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22-레이어 서버급 PCB 제조업체 | 제어된 깊이 드릴링을 갖춘 무거운 구리 PCB | UGPCB 전문가 솔루션

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Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, 인공지능, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server 인쇄 회로 기판 (PCB) is paramount. Leveraging deep technical expertise, UGPCB는 전문적인, customized, high-performance server PCB manufacturing and PCB (인쇄 회로 보드 어셈블리) one-stop solutions.

1. 제품개요 & 정의

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, 메모리, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, 전력 무결성, and thermal performance.

The specifications you provide (보드 두께: 2.8mm ±10%, 22 레이어, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, 고밀도, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

High-layer-count server PCB manufactured by UGPCB, installed inside a high-performance data center server

2. 디자인 필수사항 & Key Technologies

The success of such advanced PCB 디자인 hinges on mastering a range of cutting-edge technologies:

  1. 스택업 & 임피던스 제어: The complex 22-layer stack-up requires precise calculation to achieve strict 임피던스 제어 (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of 고속 PCB 설계.

  2. 후면 드릴링: This critical process removes the unused copper stub from high-speed signal vias (예를 들어, for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

  3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (Df) and stable dielectric constant (DK) ensure signal purity and low latency. A high Glass Transition Temperature (Tg >170℃) guarantees material reliability under the prolonged high-temperature operation of servers.

  4. RTF (Reverse Treated Foil) 구리: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

  5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (예를 들어, high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. 성능 & 구조적 특징

4. 생산 과정 & 품질 관리

UGPCB’s server PCB 생산 엄격한 기준을 따른다, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (동의하다) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, AOI (자동 광학 검사), 그리고 더, ensuring every delivered PCB meets design specifications.

5. 응용 시나리오 & Technical Classification

This high-performance server PCB is widely used in:

Scientific Classification:

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