UGPCBのロゴ
Double-Sided Power PCBs: 信頼性のある, High-Current Boards for Demanding Applications
In an era of high-power electronics, stable and efficient power management is critical. あ プリント基板 (プリント基板) optimized for power transmission and conversion is often the cornerstone of system reliability. Our double-sided power PCBs are engineered to meet the stringent challenges of high current, voltage, および熱管理.
製品の概要: What is a Double-Sided Power PCB?
A double-sided power PCB is a specialized printed circuit board designed to carry and distribute high current and manage substantial power across its two layers. Unlike standard signal PCBs, its core design objectives are low impedance, high current-carrying capacity, and superior thermal performance. We use FR-4 (a flame-retardant glass-reinforced epoxy laminate) as the base material, ensuring every board performs reliably in applications like power converters, motor drives, and industrial power supplies through stringent process control.
コア仕様
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モデル: Double-Sided Power PCB
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基本材料: High-Quality FR-4
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レイヤー数: 2 レイヤー
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板厚: 1.6mm (標準, excellent mechanical strength)
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銅の厚さ (Finished): 1オンス (35μm) - A key parameter for current carrying capacity. (2オンス, 3oz available)
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表面仕上げ: Lead-Free HASL (熱気はんだレベリング). Provides excellent solderability and cost-effectiveness.
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分. トレース/スペース: 6ミル (0.15mm), sufficient for most power layouts.
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はんだマスク色: 緑 (標準)
Design Essentials & 作業原則
Key Design Considerations:
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Wide Traces & 重い銅: Power paths (例えば。, Vin, Vout, GND) use the widest possible traces with 1oz or thicker copper to minimize resistance, heat generation, and voltage drop.
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Adequate Via Stitching: Multiple vias in arrays are used to connect the same power net on both layers, significantly reducing parasitic resistance and inductance of the vias and enhancing current capacity.
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熱管理: Strategic placement of heat-generating components (例えば。, MOSFET, インダクタ) alongside thermal vias そして exposed copper pads to efficiently transfer heat to the opposite side or an external heatsink.
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Safety Spacing: Electrical clearance and creepage distances for high-voltage lines are strictly set according to safety standards (例えば。, UL, IEC) to ensure operational safety.
作業原則:
The double-sided power PCB serves as a passive interconnection platform. Its function is to provide optimal electrical and physical connections for active power コンポーネント (IC, 変圧器, コンデンサ, インダクタ). Through meticulously designed high-power traces, it ensures energy is transferred from input to conversion circuitry and then to the load with minimal loss and heat generation. Effective thermal path design keeps component junction temperatures within safe limits, enabling reliable PCBAアセンブリ and long-term stable operation.
Product Categories, 材料 & 構造的特徴
Common Applications/Categories:
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DC-DC Converter PCBs
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AC-DC Power Supply Module PCBs
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Motor Driver PCBs
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Inverter/VFD PCBs
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High-Power LED Driver PCBs
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バッテリー管理システム (BMS) プリント基板
Materials Used:
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基板: FR-4, offering excellent insulation, 機械的強度, および火炎遅延 (94V-0).
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Conductive Layer: Electro-deposited copper foil (starting at 1oz, customizable to 2oz, 3オンス, and beyond).
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はんだマスク: Standard green LPI (Liquid Photo-Imageable) ink for protection.
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表面仕上げ: Standard Lead-Free HASL. Other finishes like ENIG or OSP are available upon request.
構造的特徴:
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Dual-Side Layout: Components can be placed on both top and bottom layers, maximizing space for efficient power routing.
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Reinforced Power Planes: While not having dedicated power planes, large copper pours on both layers create highly effective “pseudo” power planes.
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Integrated Thermal Management: Features like thermal vias and large exposed copper areas facilitate heat dissipation to enclosures or heatsinks.
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堅牢な構造: The standard 1.6mm board thickness provides superior mechanical rigidity, suitable for heavy components like large capacitors and heatsinks.
UGPCB Standard Production Flow & Performance Advantages
Our Manufacturing Process:
DFM Review → Material Prep → Drilling → Plating (PTH) → Pattern Transfer → Pattern Plating (Copper Build-up) → Etching → Solder Mask Application → Surface Finish (出血) → Silkscreen → Electrical Testing → Final Inspection → Packaging & 配送
We maintain strict control over every step, particularly copper plating thickness and etch uniformity, to ensure precision and current-carrying capability of power traces.
Key Performance Advantages:
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High Current Capacity: Optimized copper weight and trace design for handling Ampere-level currents.
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Low Thermal Resistance: Innovative cooling features effectively reduce hot spot temperatures, extending component lifespan.
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High Stability: Rigorous process and material control ensure stable performance in harsh environments (high temp/humidity).
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Strong Compatibility: Proven HASL surface finish offers excellent solderability for volume プリント基板 生産.
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Cost-Effective: Provides competitive pricing for both PCB quick-turn prototypes and volume production without comp
Wide Range of Applications
UGPCB’s double-sided power PCBs are the ideal choice for numerous high-power electronic devices:
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産業管理: Variable Frequency Drives (VFDs), servo drives, PLC power modules.
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新しいエネルギー: PV inverters, Energy Storage System (ESS) power conversion systems, charging pile modules.
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カーエレクトロニクス: On-Board Chargers (OBC), DC-DCコンバーター, motor controllers.
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家電: High-wattage adapters, gaming console PSUs, high-end audio amplifiers.
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Telecom Equipment: Base station power supplies, network equipment power distribution boards.
Why Choose UGPCB for Your Double-Sided Power PCBs?
We understand the complexities of power プリント基板設計. Choosing UGPCB means gaining more than just a circuit board; you gain a reliable power solution partner. We offer comprehensive support from PCB design review そして quick-turn prototyping to volume production, ensuring your product’s smooth journey from concept to market.
Contact a UGPCB sales engineer today for a customized quote and technical solution for your double-sided power PCB needs! Let our expertise empower your product with stable, reliable performance.
