18-레이어 고성능 Megtron-7 PCB 제조업체 | 1.86mm 두께 | ENIG 2u”

In the era of high-speed data transfer and precision computing, the performance of the 인쇄 회로 기판 (PCB)—the core brain of electronic devices—determines the entire system’s capability. UGPCB introduces its high-performance 18-레이어 견고한 PCB 기반으로 Megtron-7 재료, engineered to meet the most demanding electrical and physical challenges, serving as the essential foundation for your next-generation advanced equipment.

1.18-Layer Megtron-7 Rigid PCB 제품개요 & 정의

This product is an 18-layer rigid high-layer count PCB with a precisely controlled thickness of 1.86mm and overall dimensions of 165mm x 120mm. It utilizes industry-leading Megtron-7 high-speed low-loss laminate and features a 2-microinch (대략. 0.05μm) 무전해 니켈 침지 금 (동의하다) 표면 마감. This specification represents an advanced tier in 고성능 PCB 제조, designed for applications where signal integrity, 열 관리, and reliability are paramount.

2. 중요한 설계 고려 사항

Designing a successful 18-layer PCB, especially with high-speed materials like Megtron-7, requires careful attention to several core aspects:

1. Stack-up Design: A rational layer stack-up is critical for impedance control and crosstalk reduction. A typical 18-layer stack includes multiple signal, 힘, and ground planes to ensure stable power distribution and clear signal return paths.

2. 임피던스 제어: High-speed signal transmission demands precise controlled impedance PCB 설계. Trace width and spacing must be calculated accurately based on the Dk (유전 상수) 및 Df (소산 인자) of Megtron-7. We offer professional impedance calculation and simulation services.

3. 열 관리: The 1.86mm board thickness and multi-layer structure necessitate effective thermal pathways in the design, such as using thermal vias to connect internal copper layers for efficient heat dissipation from components.

4. 고밀도 상호 연결 (HDI) Considerations: While this is a standard through-hole design, careful planning of via types (blind, 매장, through-hole) is essential at this layer count to minimize stub effects and optimize signal paths.

3. 작동 방식 & 구조

에이 다층 PCB functions like a highly integrated, three-dimensional “road network.” Electrical signals travel on copper traces (“roads”) on the surface and internal layers, with vertical connections between layers established through plated through-holes (“interchanges”). Dedicated power and ground planes provide stable voltage reference and noise shielding for the entire system. 이것 18-레이어 견고한 PCB is formed through a precise lamination process, bonding multiple core layers and prepreg sheets into a single, robust unit with excellent electrical properties. Its sophisticated PCB board structure is the foundation for implementing complex circuit functionalities.

4. 핵심 재료 & 주요 성과

• 사용된 재료:

  • 라미네이트: Megtron-7. This is a high-performance, low-loss copper-clad laminate from Panasonic, renowned for its stable dielectric constant (Dk ~3.3) and extremely low dissipation factor (Df ~0.001). It is optimized for applications above 10GHz and into millimeter-wave frequencies.

  • 구리 포일: Utilizes Very Low Profile (VLP) or Reverse Treated Foil (RTF) to minimize “skin effect” losses caused by signal transmission on rough copper surfaces.

  • 표면 마감: 무전해 니켈 침지 금 (동의하다, 2u”). Provides a flat surface, excellent solderability, a reliable contact interface (suitable for gold fingers), and long shelf life.

• Outstanding Performance:

  • 탁월한 신호 무결성 (그리고): Exceptionally low signal loss ensures high-speed pulse waveforms remain undistorted.

  • Excellent Power Integrity (PI): Multiple dedicated power and ground planes offer very low power distribution network impedance and superior decoupling.

  • 높은 신뢰성: The 1.86mm board thickness and premium materials deliver high mechanical strength, 내열, and long-term environmental stability.

  • Stable Impedance Control: Achieved through material consistency and precision manufacturing processes.

5. 제품 분류

According to industry and IPC standards, this product is accurately classified as:

1. 레이어 수에 의해: High-Layer Count PCB (typically defined as 10+ 레이어).

2. 재료 유형별: High-Speed High-Frequency PCB / 저손실 PCB.

3. 구조 별: 강성 PCB.

4. 기술 별: Controlled Impedance PCB, ENIG Finished PCB.

5. By Application Grade: Industrial Grade / Telecommunications Grade High-Performance PCB.

6. 주요 특징 & 이익

1. Premium Material: Built on Megtron-7 high-speed laminate, providing the physical basis for superior electrical performance.

2. High Complexity Capacity: 그만큼 18-layer circuit board design allows for extremely complex and dense circuit layouts.

3. 정밀가공: Strict tolerance control on the 1.86mm board thickness and consistent 2u” ENIG surface finish application.

4. Engineered for Speed: Optimized throughout—from design and material selection to processing—for 고속 디지털 회로 그리고 RF/microwave circuits.

7. 생산 공정 개요

그만큼 high-layer count PCB manufacturing process is highly precise: Material Cutting → Inner Layer Imaging & Etching → Automated Optical Inspection (AOI) → Lamination (Pressing multiple inner layer cores with prepreg) → Drilling → Hole Metallization (desmear, Electroless & Electrolytic Copper Plating) → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → Surface Finish (동의하다) → Profile Routing → Electrical Testing → Final Inspection. Each step requires stringent control, particularly layer-to-layer registration and impedance control.

8. 기본 응용 프로그램 & 사용 사례

이것 high-performance PCB board is the ideal choice for the following advanced applications:

• High-Speed Communication Equipment: Core motherboards for 400G/800G optical modules, 고급 라우터, 그리고 스위치.

• 고급 컴퓨팅 & 저장: Server motherboards, AI 가속기 카드, high-speed storage array (SSD) controller boards.

• Precision Test & 측정 장비: Internal core boards for high-end oscilloscopes, 스펙트럼 분석기, 및 신호 발생기.

• 항공우주 & Defense Electronics: Processing units within radar systems and satellite communication payloads.

• Advanced Medical Imaging Devices: High-speed data acquisition and processing boards for equipment like MRI and CT scanners.

Why Choose UGPCB for Your 18-Layer Megtron-7 PCBs?

We deliver more than just a 회로 기판; we provide a complete solution encompassing DFM (제조 가능성을위한 설계) 검토, 정밀 제조, 그리고 신뢰성 테스트. We possess deep expertise in every detail of 높은 레이어 수 PCB 제작, ensuring your design is translated into reality with the highest quality and reliability.

오늘 저희에게 연락하세요 for a free technical assessment and a competitive quote for your project. Let UGPCB be the robust foundation for your high-end product’s success.