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ITEQ IT-158 PCB Laminate: Comprehensive Analysis of Properties, Applications & Selection Guide - UGPCB

PCB Material List

ITEQ IT-158 PCB Laminate: Comprehensive Analysis of Properties, Applications & Selection Guide

ITEQ IT-158 PCB Board Material

ITEQ IT-158 PCB Board Material

Key Performance Parameters & Technical Advantages

ITEQ IT-158 laminate emerges as a premier choice for high-end PCB manufacturing through exceptional technical specifications:

Thermal Reliability

  • Tg: 155°C (ensures structural stability during lead-free soldering)

  • T-288: >30 seconds at 288°C (superior thermal shock resistance)

  • Td-5%: 345°C (prevents delamination in extreme conditions)

Mechanical Stability

  • Z-axis CTE: 40ppm/°C (3.3% expansion from 50-260°C)

  • Peel Strength: ≥8lb/inch (copper-clad bond integrity)

  • Water Absorption: 0.08% (maintains electrical stability in 85% RH environments)

Featured Image: Cross-sectional SEM Micrograph of IT-158 Laminate Structure

High-Frequency Signal Transmission Characteristics

Dielectric Performance at 10GHz

  • Dk: 4.0 ±0.05

  • Df: 0.018
    *(Ideal for 5G/mmWave applications with 0.15dB/inch insertion loss reduction)*

Typical Application Scenarios

5G Communication Infrastructure

  • Base station antennas

  • Optical transceivers

Automotive Electronics

  • ADAS radar systems (AEC-Q200 compatible)

  • ECU control modules

Industrial Automation

  • Servo drives (10,000hr MTBF at 105°C)

  • Power inverters

Consumer Electronics

  • Smartphone RF modules

  • Laptop motherboard HDI designs

PCB Material Selection Workflow

Phase 1: Requirement Analysis

  • Operating temperature range: Tmax +20°C margin

  • Signal frequency threshold: ≥1GHz critical

  • Environmental rating: IP67 compliance

Phase 2: Comparative Evaluation

Parameter ITEQ IT-158 Competitor A Competitor B
Tg (°C) 155 140 130
Df @10GHz 0.018 0.025 0.032
UL Certification 94V-0 94HB 94V-1

Phase 3: Reliability Validation

  1. PCT Test: 121°C/100%RH/2atm ×96hr

  2. Thermal Stress: 3× solder dips @288°C

  3. CAF Resistance: IPC-TM-650 2.6.25 compliant

Design Optimization Strategies

Stackup Configuration

  • Hybrid dielectric construction (≤5% thickness tolerance)

  • Buried vias for thermal management

Impedance Control

  • Microstrip line tolerance: ±10%

  • Differential pair spacing: 3× dielectric height

Manufacturing Process

  • Drilling: Back-drilling with ≤0.15mm stub

  • Surface Finish: ENEPIG preferred (Ni:3-5μm, Au:0.05-0.1μm)

ITEQ IT-158 PCB Substrate Parameter Table

ITEQ IT-158 PCB Substrate Parameter Table

 

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