両面スルーホールPCBボード

私. 製品の概要

UGPCB Double-Sided Through-Hole PCB Board is a high-performance 2-layer rigid プリント基板 built on an FR-4 glass-epoxy substrate using plated through-hole (PTH) テクノロジー. The board measures 86.9 × 73.58 mm with a thickness of 1.0 mm, copper foil thickness of 1/1 オズ (35 μm on both outer and inner layers), and a lead-free hot air solder leveling (出血) 表面仕上げ. The solder mask is green, and the silkscreen legend is white.

A double-sided through-hole PCB (double-sided printed circuit board) features conductive circuitry on both sides of the insulating substrate, with plated through-holes enabling electrical interconnection between the two layers. Compared to single-sided PCBs, double-sided PCBs offer 60%–80% higher routing density and support more complex circuit designs. UGPCB, backed by ISO-certified quality systems and IPC-compliant manufacturing processes, delivers high-quality double-sided through-hole PCBs and turnkey プリント基板 services to electronics manufacturers worldwide.

Ⅱ. Product Definition and Technical Specifications

Per IPC-6012F リジッドプリント基板の認定および性能仕様 (published September 2023), the double-sided through-hole PCB is classified as a rigid printed board with plated through-holes (タイプ 2). Its core feature is the electrical connection between conductors on both sides through copper-plated hole walls. UGPCB manufactures this product in full compliance with IPC-6012F and meets Class 2 パフォーマンス要件 (dedicated service electronic equipment).

主な仕様:

Ⅲ. 設計ガイドライン

3.1 Substrate Material Selection — Engineering Value of FR-4

FR-4 is a flame-retardant grade designation established by the National Electrical Manufacturers Association (NEMA). The letters “FR” stand for flame-retardant, and the number “4” denotes an epoxy resin system reinforced with woven glass fabric. Per IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards, FR-4 Grade A1 represents the core performance tier with optimal mechanical strength, electrical properties, and long-term reliability.

Key Performance Indicators of FR-4 (ソース: IPC-4101 and industry standards):

• ガラス転移温度 (TG): 130–140°C (標準FR-4)

• 誘電率 (DK) @ 1 GHz: 4.2–4.5

• 損失係数 (Df) @ 1 GHz: ≤ 0.020

• 可燃性評価: UL 94 V-0

• 吸水性 (24 時間): ≤ 0.10%

FR-4 remains the predominant substrate material in the PCB industry because it offers an outstanding balance of mechanical strength, 電気断熱, 寸法安定性, and processability.

3.2 Circuit Design Standards per IPC-2221

IPC-2221の場合 Generic Standard on Printed Board Design, conductor width design must account for current-carrying capacity, temperature rise, および銅の厚さ. The IPC-2221 current-carrying capacity formula is:

I = k · ΔT^0.44 · A^0.725

どこ:

• I = Maximum current-carrying capacity (あ)

• k = Empirical constant (0.048 for external layers, 0.024 for internal layers)

• ΔT = Allowable temperature rise (℃)

• A = Conductor cross-sectional area (ミル平方), where A = W × T

UGPCB’s product features a line width of 0.32 mm (約. 12.6 ミル), line spacing of 0.37 mm (約. 14.6 ミル), and copper thickness of 1 オズ (35 μm). For an external layer trace with a 10°C temperature rise:

A = 0.32 mm× 0.035 mm = 0.0112 mm² ≈ 17.36 ミル平方

I = 0.048 × 10^0.44 × 17.36^0.725 ≈ 0.048 × 2.75 × 7.82 ≈ 1.03 あ

This conductor width supports approximately 1 A of current, meeting the power and signal transmission needs of most consumer electronics and industrial control equipment. IPC-2221 recommends limiting the maximum temperature rise to 10°C or 20°C to preserve PCB service life.

3.3 Hole Diameter and Aspect Ratio Design

The aspect ratio of a through-hole is a critical metric for evaluating drilling and hole metallization difficulty. The formula is:

Aspect Ratio = Board Thickness / Drilled Hole Diameter

For UGPCB’s product with 1.0 mm board thickness and 0.236 mm minimum hole diameter:

Aspect Ratio = 1.0 / 0.236 ≈ 4.24:1

This aspect ratio is well below the industry-recommended upper limit of 10:1 and the conservative design threshold of 8:1. It indicates low difficulty in drilling and metallization, high yield rates, controlled costs, and assured through-hole reliability.

3.4 Land Pattern Design Reference

Per IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard, land pattern design must ensure adequate solder fillet formation and meet solderability, inspectability, and reworkability requirements. スルーホール部品用, land diameter is typically recommended at 1.8–2.2 times the hole diameter to ensure sufficient annular ring width.

Ⅳ. 動作原理

The double-sided through-hole PCB operates on three core technologies:

1. Double-Sided Routing — Conductive circuit patterns are etched on both the top and bottom surfaces of the FR-4 insulating substrate, allowing component placement on both sides. This significantly increases circuit density and design flexibility.

2. メッキスルーホール (PTH) 相互接続 — After drilling, electroless copper deposition and electrolytic copper plating build up a conductive layer on the hole walls. This creates low-resistance, highly reliable electrical connections between the top and bottom layers. Per IPC-6012F Class 2, the minimum average plated copper thickness on hole walls must be ≥ 20 μm.

3. Component Assembly and Soldering — Components are mounted through hole (tht) or surface mount (SMT) techniques and electrically connected via reflow or wave soldering, producing a fully functional PCBA (印刷回路基板アセンブリ) モジュール.

V. 製品分類

Per the IPC-6012F classification system for rigid printed boards, UGPCB’s product is classified as follows:

By application domain, this product falls into the General Industrial Grade Double-Sided PCB category, suitable for consumer electronics, 産業用制御, 通信機器, パワーアダプター, and other medium-reliability applications.

VI. 材料構成

6.1 Substrate — FR-4 Copper-Clad Laminate

FR-4 is a glass-reinforced epoxy laminate composed of electronic-grade woven glass fabric as reinforcement and epoxy resin as the binder, consolidated under high temperature and pressure. Its UL 94 V-0 flammability rating means that in the vertical burn test, the material self-extinguishes within 10 seconds after each of two 10-second flame applications, with no flaming drips that ignite cotton.

6.2 Copper Foil — 1/1 オズ

One ounce (1 オズ) of copper foil has a thickness of 35 μm (1.37 ミル). UGPCB は使用します 1 OZ copper on both outer layers (designated 1/1 オズ), ensuring equal current-carrying capacity and conductivity on both sides.

6.3 Surface Finish — Lead-Free HASL

Lead-Free HASL involves immersing the PCB in molten lead-free solder (typically Sn-Cu, Sn-Cu-Ni, or Sn-Ag-Cu alloys), then using high-pressure hot air knives to level and remove excess solder. This produces a uniform, solderable protective coating on the copper surfaces. The process complies with IPC-6012F requirements and RoHS environmental directives.

6.4 Solder Mask and Legend

• Green Solder Mask — Covers all circuit areas except pads, providing insulation, oxidation protection, and short-circuit prevention.

• White Silkscreen Legend — Identifies component reference designators, polarity markers, board part numbers, and revision levels to facilitate assembly and debugging.

VII. Product Performance

7.1 電気性能

7.2 機械的性能

7.3 信頼性

Per IPC-6012F Class 2 要件, the product must pass the following reliability verifications:

• 熱ストレステスト (288℃, 10 秒, no delamination or blistering)

• Plated Through-Hole Copper Adhesion Test (minimum average hole-wall copper thickness ≥ 20 μm)

• はんだ付け性試験

• Electrical Continuity and Insulation Resistance Test

VIII. 製品構造

UGPCB’s double-sided through-hole PCB features a symmetrical 2-layer construction. From top to bottom:

1. Top Legend Layer (White Silkscreen)

2. Top Solder Mask Layer (Green Ink)

3. Top Copper Foil Layer (1 オズ, 35 μm)

4. FR-4 Insulating Substrate (1.0 mmの厚さ)

5. Bottom Copper Foil Layer (1 オズ, 35 μm)

6. Bottom Solder Mask Layer (Green Ink)

7. Bottom Legend Layer (White Silkscreen)

8. メッキスルーホール (PTH) — Span the full board thickness with copper-plated hole walls enabling interlayer interconnection

IX. 製品の特徴

1. High Routing Density — Double-sided routing delivers 60%–80% higher density than single-sided boards, supporting more complex circuit designs.

2. Highly Reliable Through-Hole Interconnection — Plated through-hole (PTH) technology ensures long-term electrical reliability between layers, with hole-wall copper thickness meeting IPC-6012F Class 2 要件 (≥ 20 μm average).

3. Excellent Flame Retardancy — FR-4 substrate meets UL 94 V-0 可燃性評価, ensuring safety under abnormal operating conditions.

4. Lead-Free and Environmentally Friendly — Lead-free HASL surface finish complies with RoHS environmental directives.

5. Fine-Pitch Circuit Capability — Minimum line width of 0.32 mm and minimum spacing of 0.37 mm accommodate medium- to high-density circuit designs.

6. Superior Dimensional Stability — FR-4’s low water absorption (≤ 0.10%) ensures minimal dimensional change in humid environments, preserving assembly accuracy.

7. Mature Manufacturing Process — With 1.0 mm board thickness and 0.236 mm minimum hole diameter, the aspect ratio of only 4.24:1 enables mature processes, high yields, and short lead times.

x. 製造工程の流れ

UGPCB’s standard double-sided through-hole PCB manufacturing process:

1. Incoming Material Inspection → Verify FR-4 copper-clad laminate thickness, copper foil quality, and visual defects.

2. 切断 → Cut large-format copper-clad laminate to working panel size (86.9 × 73.58 mm).

3. 掘削 → Use high-precision CNC drilling machines to drill all through-holes per the Gerber drill file (minimum diameter 0.236 mm).

4. メッキスルーホール (PTH) → Deposit a thin copper seed layer on hole walls via electroless copper deposition.

5. Panel Plating → Electrolytically plate copper to build up hole-wall and surface copper to target thickness (1 オズ).

6. パターン転写 → Laminate dry film, expose, and develop to form the circuit pattern resist.

7. エッチング → Etch away unprotected copper to form the final circuit pattern.

8. Stripping → Remove the resist dry film from circuit traces.

9. ソルダーマスクの塗布 → Apply green solder mask ink, expose, and develop to expose pads.

10. 表面仕上げ → Lead-Free HASL.

11. Legend Printing → Screen-print white silkscreen legend.

12. ルーティング / V-Cut → CNC routing to final board outline.

13. 電気テスト → Flying probe or fixture testing to verify open/short integrity.

14. 最終的な品質管理 (FQC) → Visual inspection, dimensional sampling, and packaging for shipment.

XI. アプリケーションシナリオ

UGPCB Double-Sided Through-Hole FR-4 PCB Boards, with their balanced performance and mature processes, are widely used in:

11.1 家電

• パワーアダプターと充電器

• Home appliance control boards

• スマートホームデバイス

11.2 産業用制御

• PLC programmable logic controllers

• Industrial power modules

• Instrumentation and meters

11.3 通信機器

• Routers and switches

• Communication modules

• Signal conversion devices

11.4 カーエレクトロニクス

• 車載充電器

• ボディコントロールモジュール (non-safety-critical)

• インフォテインメントシステム

11.5 医療機器

• Patient monitor auxiliary boards

• 携帯型医療機器 (クラス 2 applicable)

XII. Product Advantages and Selection Guide

12.1 Why Choose UGPCB Double-Sided Through-Hole PCBs?

• IPC-Compliant Process Control — From material selection to finished goods, full compliance with IPC-6012F, IPC-4101, and other international standards.

• High-Precision Manufacturing — Minimum hole diameter of 0.236 mm and minimum line width of 0.32 mm meet medium- to high-density design requirements.

• 環境コンプライアンス — Lead-free HASL surface finish complies with RoHS 2.0 directives.

• 実証済みの信頼性 — FR-4 substrate has been market-validated for decades with consistent performance.

• 迅速な配達 — Standard specifications are stocked with ample raw materials, ensuring reliable lead times.

12.2 Selection Reference

UGPCB Double-Sided Through-Hole PCBs are the ideal choice when your project meets these criteria:

• Moderate circuit complexity that 2 layers can accommodate

• Operating frequency below 1 GHz (FR-4 performs excellently in this range)

• Long-term operating environment not exceeding 120°C

• Cost-sensitive applications demanding high value

XIII. Request a Quote

UGPCB is committed to delivering high-quality PCB manufacturing and turnkey PCBA services to customers worldwide. Whether you need standard-specification double-sided through-hole PCBs or custom requirements (special board thickness, copper weight, 表面仕上げ, インピーダンス制御, 等), UGPCB’s expert team provides full support from engineering design to volume production.

今すぐ見積もりを入手:

• Submit Gerber files + specifications — receive a quote within 24 時間

• Support from prototype to high-volume production

• Free Design for Manufacturing (DFM) レビュー

連絡先:
📧 Sales Inquiries: [sales@ugpcb.com]
🌐 Website: [www.ugpcb.com]

XIV. Data Source Declaration

The standards and data cited in this document are sourced from the following authoritative organizations:

1. IPC (エレクトロニクス産業をつなぐ協会): IPC-6012F リジッドプリント基板の認定および性能仕様 (September 2023); IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards; IPC-2221 Generic Standard on Printed Board Design; IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard

2. UL (引き受けの研究所): UL 94 Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances

3. NEMA (National Electrical Manufacturers Association): FR-4 material grade definition

4. Industry Standard Technical Data: FR-4 dielectric constant, 散逸係数, and other material property parameters