eMMC PCB Package Substrate Product Overview
In today’s data-centric world, the performance and reliability of embedded storage are critical. EMMC (embedded MultiMediaCard) serves as the core storage unit in smartphones, 정제, IoT devices, and other consumer electronics. UGPCB, leveraging deep expertise in 고밀도 상호 연결 (HDI) PCB 제조, offers specialized eMMC Package Substrate PCBs. Designed with HL832NS material in a 4-layer, ultra-thin configuration, this substrate is the essential platform for high-speed, stable electrical interconnection between the memory controller, NAND flash dies, 그리고 메인보드. It is the optimal solution for developing next-generation compact, high-capacity storage modules.
What is an eMMC Package Substrate PCB?
An eMMC Package Substrate PCB 전문이다, miniaturized 인쇄 회로 기판 used internally within an eMMC chip package. It serves as the core interposer, providing the electrical connections and physical support between the storage controller silicon die, the NAND flash memory dies, and the external Ball Grid Array (BGA) 인터페이스. Its design and manufacturing quality directly determine the signal integrity, 열 성능, and overall reliability of the final eMMC module.

디자인 하이라이트 & 주요 기술 사양
To meet the stringent demands of eMMC chips for high bandwidth and miniaturization, UGPCB’s eMMC substrate focuses on these critical design parameters:
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High-Density Routing: Supports ultra-fine circuitry with minimum line width/space of 20µm.
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Micro-Via Capability: 특징 minimum via diameter of 0.1mm for high-density I/O fanout.
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Stable Lamination: 4-layer construction with a controlled total thickness of 0.21mm, balancing electrical performance and mechanical strength.
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High-Reliability Surface Finish: 소프트 골드 (동의하다) plating provides an oxidation-resistant, low-resistance surface for reliable wire bonding or flip-chip attachment.
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Precise Solder Mask: PSR-4000 AUS308 solder mask offers excellent insulation and chemical resistance.
작동 방식 & 구조적 특징
작동 방식: The substrate acts as the internal “nervous system” and “power grid” of the eMMC module. Its conductive traces and micro-vias route command signals from the controller to the NAND flash dies and return data. Dedicated power and ground planes ensure stable, low-noise power delivery.
구조적 특징:
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초박형 & 콤팩트: 0.21mm final thickness 그리고 11.5mm x 13mm unit size minimize space consumption.
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Advanced Core Material: Built on HL832NS, a high-performance laminate known for excellent thermal stability and low signal loss (낮은 Dk/Df), crucial for heat dissipation.
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Multi-Layer Architecture: 그만큼 4-layer stack-up (typically signal, 힘, 지면) optimizes signal paths, reduces crosstalk, and controls impedance.
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BGA Pad Array: The bottom side features a precise BGA pad layout for reliable surface-mount technology (SMT) assembly of the entire module onto the host motherboard.
Primary Application & 사용 사례
Primary Application: Core interconnection platform within EMMC 5.1 이상 chip packages.
일반적인 응용 프로그램 (사용 사례):
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스마트폰 & 정제: Primary internal storage.
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Smart TVs & Set-Top Boxes: System storage and caching.
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IoT 장치: 스마트워치, smart home hubs requiring compact embedded storage.
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산업 제어 시스템: Embedded devices demanding high data reliability.
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Automotive Infotainment: Storage modules meeting automotive-grade stability requirements.
분류 & 재료 구성
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분류: Can be categorized by application grade: 소비자, 산업용, and Automotive (this model is tailored for consumer & high-end industrial applications).
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Material Stack-Up:
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Core Laminate: HL832NS 높은 Tg, Low-Loss material.
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전도성 층: High-purity electrolytic copper foil.
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솔더 마스크: PSR-4000 AUS308 (녹색, matte/gloss optional).
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표면 마감: 무전해 니켈 침지 금 (ENIG – Soft Gold).
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Performance Advantages & 주요 특징
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탁월한 신호 무결성: Controlled impedance and low-loss HL832NS material ensure stable high-speed data transfer.
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높은 신뢰성: Stringent process controls and material selection guarantee long-term durability.
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Effective Thermal Management: The laminate’s good thermal conductivity aids in heat dissipation from the active dies.
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Tight Manufacturing Tolerances: 20µm line/space and 0.1mm micro-vias demonstrate 고급의 HDI PCB 조작 전문적 지식.
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End-to-End Solution: UGPCB provides collaborative support from substrate design review 그리고 PCB 제작 에게 빠른 PCBA 프로토 타이핑.
생산 공정 개요
Our eMMC Package Substrate manufacturing follows a stringent HDI PCB process flow:
Material Prep → Inner Layer Imaging → Lamination → Laser Drilling (0.1mm vias) → Via Metallization → Outer Layer Imaging (20µm lines) → Solder Mask Application (PSR-4000) → Surface Finishing (소프트 골드) → Electrical Testing → Routing/Scoring → Final Inspection & 포장.
Why Choose UGPCB for Your eMMC Package Substrate?
Choosing UGPCB means partnering with an expert in memory chip substrate manufacturing. We understand the technical evolution of storage interfaces and offer full-chain support to ensure your product excels in performance, 비용, 신뢰성.
Contact us today to discuss your eMMC Package Substrate requirements and request a quotation. Let UGPCB’s precision engineering be the reliable foundation for your next-generation storage solutions.