4-層DDR基板メーカー | 高速HL832素材

Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs

In the booming landscape of high-performance computing, 人工知能, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing そして IC基板 ソリューション, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (例えば。, DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.

製品の概要 & 意味

あ 4-Layer DDR Substrate Board is a High-Density Interconnect (HDI) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) チップ. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard PCB boards, DDR substrates demand near-perfect signal integrity, 熱管理, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.

UGPCB's 4-Layer DDR Substrate Board

設計上の重要な考慮事項

Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.
パワーの完全性 (PI): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.
1. 信号の完全性 (そして): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-PCBAアセンブリ.
熱管理: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.

それがどのように機能するか

The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. その “sandwich” 積み上げ (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (エミ). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (例えば。, in BGA packages).

主要なアプリケーション & 分類

主要なアプリケーション: Extensively used in servers, data center switches, high-end GPUs, AI アクセラレータカード, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.
分類:
- レイヤーカウントごとに: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.
- 素材によって: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.

材料 & 性能仕様

パラメーター	仕様	Performance Advantage
コア素材	三菱ガス化学物質HL832	Industry-recognized, 高性能, low-loss (Low Df) laminate designed for high-speed digital circuits, significantly reducing signal transmission loss.
レイヤー数	4 レイヤー	最適 “Signal-Ground-Power-Signal” 積み上げ, balancing design complexity, 料金, とパフォーマンス.
仕上がり厚さ	0.25mm	Ultra-thin profile, conforming to compact chip packaging trends for integration into miniaturized devices.
銅の厚さ	0.5オンス (17.5μm)	Standard starting weight, suitable for fine-line etching; can be plated up for higher current needs.
はんだマスク色	緑 (AS308)	Provides excellent insulation protection and visual contrast for Optical Inspection (あおい) 後 PCBアセンブリ.
表面仕上げ	ソフトゴールド (同意する)	Excellent surface planarity and low hardness, ensures superior compatibility with wire bonding or BGA solder balls for reliable connections.
最小ドリル穴サイズ	100μm	Supports high-density micro-via design for complex chip pinout interconnection.
分. 線の幅/スペース	50μm / 75μm	High-precision routing capability allows more high-speed lines in limited space, ミーティング high-density interconnect PCB design needs.

Product Structure & 主な特長

構造: Typical 4-layer sequential lamination: 最上層 (Signal/Components) -> Inner Layer 1 (Solid Ground Plane) -> Inner Layer 2 (Solid Power Plane) -> 下層 (Signal/Components). This structure offers optimal shielding for high-speed signals.
主な特長:
- Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.
- High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.
- 高い信頼性: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.
- Ultra-Thin & 正確な: 0.25mm overall thickness meets stringent space requirements in modern electronics.

Precision Manufacturing Process

私たちの プリント基板の製造 process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (同意する) → Solder Mask Application → Profiling → Electrical Test & 最終検査.
Each stage is supported by advanced inspection equipment (例えば。, あおい, フライングプローブテスト), すべてを保証する IC基板 delivered is flawless.

典型的なユースケース

This 4-Layer DDR Substrate is the ideal choice for:

データセンター & サーバー: Carrying CPU and memory modules for massive data processing.
ai & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.
High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.
フラッグシップコンシューマーエレクトロニクス: Main memory substrates in top-tier gaming consoles and laptops.

DDR Substrate in AI Accelerator Card with Memory

Why Choose UGPCB’s 4-Layer DDR Substrate?

私たちは以上のものです PCBメーカー; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.