCB | 2.4厚さ mm | ナンヤ NY6300S | バックドリリング & RTFフォイル

Professional Product Overview: The 12-Layer High-Speed, 高密度PCB

In the era of high-speed data transmission and complex system integration, conventional printed circuit boards (プリント基板) fall short of meeting the performance demands of advanced electronics. The 12-layer high-speed, 高密度PCB is the engineered solution. Featuring up to 12 precisely aligned conductive layers, it enables intricate interconnections and efficient signal transmission within a compact footprint, serving as the “central nervous system” for high-end networking gear, data center servers, ハイパフォーマンスコンピューティング (HPC), and AI hardware.

As an expert PCBメーカー そして PCBサプライヤー, UGPCB leverages advanced processes to deliver reliable 12-層 PCBボード 生産, ensuring your products maintain a competitive performance edge.

In-Depth Parameter Analysis: The Foundation of Performance

The capability of a high-quality 多層プリント回路基板 is defined by its specifications. Below is an analysis of this product’s core parameters:

• レイヤー数 & Stack-up: 12 レイヤー. これ multilayer PCB design offers superior signal integrity (そして), パワーの完全性 (PI), and EMC performance compared to boards with fewer layers. It allows for dedicated power and ground planes, providing clear return paths for high-speed signals.

• 板厚 & 許容範囲: 2.4mm ±10%. This robust thickness offers excellent mechanical strength for backplanes and large-form-factor applications, ensuring reliability during mating and installation. The tight tolerance guarantees consistency in assembly.

• Finished Copper Weight: Unique distribution: 1/1/1/1/1/2/2/1/1/1/1/1 oz. This indicates that the inner layers (L6 & L7) utilize 2oz heavy copper, designed specifically for high-current power delivery. The outer and other signal layers use 1oz copper, optimized for fine-line etching. This hybrid construction is a hallmark of 高信頼性 PCB製造.

• Critical Process Capabilities:

  • Minimum Drilled Hole Size: 0.2mm. Supports high-density BGA fan-out, enhancing routing flexibility.

  • Minimum Line Width/Space: 0.076mm / 0.09mm (3ミル / 3.5ミル). 達成 高密度相互接続 (HDI)-level routing, essential for high-speed signal propagation.

• 表面仕上げ: OSP (有機はんだ付け性防腐剤). Compatible with both leaded and lead-free soldering, it protects copper pads from oxidation, offers excellent surface planarity, and is cost-effective—ideal for boards with dense SMT コンポーネント.

コア材料 & Key Technologies: Enabling Superior Signal Integrity

1. High-Performance Laminate: Utilizes ナンヤ NY6300S high-speed laminate. Its high glass transition temperature (TG >150℃) ensures dimensional stability and reliability during high-temperature reflow soldering. Its optimized dielectric constant (DK) and dissipation factor (Df) significantly reduce signal loss at high frequencies, forming the material foundation for 高周波プリント基板.

2. Advanced Copper Foil: Employs RTF (Reverse Treated Foil) 銅. Compared to standard electrodeposited (編) foil, RTF foil features a smoother, low-profile surface on the treated side. This reduces signal loss due to the “表皮効果” at high frequencies, critically enhancing the performance of differential signals exceeding 10 Gbps.

3. Critical Process: Controlled-Depth Drilling (バックドリリング): In 12-layer or higher 多層PCB, the unused portion (stub) of a through-hole via can cause significant signal reflection, degrading integrity. The back drilling process precisely removes this non-functional via stub, eliminating its negative impact—a key technology for high-speed multilayer PCB パフォーマンス.

生産フロー & 品質保証

UGPCB 12-層PCBの製造プロセス strictly adheres to IPC標準 and includes 製造可能性のための設計 (DFM) レビュー, inner layer imaging, ラミネーション, 掘削 (including back drilling), メッキ, outer layer imaging, solder mask application, 表面仕上げ (OSP), ルーティング, electrical testing, そして最終検査. Each stage is supported by precision measurement equipment (あおい, Impedance Testing, フライングプローブテスト), ensuring every 回路基板 delivered meets design specifications and our high-quality standards.

典型的なアプリケーション & Product Classification

This high-performance PCBボード is designed for demanding electrical environments and complex systems, primarily used in:

• High-End Network & 通信機器: Core motherboards for 400G/800G optical modules, high-end routers, and switches.

• Data Center & クラウドコンピューティング: Server motherboards, accelerator cards, storage backplanes.

• 高性能コンピューティング: Workstation motherboards, GPU computing cards, AI accelerator hardware.

• Advanced Test & Measurement Instruments: Internal boards for instruments processing very high-frequency signals.

Scientific Product Classification:

• レイヤーカウントごとに: 多層プリント基板 (>8 レイヤー)

• By Technology Type: High-Speed/High-Frequency PCB, HDI PCB, 重い銅の PCB (partial)

• アプリケーションによって: Telecom Infrastructure PCB, Data Center/Server PCB

Why Choose UGPCB for Your 12-Layer High-Speed PCB?

• 技術的な専門知識: Proven mastery of back drilling そして RTF copper foil application to tackle high-speed design challenges.

• 精密製造: Capable of 3/3.5 mil line/space, meeting stringent high-density interconnect requirements.

• Material Integrity: Core use of reputable high-speed laminates like Nanya NY6300S ensures foundational performance.

• デザインサポート: Expert プリント基板設計 そして DFM review services to de-risk your project from the start.

• Consistent Quality: A fully controlled プリント基板の製造 and inspection system delivers reliable products you can trust.

Ready to elevate your hardware? Contact UGPCB’s engineers for a free PCB quote そして DFM分析 on your next 12-layer high-speed board project.