0.22mm 초박형 6층 HDI Rigid-Flex PCB 제조업체 | UGPCB

UGPCB’s 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB 제품개요

In the pursuit of extreme device miniaturization and high reliability, traditional rigid 인쇄 회로 기판 (PCB) are often insufficient. UGPCB combines advanced 고밀도 상호 연결 (HDI) 그리고 리지드 플렉스 technologies to present our flagship product: 그만큼 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB. This board is a pinnacle of PCB 제조 그리고 a high-performance interconnect solution engineered for wearable technology, advanced medical instruments, 항공우주, and premium consumer electronics. It seamlessly merges the stable support of rigid boards with the dynamic bending capability of flexible circuits, enabling complex electrical connections within minimal space.

제품 정의 & 과학적 분류

이것은 a입니다 high-layer-count PCB utilizing 모든 계층 HDI 그리고 rigid-flex construction. It can be accurately classified per industry standards:

• 구조 별: 리지드 플렉스 PCB – Laminates rigid and flexible circuit layers into a single unit.

• By Technology Level: 고급 HDI PCB – Employs laser drilling, filled vias, and microvias (<0.15mm) for superior routing density.

• 레이어 수에 의해: 6-Layer Circuit Board (comprising both rigid and flexible layers).

• 재료로: Specialty High-Performance Material PCB – Core build-up uses Panasonic RF-777 composite.

디자인 필수사항 & 작동 원리

디자인 필수사항: The key to a successful rigid-flex board design lies in the rigid-to-flex transition zone. Precise calculation of bend radius, stress relief, and routing in flex areas is critical to prevent cracking during dynamic flexing. 동시에, HDI blind and buried via design must coordinate with the stack-up structure to optimize signal integrity (그리고) and power integrity (PI).
작동 원리: 그만큼 PCB 구조 integrates rigid sections (for component mounting and mechanical support) with flexible sections (for 3D interconnection and movement) ~을 통해 다층 적층. Electrical signals travel through laser-drilled microvias 그리고 via filling plating technologies inherent to HDI 보드, achieving the shortest and most reliable paths between layers, which minimizes signal loss and crosstalk.

핵심 재료 & Superior Performance

• 핵심 자료: We utilize the industry-premium Panasonic RF-777 35/50 복합 재료. Renowned for its exceptional 치수 안정성, superior high-frequency performance, and excellent 내열, it is the ideal choice for manufacturing high-reliability rigid-flex circuit boards.

• 표면 마감: The board features a 2-micron Electroless Nickel Immersion Gold (동의하다) finish. This provides a flat surface, excellent solderability, and long-term oxidation resistance for PCB pads, making it perfect for mounting 미세 피치 부품 like BGAs.

• Key Performance Attributes:

  • Ultra-Thin 0.22mm Profile: Enables maximum compression of internal device space.

  • 높은 신뢰성: Undergoes rigorous PCB reliability testing, capable of withstanding millions of dynamic bend cycles.

  • Excellent Signal Transmission: HDI 디자인 and premium materials ensure low-loss transmission for high-speed signals.

  • High-Density Assembly: Provides an ideal platform for SMT 어셈블리, supporting miniaturized component layout.

구조 & 주요 특징

• PCB Structure: A typical 6-layer construction involving 2-4 layers of rigid FR-4 laminated with polyimide flexible cores. 그만큼 쌓이다 is meticulously engineered to balance stiffness and flexibility.

• 제품 기능:

  1. 3D Interconnection Freedom: Eliminates spatial constraints, enabling 3D assembly and reducing connectors and cables.

  2. 가벼운 중량 & 소형화: The extreme thinness directly reduces product weight and size.

  3. Enhanced System Reliability: Removes connection point failures, improving overall stability in vibrating or high-shock environments.

  4. Simplified Assembly Process: 로서 custom PCB 조립, it streamlines final product assembly, lowering labor costs.

정밀제조공정

UGPCB adheres to international quality standards like IPC-6013 (for flexible circuits) 그리고 IPC-2221/2223. 우리의 PCB 제조 공정 is precise and rigorous:

1. 레이저 드릴링: Creates micron-level blind and buried vias in flexible and core layers.

2. 홀 금속화 & 도금: Vias are made conductive through chemical deposition and plating, ~와 함께 via filling for planarization.

3. Pattern Transfer & 에칭: Forms the intricate circuit board traces.

4. 층 정렬 & 라미네이션: Rigid layers, 준비, and flexible layers are precisely aligned and bonded under high heat and pressure. This is the core step in rigid-flex PCB manufacturing.

5. 표면 마무리: 의 적용 동의하다 coating to protect pads and ensure solderability.

6. 엄격한 테스트: 포함 비행 프로브 테스트, 자동 광학 검사 (AOI), and reliability testing to ensure every board’s quality.

Wide-Ranging Application Scenarios

이것 advanced PCB is the core skeleton for innovative products in:

• 웨어러블 기술: 스마트워치, AR/VR glasses, health monitors, requiring comfort and constant flexing.

• Advanced Medical Electronics: Endoscopic capsules, hearing aids, portable monitors, demanding high reliability and miniaturization.

• 항공우주 & 방어: Satellite components, UAV flight control systems, needing extreme environment endurance and low weight.

• Precision Consumer Electronics: High-end smartphone camera modules, folding phone hinge areas, ultra-thin laptops.

• 산업용 & 자동차 전자: Compact sensors, robotic joint interconnection modules.

Contact a UGPCB PCB Technical Expert today for your 0.22mm Ultra-Thin HDI Rigid-Flex PCB solution! Make your product stand out in the competition for miniaturization and high performance.