Rogers RO4350BハイブリッドPCB | 4-層混合誘電体高周波PCBメーカー

1. 製品の概要: Where High-Frequency Performance Meets Cost-Effectiveness

In today’s rapidly evolving landscape of 5G communication, マイクロ波レーダー, and aerospace electronics, the material selection for プリント基板 (プリント基板) directly determines the performance ceiling of end-user equipment. To meet the stringent signal integrity requirements of RF (無線周波数) and high-speed digital circuits while controlling manufacturing costs, hybrid laminate PCB technology has emerged as a vital solution.

UGPCB Rogers RO4350BハイブリッドPCB represents the pinnacle of this technological approach. This product ingeniously combines Rogers RO4350B high-frequency laminates with conventional FR-4 materials through precise construction design, creating a 4-layer board that delivers both exceptional high-frequency characteristics and mechanical stability. With a stable 誘電率 (DK) の 3.48 and a precisely controlled finished board thickness of 1.0mm, complemented by イマージョンゴールド (同意する) 表面仕上げ, this PCB is engineered specifically for communication equipment demanding ultimate signal transmission quality.

2. Product Definition and Scientific Classification

意味: UGPCB’s Rogers RO4350B Hybrid PCB is a mixed dielectric laminate printed circuit board. It features an asymmetric “2-layer Rogers RO4350B + 2-layer FR4” 工事, integrating high-frequency materials with standard materials within a single board.

科学的分類:

• 素材によって: Rigid Board, Mixed Dielectric Laminate

• By Operating Frequency: High-Frequency Microwave Board

• By Process Structure: 多層プリント基板, specifically 4-layer configuration

3. Core Technical Parameters and Design Considerations

UGPCB strictly adheres to material specifications in the design of this product, ensuring every board precisely matches the requirements of RF front-end module designs:

• Core Construction (構造): 2 Layers Rogers RO4350B + 2 Layers FR4. This configuration places RO4350B on the outer layers for high-frequency signal transmission, while FR4 serves as inner or bottom layers providing mechanical support and power distribution, パフォーマンスとコストの最適なバランスを実現する.

• 誘電率 (DK): 3.48 (typically tested at 10GHz). RO4350B’s Dk exhibits minimal variation with frequency and temperature changes, ensuring phase stability of high-frequency signals.

• 物理的寸法:

  • レイヤー数: 4 レイヤー

  • 仕上がり厚さ: 1.0mm

  • 誘電体の厚さ: 0.508mm (typically referring to the RO4350B core layer thickness, critical for impedance control)

• Copper Thickness Configuration:

  • 材料の銅の厚さ: ½ oz (18μm) HH/HH, meaning all layers start with 0.5 oz copper foil.

  • 銅の仕上がり厚さ: 1/0.5/0.5/1 (オズ). This precise layer-specific copper thickness design delivers:

    • L1 & L4 (外層): 1 オズ (35μm), enhancing current-carrying capacity and outer layer soldering reliability.

    • L2 & L3 (内層): 0.5 オズ (18μm), facilitating fine-line etching and ensuring signal layer precision.

• 表面処理: イマージョンゴールド (同意する). ENIG provides excellent surface planarity—critical for high-frequency signal transmission where skin effect dominates—while offering superior oxidation resistance and solderability.

• 可燃性評価: UL 94 V-0 準拠, ensuring product safety.

4. 動作原理とパフォーマンスの利点

作業原則

As a carrier and electrical interconnection platform for electronic components, this PCB operates on a fundamental principle: high-frequency signals travel through microstrip or stripline structures within the Rogers RO4350B material layers (L1, L2). Thanks to RO4350B’s exceptionally low 損失係数 (Df) 安定した誘電率, signal energy loss during transmission is minimized, with reflections and scattering effectively suppressed. The underlying FR4 layers primarily handle power distribution and digital control signal transmission, interconnected through precisely designed vias without mutual interference.

Core Performance Advantages

• 優れた信号の完全性: Rogers RO4350B material ensures low insertion loss and high signal transmission speed, perfectly meeting 5G communication requirements for high data rates.

• Excellent Temperature Stability: RO4350B features a high glass transition temperature (TG) and an exceptionally low Z-axis coefficient of thermal expansion (CTE), ensuring plated through-hole (PTH) reliability under extreme temperature variations and preventing barrel cracking.

• Optimized Power and Thermal Management: The asymmetric copper thickness design (1oz outer layers) facilitates heat dissipation from high-power components. RO4350B’s thermal conductivity, 約 0.69 W/m·k, exceeds that of standard FR4, effectively drawing heat away from hotspots.

• Mechanical and Process Compatibility: Unlike pure ceramic or PTFE materials, RO4350B is rigid and highly compatible with FR4 processing workflows, supporting conventional CNC drilling and copper deposition processes for volume production.

5. Manufacturing Process Flow

UGPCB employs a rigorously controlled process flow to ensure the quality of this mixed dielectric PCB:

1. Incoming Material Inspection: Strictly source original Rogers RO4350B laminates and grade A FR4 materials (such as SYTECH or equivalent), verifying Dk values and resin flow characteristics.

2. Inner Layer Circuitry (L2/L3): Apply dry film to 0.5oz inner layer copper, 続いて露出, 発達, and acid etching to form precision circuits.

3. Brown Oxide and Lamination: Critical process! Stack inner layer cores, プリプレグ, and outer layer RO4350B/copper foil according to construction specifications. Due to differing resin flow characteristics of RO4350B and FR4, stepped temperature profiles during lamination are essential to prevent delamination and voids.

4. 掘削: Utilize ultra-hard coated drill bits with optimized speed and feed rates to minimize wear from glass fiber and ceramic fillers in RO4350B material, ensuring smooth hole walls.

5. Electroless Copper and Panel Plating: Achieve interlayer interconnection and increase outer layer copper thickness to 1oz through pattern plating, with hole copper thickness meeting IPC Class 2/3 標準.

6. Outer Layer Circuitry: Fabricate precision RF microstrip or antenna traces on L1 and L4.

7. Solder Mask and Legend: Apply high-quality photosensitive solder mask ink to protect circuits and prevent signal leakage.

8. 表面仕上げ: イマージョンゴールド (同意する) プロセス. Apply a uniform chemical nickel-gold layer on pads for excellent solderability.

9. Profiling and Electrical Testing: CNC routing for final shape, に続く 100% flying probe testing or dedicated fixture testing, with special focus on インピーダンス制御 verification within specified tolerances.

6. 典型的なアプリケーションシナリオ

With its stable Dk value of 3.48 そして mixed dielectric construction, UGPCB’s product is primarily applied in the following high-frequency communication fields:

• ベースステーションアンテナ: 5G Massive MIMO antenna arrays, パワーアンプ

• 衛星通信: LNB (Low-Noise Block downconverters), GPS active antennas

• カーエレクトロニクス: 77GHzミリ波レーダー, in-vehicle infotainment high-frequency modules

• 産業管理: High-frequency data acquisition equipment, wireless bridge devices

• テストと測定: Internal high-frequency boards for network analyzers, RF probe cards

7. UGPCBを選択する理由?

• Precise Parameter Replication: We understand that data is critical. We commit to strict adherence to your プリント基板設計 documentation, ensuring RF performance aligns with simulation designs.

• Expert Hybrid Lamination Technology: With over a decade of experience in mixed dielectric board processing, we have mastered RO4350B and FR4 matching flow control techniques, eliminating process challenges such as delamination and warpage.

• Rapid Response and Service: Comprehensive support from PCB レイアウト review and impedance calculation to prototyping and small-batch production.

Ready to Elevate Your RF Design?

Partner with UGPCB as your most reliable 高周波プリント基板 manufacturing ally. Whether for 5G communications, レーダーシステム, or precision instrumentation, 私たちの Rogers RO4350BハイブリッドPCB delivers stable, 効率的, and cost-effective hardware support.

Please send the following specifications to our sales team:

• モデル: Rogers RO4350BハイブリッドPCB

• 量: [Your required quantity]

• 特別な要件: [例えば。, impedance trace tolerances, packaging preferences]

Contact UGPCB Experts: Request Quote | [電子メール: sales@ugpcb.com]