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製品の概要: What Is an OSP Antioxidant PCB Circuit Board?
AnOSP antioxidant PCB circuit board uses有機はんだ付け性保存剤 (OSP) as its copper surface finish. This process deposits an ultra-thin organic film on bare copper surfaces. The film prevents oxidation during storage and assembly. During soldering, the flux quickly dissolves the OSP film. This exposes clean copper for reliable solder joints.
UGPCB’s OSP antioxidant PCB circuit board usesFR-4 glass epoxy laminate as the base material. It features 35μm (1 オンス) 銅箔, 1.6板厚mm, and dimensions of 68.36 × 34.6mm. The minimum finished hole size is 0.45mm. Minimum trace width is 0.15mm and minimum spacing is 0.20mm. The product fully complies with IPC-6012E (rigid printed board qualification and performance) and IPC-4555 (high-temperature OSP performance) 仕様.
これdouble-sided OSP PCB serves consumer electronics, 通信機器, and industrial controls. It works best where cost sensitivity and surface flatness matter most.
科学製品の分類
Based on international PCB classification systems, this product falls into these categories:
| Classification Dimension | カテゴリ |
|---|---|
| 基板材料 | FR-4 epoxy glass fabric rigid PCB |
| レイヤー数 | 両面 (two-layer circuitry) |
| 表面仕上げ | OSP (有機はんだ付け性保存剤) antioxidant |
| 可燃性評価 | UL 94 V-0 |
| IPC Performance Class | クラス 2 (dedicated service electronic products) |
| 銅箔の厚さ | 1 オンス (35μm) standard copper |
| 板厚 | 1.6mm standard rigid board |
| Hole Type | Through-hole compatible with SMT |
Key Technical Parameters Explained
基板: FR-4 Epoxy Glass Fabric
FR-4 is the most common rigid substrate in the プリント基板 業界. “FR” means flame-retardant. “4” indicates epoxy resin combined with glass fabric that meetsUL 94 V-0 flammability standards. UL 94 V-0 requires vertical specimens to self-extinguish within10 秒 after two 10-second flame applications. No flaming drips may ignite cotton.
ガラス転移温度 (TG) measures heat resistance. Standard FR-4 Tg ranges from 130–140°C. Mid-Tg FR-4 reaches 150–160°C. High-Tg FR-4 exceeds 170°C. This product uses standard FR-4 with Tg ≥ 130°C (IPC-4101/21 compliant). This meets the thermal shock demands of reflow soldering (peak temperatures 240–260°C).
銅箔の厚さ: 35μm (1 オンス)
Copper thickness determines current-carrying capacity. This product uses35μm 銅箔, known as1 oz銅 (1 oz/ft² ≈ 35μm). IPC-2221によると, 1 oz copper at 10°C temperature rise carries approximately:
- 0.15mm (6 ミル) トレース幅: 0.5–0.7A
- 0.20mm (8 ミル) トレース幅: 0.8–1.0A
The 35μm copper thickness is the most common standard for double-sided PCBs. It balances cost, current capacity, and manufacturing yield.
基板寸法: 68.36 × 34.6mm
The finished board measures68.36mm × 34.6mm. This compact size suits tight electronic modules. Small PCBs demand tighter precision—dimensional tolerances typically stay within ±0.15mm (IPC-6012クラス 2).
Minimum Finished Hole Size: 0.45mm
0.45mm is the minimum plated through-hole (PTH) diameter. This hole size is a standard in the industry. It ensures reliable plating (aspect ratio approximately 3.6:1 with 1.6mm board thickness). The hole size accommodates most DIP components and standard SMT pad designs.
PCB Thickness: 1.6mm
1.6mm is the most common board thickness in PCB manufacturing. It provides excellent mechanical strength and flexural rigidity. It matches standard connectors and sockets perfectly.
トレース幅と間隔: 0.15mm / 0.20mm
This product offersminimum trace width of 0.15mm (について 6 ミル) そしてminimum spacing of 0.20mm (について 8 ミル). According to IPC classification, these dimensions fall intoクラス 2 (dedicated service electronic products). This precision meets most medium-density PCB designs, including MCU control boards, power management modules, and interface converter boards.
How OSP Antioxidant Process Works
The OSP process grows an ultra-thin organic film on clean bare copper throughchemical adsorption. The OSP film mainly consists ofalkyl benzimidazole compounds (azole-based). Film thickness typically ranges from0.2–0.5μm.
Protection Mechanism
The OSP film protects copper surfaces through three mechanisms:
- Physical barrier – The organic film forms a dense molecular layer. It blocks oxygen and moisture from contacting the copper surface.
- Chemical adsorption – Active groups in OSP molecules bond chemically with copper atoms. This creates strong adhesion.
- Selective protection – The OSP film covers only copper areas. It does not affect solder mask or other non-metallic regions.
Behavior During Soldering
During SMT reflow, temperatures reach190–230°C. The flux’s active ingredients decompose and dissolve the OSP film. This exposes clean copper underneath. Solder directly contacts bare copper and formsintermetallic compounds (IMC). This creates reliable electrical connections. The OSP filmcompletely decomposes with no residue after soldering.
Key Performance Characteristics
Based on IPC-TM-650 test methods:
| 特性 | 代表値 / 要件 | Reference Standard |
|---|---|---|
| OSP Film Thickness | 0.2–0.5μm | IPC-4555 |
| Solder Wetting Angle | ≤30° (後 1 リフロー) | IPC-TM-650 2.4.1 |
| Solder Spread Ratio | ≥80% | IPC-TM-650 2.4.1 |
| Oxidation Protection (ambient) | ≥6 months | IPC-4555 |
| Contact Resistance Change | ≤10% (後 6 months storage) | IPC-TM-650 |
OSP Antioxidant PCB Manufacturing Process
OSP antioxidant PCB manufacturing follows strict process controls. Every step affects final quality and reliability.
Front-End Processes (Substrate Preparation & 回路パターニング)
- 材料の切断 – Cut FR-4 copper-clad laminate to size
- 掘削 – CNC drilling with 0.45mm minimum hole size
- Electroless Copper / Electroplating – Metallize hole walls for layer-to-layer connection
- Circuit Pattern Transfer – Dry film / wet film exposure and development
- エッチング – Remove unwanted copper to create 0.15mm trace / 0.20mm spacing circuitry
- Solder Mask Printing – Apply green or other colored solder mask ink
- Pre-Clean – Remove oxides and contaminants before surface finish
OSP Coating Process (Core Process)
The typical OSP coating flow:
Degreasing → Double Water Rinse → Micro-Etching → Double Water Rinse → Acid Pickling → DI Water Rinse → OSP Film Formation → Air Drying → DI Water Rinse → Final Drying
- Micro-Etching – Removes copper oxides and creates a uniform microscopically rough surface. This promotes OSP film growth.
- OSP Film Formation – Immerse the PCB in OSP chemistry (アルキルベンジミダゾール, organic acids, 塩化銅, 脱イオン水). The film grows through chemical adsorption on copper surfaces.
- Film Thickness Control – Precise control is critical. Too thin means poor heat resistance. Too thick hinders flux action and solder flow.
Back-End Processes
- ルーティング – CNC routing to final dimensions
- 電気テスト – Flying probe or fixture testing
- 最終検査 – Visual inspection and film thickness sampling
- Vacuum Packaging – Moisture-proof and oxidation-proof packaging
Product Features and Core Advantages
優れた表面の平坦性
The OSP film is only0.2–0.5μm thick. It forms through chemical adsorption with uniform thickness and a smooth surface. This preserves the original copper foil flatness. It is ideal forfine-pitch SMT コンポーネント (such as 0.4mm and below pitch QFP, QFN packages).
優れたはんだ付け性
The OSP film dissolves quickly in flux during reflow. This exposes fresh copper for reliable IMC formation. The OSP process supports bothスルーホール (tht) そしてsurface-mount (SMT) はんだ.
費用対効果が高い
OSP uses no precious metals (金, silver, パラジウム). Material and processing costs are lower than ENIG, 浸漬シルバー, or immersion tin. For high-volume production like consumer electronics, OSP offers exceptional cost competitiveness.
Environmentally Compliant
OSP uses organic compounds. It contains no lead, 水銀, cadmium, or hexavalent chromium. It fully meetsRoHS 2.0 要件. Waste treatment costs and complexity are also lower than metal finishing processes.
Short Processing Time
OSP coating is simple and fast. It needs no complex plating equipment or long deposition times. Compared to ENIG (which takes hours), OSP completes surface finishing in30–60 minutes バッチごと. This significantly reduces lead times.
Design Guidelines and Important Considerations
製造用のデザイン (DFM) Rules
Based on this product’s process capabilities:
| Design Parameter | Product Capability | Recommended Design Value |
|---|---|---|
| 最小トレース幅 | 0.15mm | ≥0.15mm (信号トレース) |
| Minimum Spacing | 0.20mm | ≥0.20mm |
| 最小穴サイズ | 0.45mm | ≥0.45mm |
| 板厚 | 1.6mm | 1.6mm (標準) |
OSP Process Limitations and Mitigations
OSP offers many benefits but has inherent limitations:
- Limited Shelf Life – OSP film protects for6 月 in ambient conditions. For best solderability, complete SMT assembly within 3 月.
- Moisture Sensitivity – OSP films degrade in high-temperature, 高湿度環境. Store boards at20–25°C with 40–60% relative humidity.
- Limited Reflow Cycles – Standard OSP withstands1–2 reflow thermal shocks. Multiple reflows require high-temperature OSP (IPC-4555 compliant).
- Electrical Test Challenges – The OSP film is insulating. It affects electrical test contact reliability. Test points need solder paste printing to remove the OSP layer.
Storage and Handling Recommendations
- Vacuum-sealed packaging with desiccant and humidity indicator cards
- 保管環境: temperature ≤30°C, relative humidity ≤60%
- Complete soldering within48 時間 of opening the package
- Wear anti-static gloves during handling. Avoid bare hand contact with board surfaces.
典型的なアプリケーションシナリオ
OSP antioxidant PCB circuit boards serve many industries due to theircost advantage, surface flatness, and excellent solderability:
家電
- Smartphone motherboards and tablet PCBs
- Computer motherboards and graphics cards
- Home appliance control boards
- Wearable device circuit boards
通信機器
- Router and switch PCBs
- Communication modules and IoT devices
- ブルートゥース / Wi-Fi module carrier boards
産業用制御
- PLC programmable logic controllers
- Power management modules
- Instrumentation circuit boards
- Motor drive control boards
カーエレクトロニクス (Non-Safety-Critical)
- In-vehicle infotainment systems
- ボディコントロールモジュール
- Sensor interface boards
Quality Assurance and Standards Compliance
Applicable Standards
UGPCB’s OSP antioxidant PCB product strictly follows these international standards:
| 標準 | Title | Scope |
|---|---|---|
| IPC-4555 | Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards | OSP process requirements and testing |
| IPC-6012E | リジッドプリント基板の認定および性能仕様 | Finished board quality and performance |
| IPC-4101/21 | Specification for Glass-Reinforced Epoxy Laminate | FR-4 substrate technical requirements |
| IPC-TM-650 | Test Methods Manual | Various performance test methods |
| UL 94 V-0 | Flammability of Plastic Materials | Substrate flame retardant safety |
| RoHS 2.0 | Restriction of Hazardous Substances | Environmental compliance |
Key Quality Indicators
Per IPC requirements, key quality metrics include:
- OSP Film Thickness: 0.2–0.5μm, uniformity tolerance ≤ ±0.1μm
- Adhesion: ≥4B (IPC-TM-650 2.4.29 cross-cut test)
- Solder Spread Ratio: ≥80% (IPC-TM-650 2.4.1)
- Oxidation Protection Period: ≥6 months (ambient conditions)
- 可燃性評価: UL 94 V-0
Why Choose UGPCB for OSP Antioxidant PCBs?
精密製造能力
- 0.15mm minimum trace width / 0.20mm minimum spacing
- 0.45mm minimum finished hole size
- 1.6mm standard board thickness with excellent compatibility
Reliable OSP Process Control
- Strict adherence to IPC-4555 for film thickness and quality
- Full traceability throughout the manufacturing process
- Solderability testing and film thickness sampling for every batch
迅速な配達
- Standard lead time: 7–10 working days
- Supports both prototype sampling and volume production
Comprehensive Technical Support
- Free DFM design review
- Professional engineering team for product selection guidance
今すぐ見積もりを入手
UGPCB delivers high-value OSP antioxidant PCB circuit board solutions. 必要かどうかprototype sampling またはvolume production, we provide professional technical support and competitive pricing.
📞 How to Get a Quote:
- Submit your Gerber files and BOM list
- Our engineering team responds with a customized solution and quote within24 時間
- Free DFM check to ensure your design passes the first time
Data Source Statement: The technical data and standard requirements cited in this document are primarily derived from IPC (エレクトロニクス産業をつなぐ協会) standards including IPC-4555 “Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards,” IPC-6012E “リジッドプリント基板の認定および性能仕様,” IPC-4101/21 “Specification for Glass-Reinforced Epoxy Laminate,” IPC-TM-650 “Test Methods Manual,” およびUL 94 “Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances.” Some process parameters reference publicly available technical data from leading PCB manufacturers. All data has been verified for accuracy.
