12-Layer Gold Finger PCB Manufacturer | 1.6mm FR-4 TG170 ENIG & Hard Gold Plating | UGPCB

High-Performance 12-Layer ENIG + Gold Finger PCB 製品の概要

The 12-Layer Gold Finger PCB is a hallmark product in the high-end プリント基板 業界, engineered specifically for electronic equipment demanding extreme reliability, stable electrical connections, and frequent plugging/unplugging cycles. UGPCB employs advanced manufacturing processes and premium materials (FR-4 TG170), combining 2m” エレクトロレスニッケルイマージョンゴールド (同意する) surface finish with 30m” Hard Gold Finger Plating テクノロジー. We deliver a comprehensive high-reliability PCB solution for applications ranging from industrial controls to advanced communication systems.

Product Definition

A Gold Finger PCB refers to a circuit board featuring a series of exposed, rectangular contact pads plated with thick gold (“fingers”) along one edge. These boards are designed for direct insertion into a matching connector slot, establishing a stable, pluggable connection for electrical signals and power between devices. This product is a 12-layer multilayer PCB with a standard thickness of 1.60mm, offering an optimal balance between complex circuit integration and mechanical robustness.

設計上の重要な考慮事項

1. Gold Finger Area Design:

   • Chamfer (Bevel) Edge (Typically 20-45°): Facilitates smooth insertion into the connector—a critical aspect of ゴールドフィンガー プリント基板設計.

   • Lead-in (Trace Fanout): Connections from the gold fingers to internal traces must have smooth curves, avoiding right angles to prevent stress concentration and plating cracks.

   • Solder Mask Clearance (Solder Mask Define): The gold finger area requires precise solder mask opening to ensure a clean, exposed plating surface.

2. インピーダンス制御 & 信号の完全性: として 12-layer precision PCB, strict impedance control (例えば。, 50Ω シングルエンド, 100Ω differential) for high-speed signal layers is essential. Stack-up design must be optimized via simulation to minimize crosstalk.

3. 熱 & Reliability Management: High-Tg material, coupled with a well-designed via structure, ensures the high-layer-count PCB operates stably in elevated temperature environments. メッキスルーホール (pths) should be avoided at the root of gold fingers to prevent fluid entrapment and structural weakness.

それがどのように機能するか & 構造

This PCB facilitates complex circuit interconnections through its internal 12 conductive layers. The core functionality resides in the Hard Gold Plated Fingers. The durable 30-microinch gold plating provides excellent conductivity, 耐酸化性, そして耐摩耗性. When the board is inserted into a backplane or card-edge connector, the gold fingers make tight, low-resistance electrical contact with the connector’s spring contacts, transmitting signals and power. The board core uses FR-4 TG170, providing solid mechanical support and electrical insulation.

コア材料 & 仕様

• 基本材料: FR-4 TG170. A high-performance epoxy glass laminate.

  • 高いガラス転移温度 (Tg ≥ 170°C): Significantly enhances the PCB’s mechanical stability and heat resistance under high-temperature operating conditions, preventing delamination and Z-axis expansion.

  • Superior Electrical Properties: 低誘電率 (DK) および散逸率 (Df), suitable for mid-to-high frequency applications.

  • High Mechanical Strength: Ensures the 1.6mm thick PCB board resists bending and warping in mating/unmating and high-vibration environments.

• 表面仕上げ:

  • Board Surface: エレクトロレスニッケルイマージョンゴールド (同意する, 2m”): アパートを提供します, coplanar surface for reliable soldering of fine-pitch components and offers excellent oxidation resistance.

  • ゴールドフィンガーズ: Selective Electroplated Hard Gold (30m”): High hardness, superior abrasion resistance, and extended mating cycle life, capable of withstanding 500+ insertion/withdrawal cycles with ease.

主な特長 & 利点

1. Unmatched Reliability: FR-4 TG170 high-Tg material そして 12-layer precision lamination ensure long-term stability in harsh operating conditions.

2. Extended Mating Cycle Life: 30m” thick hard gold fingers far exceed standard plating thickness, offering exceptional wear resistance—the ideal choice for high-durability plug-in PCBs.

3. 優れた信号の完全性: The multilayer design provides uninterrupted reference planes for high-speed signals, and controlled impedance guarantees signal quality.

4. Robust Thermal & 機械的性能: The 1.60mm standard thickness combined with high-Tg material delivers superior rigidity, 熱管理, and dimensional stability.

5. Comprehensive High-End Solution: から 多層 PCB製造 に specialty surface finishing (同意する + Selective Gold), UGPCB provides full-process control, ensuring consistent, 高品質の結果.

Manufacturing Process Flow

Panelization → Inner Layer Imaging → Lamination (12-層) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging → パターンメッキ (for Hard Gold Fingers) → Etching → Solder Mask Application → ENIG Surface Finish → Gold Finger Beveling → Electrical Test (飛行プローブ / Fixture) → Final Automated Optical Inspection (あおい) → Packaging.

主要なアプリケーション & ユースケース

This product is the core component of high-end electronic devices requiring direct board-to-board plug connections または integration into backplane systems.

• Industrial Control Systems: PLCモジュール, industrial computer motherboards, servo drives, I/O interface cards.

• 通信 & Networking Equipment: Router/switch line cards, optical transceiver modules, baseband processing units.

• 医療エレクトロニクス: Data acquisition and processing boards for advanced medical imaging systems (例えば。, CT scanners, ultrasound machines).

• テスト & 測定器: Plug-in modules for high-end oscilloscopes, スペクトラムアナライザ, and Automated Test Equipment (食べた).

• 航空宇宙 & 防衛電子機器: Mission-critical avionics systems and radar signal processing modules where reliability is paramount.

科学製品の分類

1. レイヤーカウントごとに: High-Layer-Count / Multilayer Circuit Board (≥8 layers, 具体的には 12 レイヤー).

2. By Special Feature/Process: ゴールドフィンガー (Gold Edge Connector) プリント基板, Mixed Surface Finish PCB (同意する + Selective Hard Gold).

3. By Material Property: 高Tg (TG170) プリント基板, FR-4 Series PCB.

4. アプリケーショングレード別: Industrial-Grade PCB, Telecom-Grade PCB, High-Reliability PCB.

Why Choose UGPCB’s 12-Layer Gold Finger PCB?

We understand that a reliable Gold Finger PCB is the foundation of your high-end equipment’s stable operation. Leveraging deep expertise in 多層 プリント基板の製造 そして specialty surface finish processes, UGPCB guarantees that every board delivered meets military-grade reliability standards with commercial-grade delivery efficiency. We provide not just a product, but a customized PCB solution.

今すぐ当社の技術営業チームにお問い合わせください to discuss your project requirements, receive a detailed quote, and qualify for a free design-for-manufacturability (DFM) レビュー and sample program. Partner with UGPCB for your most demanding 12 層回路基板 アプリケーション.