RO4350B セラミックハイブリッド高周波基板メーカー | 8-層, 2.5mm, 同意する

Engineered for High-Frequency Communications: The RO4350B Ceramic Hybrid PCB Solution

In the world of high-frequency communications where signal speed and integrity are paramount, 標準 プリント基板材料 fall short. UGPCB introduces its high-performance 高周波プリント基板 solution based on Rogers RO4350B ceramic hybrid material. Designed for critical applications like communication instruments, レーダーシステム, and satellite receivers, これ RF PCB delivers reliable and stable performance.

1. 製品の概要 & 意味

この製品は、 8-layer high-frequency PCB manufactured using a “Rogers RO4350B Laminates and FR4 Hybrid Lamination” プロセス. This innovative Hybrid Construction PCB strategically combines high-performance ceramic-filled PTFE material (RO4350B) with cost-effective FR4. The RO4350B material is used in critical signal layers to ensure exceptional high-frequency performance, while FR4 is used in inner power and ground layers for optimal cost-efficiency. This Mixed Dielectric プリント基板設計 represents an intelligent choice for balancing performance and budget.

2. 設計上の重要な考慮事項

1. 正確なインピーダンス制御: The RO4350B material offers a stable and low 誘電率 (Dk=3.48). Combined with precision manufacturing processes, it enables highly accurate impedance control (typically ±5% or better), ensuring signal integrity for high-speed transmission.

2. Hybrid Stack-up Design: The design must clearly separate high-frequency signal layers (using RO4350B dielectric) from power/ground planes (which may use FR4). Rational stack-up planning is key to leveraging the benefits of hybrid material PCBs and controlling costs.

3. Low-Loss Design: The inherently low dissipation factor (Df) of RO4350B is foundational. Designers should also employ appropriate trace width, copper weight, and smooth copper foil surfaces (like reversed foil) to further minimize insertion loss.

4. 熱管理: Although the 熱伝導率 (0.69W/m.K) of RO4350B is superior to most standard FR4, high-power applications still require careful thermal management through proper layout, thermal vias, and potential additional heat sinking.

3. それがどのように機能するか & 主な特長

作業原則

高周波数で (typically above 500MHz), skin effect is significant, and signal integrity is highly susceptible to the dielectric properties of the substrate. The RO4350B ceramic hybrid High Frequency Circuit Board minimizes signal energy loss (挿入損失) and phase distortion during transmission through its stable dielectric constant and very low loss tangent, ensuring low-noise, high-fidelity signal transmission.

主な特長 & パフォーマンス

• Superior High-Frequency Stability: Stable Dk value across frequency and temperature variations ensures consistent and reliable circuit performance.

• Exceptionally Low Signal Loss: Optimized for high-frequency applications, it significantly reduces signal attenuation, improving system SNR and transmission range.

• Excellent Mechanical & 熱信頼性: Glass-reinforced for high rigidity; resistant to high temperatures with a CTE matched to copper, enhancing long-term reliability.

• Effective Heat Dissipation: A thermal conductivity of 0.69W/m.K aids in dissipating heat from high-power components, ensuring system stability.

• Compliance with Safety Standards: The laminate meets the stringent UL 94V-0 可燃性評価.

• 信頼性の高い表面仕上げ: イマージョンゴールド (同意する) treatment provides a flat soldering surface, 優れた耐酸化性, and good contact conductivity, suitable for high-frequency signal connections and fine-pitch component soldering.

4. 材料 & 構造

• 主な材料: ロジャース RO4350B (ceramic-filled PTFE composite) and FR-4 epoxy glass laminate.

• Conductive Layers: 1オズ (35μm) Electrolytic Copper Foil.

• 表面仕上げ: エレクトロレスニッケルイマージョンゴールド (同意する).

• 仕上がり板厚: 2.5mm (±10％).

• 誘電体の厚さ: 0.338mm (典型的な, varies based on specific lamination structure).

• Board Structure: 8-layer board. A typical stack-up involves a symmetrical or asymmetrical combination like [FR4-PP-RO4350B Core-RO4350B Core-PP-FR4], determined by electrical design requirements.

5. 科学的分類

1. 材料の種類別: Ceramic-Filled PTFE Hybrid Dielectric High-Frequency PCB / Composite Dielectric Substrate PCB.

2. By Application Frequency: RF Microwave PCB / High-Frequency High-Speed PCB.

3. 構造によって & プロセス: Multilayer Hybrid Laminate PCB / 8-Layer Precision Controlled Impedance Board.

6. Key Control Points in Production Flow

UGPCB possesses mature manufacturing processes for High Frequency Printed Circuit Boards. Critical control points include:

1. 精密ラミネート: Strict control of lamination parameters (プレッシャー, 温度, 時間) for RO4350B and FR4 to prevent delamination/voids and maintain consistent dielectric thickness.

2. Fine-Line Etching: Utilization of high-precision imaging transfer technology to ensure trace edge smoothness and dimensional accuracy.

3. Stringent Impedance Control: End-to-end monitoring from design simulation to production, using advanced testing equipment (例えば。, TDR) のために 100% sampling or full inspection.

4. Low-Loss Surface Treatment: Optimized ENIG process to ensure uniform plating, controlled thickness, and avoidance of issues like “黒ニッケル” that degrade high-frequency performance.

7. 主要なアプリケーション & ユースケース

This product is designed for fields with stringent requirements for signal frequency and integrity, serving as a core component in High-Frequency Communication Equipment.

• Communication Base Stations: 5G/4G Base Station RF power amplifiers, アンテナ, フィルター, デュプレクサ.

• 衛星通信 & レーダーシステム: 衛星受信機, radar transceiver modules, ナビゲーションシステム.

• テスト & 測定器: ネットワークアナライザ, スペクトラムアナライザ, high-frequency signal sources.

• カーエレクトロニクス: 77GHzミリ波レーダー, 高度なドライバー支援システム (アダス).

• 無線インフラストラクチャ: Point-to-point microwave links, wireless access equipment.

Get Your High-Frequency PCB Solution Now

Your next-generation high-performance communication instrument deserves a more reliable core. UGPCB’s RO4350B Ceramic Hybrid 高周波ボード is ready to power your lead in the signal age.

Click to contact our High-Frequency PCB experts for a free design consultation and an instant quote!
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