Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs
In the booming landscape of high-performance computing, 人工知能, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing そして IC基板 ソリューション, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (例えば。, DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.
製品の概要 & 意味
あ 4-Layer DDR Substrate Board is a High-Density Interconnect (HDI) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) チップ. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard PCB boards, DDR substrates demand near-perfect signal integrity, 熱管理, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.
設計上の重要な考慮事項
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Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.
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パワーの完全性 (PI): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.
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信号の完全性 (そして): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-PCBAアセンブリ.
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熱管理: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.
それがどのように機能するか
The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. Its “sandwich” stack-up (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (エミ). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (例えば。, in BGA packages).
主要なアプリケーション & 分類
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主要なアプリケーション: Extensively used in servers, data center switches, high-end GPUs, AI アクセラレータ カード, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.
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分類:
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レイヤーカウントごとに: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.
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素材によって: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.
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材料 & 性能仕様
| パラメーター | 仕様 | Performance Advantage |
|---|---|---|
| コア素材 | 三菱ガス化学物質HL832 | Industry-recognized, 高性能, low-loss (Low Df) laminate designed for high-speed digital circuits, significantly reducing signal transmission loss. |
| レイヤー数 | 4 レイヤー | Optimal “Signal-Ground-Power-Signal” stack-up, balancing design complexity, 料金, とパフォーマンス. |
| 仕上がり厚さ | 0.25mm | Ultra-thin profile, conforming to compact chip packaging trends for integration into miniaturized devices. |
| 銅の厚さ | 0.5オンス (17.5μm) | Standard starting weight, suitable for fine-line etching; can be plated up for higher current needs. |
| はんだマスク色 | 緑 (AS308) | Provides excellent insulation protection and visual contrast for Optical Inspection (あおい) 後 PCBアセンブリ. |
| 表面仕上げ | ソフトゴールド (同意する) | Excellent surface planarity and low hardness, ensures superior compatibility with wire bonding or BGA solder balls for reliable connections. |
| 最小ドリル穴サイズ | 100μm | Supports high-density micro-via design for complex chip pinout interconnection. |
| 分. 線の幅/スペース | 50μm / 75μm | High-precision routing capability allows more high-speed lines in limited space, ミーティング high-density interconnect PCB design needs. |
Product Structure & 主な特長
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構造: Typical 4-layer sequential lamination: 最上層 (Signal/Components) -> Inner Layer 1 (Solid Ground Plane) -> Inner Layer 2 (Solid Power Plane) -> 下層 (Signal/Components). This structure offers optimal shielding for high-speed signals.
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主な特長:
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Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.
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High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.
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高い信頼性: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.
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Ultra-Thin & 正確な: 0.25mm overall thickness meets stringent space requirements in modern electronics.
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私たちの プリント基板の製造 process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (同意する) → Solder Mask Application → Profiling → Electrical Test & 最終検査.
Each stage is supported by advanced inspection equipment (例えば。, あおい, フライングプローブテスト), すべてを保証する IC基板 delivered is flawless.
典型的なユースケース
This 4-Layer DDR Substrate is the ideal choice for:
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データセンター & サーバー: Carrying CPU and memory modules for massive data processing.
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ai & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.
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High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.
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フラッグシップコンシューマーエレクトロニクス: Main memory substrates in top-tier gaming consoles and laptops.
Why Choose UGPCB’s 4-Layer DDR Substrate?
私たちは以上のものです PCBメーカー; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.
Contact our expert team today for a project-specific quote and technical consultation. Power up your high-speed design with UGPCB!