カスタム 2 層リジッド FR-4 PCB | 同意する + ハードゴールド仕上げ | 高い信頼性 & 低コスト

カスタム 2 層リジッド FR-4 PCB: 同意する + Hard Gold Finish for High Reliability & 費用対効果

Discover the industry “gold standard” for balanced performance and affordability. UGPCB’s 2-layer rigid FR-4 プリント基板, featuring TG150 high-temperature material and a dual ENIG + Hard Gold surface finish, delivers superior reliability for demanding applications.

私. Why Choose 2-Layer Rigid FR-4 PCB?

In the era of electronic miniaturization, の需要 高い信頼性, 低コスト, そして compact design has made the 2-layer rigid PCB the “golden choice” for engineers and procurement managers. Unlike single-sided boards limited by routing space or expensive multi-layer boards, the 2-layer design strikes the perfect balance between performance and price.

UGPCB enhances this baseline by utilizing FR-4 TG150 heat-resistant material and a specialized エレクトロレスニッケルイマージョンゴールド (同意する) + ハードゴールド 表面処理. This combination significantly improves durability and solderability, making it suitable for a wider range of harsh environments.

Ⅱ. Product Core Specifications (IPC-A-600 Compliant)

The following parameters ensure full compatibility with industry standards and optimal manufacturability (DFM).

Ⅲ. Product Definition: What is a 2-Layer Rigid PCB?

1. 意味

あ リジッドPCB is a non-flexible printed circuit board composed of a substrate, copper foil traces, はんだマスク, and silkscreen. It establishes fixed electrical connections through drilling and etching processes.
あ 2-レイヤーリジッドPCB (Double-Sided Board) is the foundational type of rigid PCB, featuring copper traces on both the top and bottom sides of the substrate. Electrical connections between layers are achieved via Plated Through Holes (Vias).

2. Classification by Layer Count

• 1-層 (Single-Sided): Circuits on one side only. Lowest cost but severe routing limitations.
• 2-レイヤー (Double-Sided): Circuits on both sides. Higher routing flexibility than single-sided; moderate cost. (UGPCB’s Specialty)
• Multi-Layer (4+ レイヤー): Three or more copper layers. Suitable for complex circuits but significantly higher cost.

UGPCB’s 2-layer offering represents the highest cost-performance ratio in the rigid PCB category.

Ⅳ. Design Guidelines for High Reliability

With limited routing space on 2-layer boards, 順守 IPC-2221 design standards is crucial for signal integrity and thermal management.

1. Power and Ground Layout

• Ground Planes: Use large copper pours for Ground (GND) to minimize signal interference and EMI.
• Power Traces: Widen VCC traces to >20ミル to reduce resistance and voltage drop.
• 間隔: Maintain a minimum 10mil clearance between power and ground to improve filtering.

2. Signal Routing

• Differential Pairs: For high-frequency signals (USB, HDMI), use differential routing to reduce electromagnetic radiation.
• 3W Rule: Maintain a spacing of ≥3x the trace width between signal lines to avoid crosstalk.
• Return Paths: Avoid signal traces crossing splits in the ground plane to prevent signal reflection.

3. Via Design

• Hole Size: Minimize via diameter (例えば。, 0.3mm) to save routing space.
• Via Tenting: Use solder mask to cover vias to prevent solder paste wicking during soldering.
• 高周波: Use through-hole vias (standard for 2-layer) to minimize parasitic capacitance compared to blind/buried vias.

V. 動作原理: How PCBs Work

The core function of a PCB is to connect electronic components (チップ, 抵抗器, コンデンサ) via copper traces to achieve predetermined electrical functions.

• 例: In a smartphone charging board, the PCB routes power from the USB interface to the charging management chip, distributes it to the battery, and feeds battery level data back to the system via signal lines.
• While the principle is identical to 多層基板, 2-layer boards require meticulous layout planning to ensure 信号の完全性 (そして) within limited space.

VI. 材料 & パフォーマンス: Why FR-4 TG150?

1. 基本材料: FR-4 TG150

FR-4 (Flame Retardant 4) is the industry standard for epoxy resin glass cloth substrates.

• High Mechanical Strength: Reinforced by glass cloth, resisting bending and breakage.
• 熱安定性: TG150 (Glass Transition Temperature 150°C) ensures stability in high-temperature environments (industrial workshops, automotive engine compartments).
• 電気的特性: 誘電率 (DK) 4.2-4.5, 損失係数 (Df) 0.02, making it suitable for high-frequency signal transmission.
• 耐薬品性: Resists corrosion from solder and flux, extending service life.

2. 表面仕上げ: ENIG 2u” + Hard Gold 30u”

Surface finish acts as the PCB’s “protective shield.” UGPCB combines two finishes for maximum benefit:

• 同意する (エレクトロレスニッケルイマージョンゴールド): あ 2u” (0.05μm) gold layer deposited chemically. Offers excellent planarity and solderability, ideal for fine-pitch components (例えば。, 0.5mm pitch chips).
• ハードゴールド (Electrolytic Gold): A thick 30u” (0.76μm) gold layer plated electrically. Provides superior wear resistance and conductivity, perfect for frequent plug-in/unplug cycles (USB ports, SD card slots).

Comparison: This combination outperforms HASL (熱気はんだレベリング) and standard OSP (有機はんだ付け性防腐剤) in high-reliability applications like 産業用制御 そして 自動車エレクトロニクス.

VII. 構造 & 特徴: Panelization Advantages

This PCB utilizes Matrix Panelization, where multiple individual PCBs (例えば。, 10×10 array) are arranged on a larger production panel connected by Webs (Tabs).

Advantages of Panelization:

• Production Efficiency: Multiple PCBs produced simultaneously, reducing machine setup time.
• コスト削減: Minimizes scrap material and maximizes material utilization.
• Assembly Ease: Webs can be separated via routing or V-Cut (V-Scoring) without damaging individual boards.

Additional Product Features:

• 高い信頼性: FR-4 TG150 + ENIG/Hard Gold withstands harsh environments (high temp, 湿度, vibration).
• 低コスト: Mature 2-layer process is 30%-50% 安く than multi-layer boards.
• カスタマイズ: Supports min. 0.1mm hole size, 分. 3MILトレース/スペース, and various finishes (浸漬シルバー, OSP, 等).
• Eco-Friendly: Compliant with RoHS そして 到着 標準; lead-free soldering ready for global export.

VIII. 製造工程: Strict IPC-A-600 & IPC-6012 Control

UGPCB’s workflow adheres strictly to IPC-A-600 (Quality Standard) そして IPC-6012 (Performance Specification for Rigid PCBs).

1. 切断: Shearing FR-4 laminate to required dimensions (例えば。, 18″x24″).
2. 掘削: CNC drilling for component holes (0.3mm) and vias (0.2mm).
3. Electroless Copper: Chemical deposition of 1-2μm copper for interlayer connectivity.
4. Image Transfer: フォトレジストの塗布, 暴露する, and developing to transfer circuit patterns.
5. エッチング: Removing excess copper to form final traces.
6. はんだマスク: Coating with green solder mask ink, 暴露する, and curing to protect circuits.
7. 表面仕上げ: 同意する (2u”) + ハードゴールド (30u”) plating for solderability.
8. シルクスクリーン: Printing component designators (R1, C2) and logos.
9. 電気試験: フライングプローブテスト to check continuity and isolation (no shorts/opens).
10. Routing/V-Cut: Separating individual PCBs from the panel and chamfering edges.
11. 最終検査: あおい (自動光学検査) for scratches, 酸化, dimensional accuracy, and reliability tests (Thermal Shock, Vibration).

IX. アプリケーションシナリオ

Thanks to its high reliability and cost-effectiveness, this PCB is widely used in:

1. 家電
   • Mobile/Tablets: Charging boards, パワーモジュール, keypads.
   • ウェアラブル: Smartwatch motherboards, fitness tracker sensors.
   • Home Appliances: AC control boards, washing machine displays.
2. 産業管理
   • PLC Modules: I/O boards, communication modules.
   • センサー: Signal processing for temp/pressure sensors.
   • Robotics: Servo motor control, encoder interfaces.
3. カーエレクトロニクス
   • Infotainment: Navigation mainboards, audio controls.
   • Safety Systems: Reverse radar control, TPMS (Tire Pressure Monitoring).
   • EVs: Charging pile control, BMS (バッテリー管理システム) auxiliary boards.
4. 医療機器
   • Portable Diagnostics: Glucose meters, sphygmomanometers.
   • Monitoring: ECG, pulse oximeter signal boards.
   • Surgical: Control boards for minimally invasive instruments.
5. Other Fields
   • 電気通信: Router/Switch interface cards.
   • 航空宇宙: Drone flight controllers, satellite comms.
   • スマートホーム: Smart locks, smart lighting controls.

x. UGPCBを選択する理由?

As a professional PCB manufacturer with over 10 years of experience, UGPCB serves 1000+ clients globally.

• Advanced Equipment: Japanese Mitsubishi drills, German LPKF exposure machines, US Test Research flying probe testers.
• Strict Quality: 認定されています ISO9001, ISO14001, and IATF16949 (自動車産業).
• 速いターンアラウンド: 24-hour lead time for prototypes; 3-5 days for volume production.
• Free Services: DFM (製造用のデザイン) Check, free quotes, and free sample testing (for first-time orders).

XI. Request a Quote: Accelerate Your Time-to-Market

If you need 2-layer rigid FR-4 PCBs or have questions about ENIG+Hard Gold または panelization, contact UGPCB today!

• ✅ Free DFM Review: Optimize your design to prevent manufacturing defects.
• ✅ Free Sample Testing: Verify performance before mass production.
• ✅ 競争力のある価格設定: Cost-effective solutions based on quantity and specs.
• ✅ 迅速な配達: Prototypes in 24h, Mass production in 3-5 日.

まとめ

UGPCB 2-Layer Rigid FR-4 PCB, フィーチャー FR-4 TG150 base material そして 同意する + Hard Gold surface finish, is the premier choice for applications demanding 高い信頼性 そして 低コスト. Whether you are a consumer electronics manufacturer or an automotive engineer, we provide customized solutions that meet IPC-A-600 standards.

Contact us now to start your project and seize market opportunities!