A 6-Layer Rigid-Flex PCB is an advanced 인쇄 회로 기판 technology that integrally combines rigid board stability with flexible circuit dynamic bending capability. This product from UGPCB utilizes a premium adhesive-free lamination 프로세스, resulting in a final board thickness of 1.50mm, 차원 120x80mm, and features an 동의하다 (무전해 니켈 침지 금, 3μ”) 표면 마감. It represents a cutting-edge solution for 고밀도 상호 연결 (HDI) and three-dimensional electronic packaging, solving complex spatial and mechanical challenges in modern electronics.
과학적인 제품 분류
According to IPC-6013D standards and product construction, this board is accurately classified as:
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By Construction: Rigid-Flex Printed Board (유형 4)
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레이어 수에 의해: Six-Layer Board (combining rigid and flexible layers)
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기술 별: Adhesive-less (Adhesive-Free) Flexible Material Rigid-Flex PCB
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응용 프로그램에 의해: High-Reliability, High-Flex-Cycle Industrial & Medical Grade PCB
Core Structure & 재료
The exceptional performance is rooted in its sophisticated layered structure and top-tier materials:
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Core Flex Material: 특징 Shengyi’s 18/50/18 μm adhesive-free double-sided substrate. “18/50/18” denotes a structure of 1 온스 (18μm) 구리 / 50μm Polyimide (PI) 유전체 / 1 온스 (18μm) 구리. 그만큼 adhesive-free construction bonds copper to PI chemically, eliminating adhesive layers, which significantly enhances thermal resistance, 화학 저항, 그리고 flex circuit 신뢰할 수 있음.
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Rigid Section Material: 용도 25/25 준비 for lamination in rigid areas, providing robust mechanical support.
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표면 마감: The entire board employs 동의하다 (3μ”). This 3-microinch gold layer offers excellent flatness, 내산화성, and solderability for PCB pads, making it ideal for assembling 미세 피치 부품 like BGAs.
Design Key Considerations & 작동 원리
Rigid-flex PCB design is critical for success. The board operates by routing electrical signals through flexible polyimide areas for dynamic movement, while using rigid FR-4 sections for component mounting and structural support.
Essential Design Guidelines Include:
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Bend Area Definition: Clearly distinguish between static (one-time install) 그리고 dynamic (repeated operation) bend zones. Design the bend radius accordingly. A dynamic bend radius should be at least 10x the flex area thickness (for this board, ≥15mm is recommended).
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Transition Zone Reinforcement: The rigid-to-flex junction is a stress point. 사용 teardrop pads, curved traces, 그리고 stiffeners to prevent delamination and cracking.
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임피던스 제어: For high-speed signals (예를 들어, differential pairs) crossing flex areas, precisely calculate trace width and dielectric thickness to maintain consistent 특성 임피던스 (예를 들어, 50Ω 단일 종단, 100Ω 차동).
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Flex Routing Rules: In flexible areas, route conductors perpendicular to the bend axis. Use curved or staggered traces to distribute stress evenly.
성능 특성 & 장점
Compared to traditional adhesive-based rigid-flex PCBs or rigid-board+connector assemblies, this UGPCB product offers distinct PCB advantages:
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향상된 신뢰성: The adhesive-free structure prevents delamination risks from adhesive aging or moisture absorption, increasing flex life by up to 10x and withstands over 100,000 동적 벤드 사이클.
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Superior Electrical Performance: Uniform PI dielectric with stable dielectric constant (Dk~3.4) ensures signal integrity for high-frequency applications and reduces loss.
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가벼운 중량 & 고밀도: Eliminates connectors, 케이블, and solder joints, enabling 3D assembly. Can reduce system weight by up to 60% and save over 50% 공간.
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Excellent Durability: Resists extreme temperatures (-55°C ~ +125°C) and chemical exposure, 가혹한 환경에 적합합니다.
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Simplified Assembly: A single integrated component reduces assembly steps, potential failure points, and improves final product yield.
생산 공정 개요
UGPCB rigid-flex PCB manufacturing combines advanced rigid PCB fabrication 그리고 flexible circuit production 프로세스:
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Inner Layer Fabrication: Separate etching of rigid FR-4 and flexible PI core layers.
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라미네이션: Precise alignment and high-temperature/pressure bonding of rigid layers, adhesive-free flex cores, and prepreg into a monolithic structure—a critical step in 다층 PCB 처리.
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교련 & 도금: Mechanical and laser drilling (if needed) followed by copper deposition and plating to create Plated Through Holes (PTH) for interlayer connection.
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외부 레이어 이미징 & 에칭: Pattern formation for outer layer circuits.
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표면 마감 적용: ENIG chemical deposition.
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표지 & Profiling: Application of protective film (coverlay) on flex areas. 정밀한 라우팅 그리고 레이저 절단 define the board outline and flex section openings.
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Electrical Test & 최종검사: 100% 비행 프로브 or fixture testing for electrical continuity, followed by rigorous visual and dimensional inspection.
기본 응용 프로그램 & 사용 사례
이것 6-layer high-reliability PCB is the ideal choice for demanding applications:
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항공우주 & 방어: Satellite deployment mechanisms, 안내 시스템, avionics sensors requiring utmost reliability and weight reduction.
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Advanced Medical Devices: 내시경, ultrasound probes, wearable monitors needing complex motion and signal transmission in minimal space.
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Industrial Robotics: Robot joints, internal robotic arm assemblies for seamless power/signal transmission across moving parts.
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Precision Instruments & 가전제품: Advanced camera modules, foldable display hinges, drone gimbals pursuing slimness and durability.
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자동차 전자: Automated parking sensors, foldable dash displays, in-vehicle camera modules resistant to vibration and thermal cycling.
Ready to integrate superior reliability into your design? Contact UGPCB engineers today for a free design review and quote on your custom 6-Layer Rigid-Flex PCB solution.