UGPCB

12-Layer ENIG PCB | High-Reliability FR-4 TU872SLK Multilayer Circuit Board

ultimin

プロフェッショナル製品の概要

The UGPCB 12-Layer Rigid PCB is a high-end 多層回路基板 engineered for complex signal transmission, 高密度相互接続 (HDI), and demanding operating environments. Manufactured with high-performance FR-4 TU872SLK laminate and finished with 2-microinch Immersion Gold (同意する), this board is a cornerstone solution for industrial control systems, 通信インフラ, and advanced computing hardware, offering exceptional electrical performance, long-term reliability, and robust signal integrity.

12-Layer ENIG PCB

Product Definition & 分類

This product is classified as a High-Layer Count Rigid Printed Circuit Board. It can be further categorized as:

設計上の重要な考慮事項

Designing a 12-layer PCB requires meticulous attention to:

  1. スタックアップデザイン: A rational stack-up sequence (例えば。, alternating signal-ground-signal layers) is paramount for impedance control, crosstalk reduction, and Electromagnetic Compatibility (EMC). A proper 12-layer stack-up provides excellent power integrity and signal shielding.

  2. インピーダンス制御: For high-speed digital signals (例えば。, DDR, PCIE) or RF lines, precise calculation and control of trace characteristic impedance (例えば。, 50Ω シングルエンド, 90Ω/100Ω差動) are essential. We utilize advanced EDA tools and precise process controls to ensure consistency.

  3. 力 & Ground Plane Management: Solid ground planes and optimized power segmentation ensure low-noise power delivery and clear return paths, which are critical for system stability.

  4. 熱管理: The 1.6mm board thickness and the thermal properties of FR-4 must align with component power dissipation. High-power areas may require thermal vias or integration with external cooling solutions.

それがどのように機能するか

A PCB is a passive platform that provides mechanical support, electrical interconnection, and signal transmission pathways for electronic components. This 12-layer PCB facilitates a complete working system by connecting chips, 抵抗器, コンデンサ, 等, through a complex network of etched copper traces. The multilayer architecture allows traces to cross on different layers without interference, significantly increasing circuit complexity and integration density. The ENIG surface finish guarantees reliable solder joints and long-term contact stability.

*(Image Suggestion: Detailed cross-sectional diagram of a 12-layer PCB stack-up)*
*代替テキスト: Cross-sectional view of a 12-layer PCB stack-up showing alternating copper layers and dielectric, illustrating complex internal structure for high-density interconnect.*

工事 & 材料

主な特長 & パフォーマンス

  1. 高い信頼性: TU872SLK high-Tg material and ENIG finish ensure resistance to high temperatures, 腐食, and suitability for long-term operation in harsh environments.

  2. 優れた信号の完全性: Rigorous stack-up design and impedance control guarantee high-speed signal quality and lower bit error rates.

  3. Strong Load-Bearing & Thermal Capacity: The 1.6mm thickness offers robust mechanical strength and substantial thermal load management.

  4. Precision Solder Platform: The flat 2μ” ENIG surface is ideal for fine-pitch コンポーネント (例えば。, BGAS), resulting in strong, reliable solder joints with low defect rates.

  5. 高密度相互接続 (HDI): Twelve routing layers support complex, dense circuit designs, enabling reduced product footprint.

Manufacturing Process Flow

Inner Layer Imaging → AOI Inspection → Lamination & Pressing → Drilling → Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing & Profiling → Electrical Testing → Final Quality Control (FQC)

アプリケーション & ユースケース

This PCB is widely used in stability and performance-critical fields:

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