
ITEQ IT-158 PCB Board Material
Key Performance Parameters & Technical Advantages
ITEQ IT-158 laminate emerges as a premier choice for high-end PCB manufacturing through exceptional technical specifications:
Thermal Reliability
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Tg: 155°C (ensures structural stability during lead-free soldering)
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T-288: >30 seconds at 288°C (superior thermal shock resistance)
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Td-5%: 345°C (prevents delamination in extreme conditions)
Mechanical Stability
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Z-axis CTE: 40ppm/°C (3.3% expansion from 50-260°C)
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Peel Strength: ≥8lb/inch (copper-clad bond integrity)
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Water Absorption: 0.08% (maintains electrical stability in 85% RH environments)
High-Frequency Signal Transmission Characteristics
Dielectric Performance at 10GHz
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Dk: 4.0 ±0.05
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Df: 0.018
*(Ideal for 5G/mmWave applications with 0.15dB/inch insertion loss reduction)*
Typical Application Scenarios
5G Communication Infrastructure
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Base station antennas
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Optical transceivers
Automotive Electronics
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ADAS radar systems (AEC-Q200 compatible)
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ECU control modules
Industrial Automation
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Servo drives (10,000hr MTBF at 105°C)
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Power inverters
Consumer Electronics
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Smartphone RF modules
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Laptop motherboard HDI designs
PCB Material Selection Workflow
Phase 1: Requirement Analysis
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Operating temperature range: Tmax +20°C margin
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Signal frequency threshold: ≥1GHz critical
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Environmental rating: IP67 compliance
Phase 2: Comparative Evaluation
Parameter | ITEQ IT-158 | Competitor A | Competitor B |
---|---|---|---|
Tg (°C) | 155 | 140 | 130 |
Df @10GHz | 0.018 | 0.025 | 0.032 |
UL Certification | 94V-0 | 94HB | 94V-1 |
Phase 3: Reliability Validation
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PCT Test: 121°C/100%RH/2atm ×96hr
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Thermal Stress: 3× solder dips @288°C
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CAF Resistance: IPC-TM-650 2.6.25 compliant
Design Optimization Strategies
Stackup Configuration
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Hybrid dielectric construction (≤5% thickness tolerance)
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Buried vias for thermal management
Impedance Control
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Microstrip line tolerance: ±10%
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Differential pair spacing: 3× dielectric height
Manufacturing Process
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Drilling: Back-drilling with ≤0.15mm stub
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Surface Finish: ENEPIG preferred (Ni:3-5μm, Au:0.05-0.1μm)

ITEQ IT-158 PCB Substrate Parameter Table