F4BT-1/2: A Micro Dispersed Ceramic PTFE Composite
Introduction to F4BT-1/2
F4BT-1/2 is a micro dispersed ceramic PTFE composite featuring woven fiberglass reinforcement. هذا المنتج, developed through scientific formulation and strict technological processes, surpasses traditional PTFE copper clad laminates with its higher dielectric constant, catering to the design and manufacturing requirements of circuit miniaturization. Its enhanced performance is attributed to the incorporation of ceramic powder.
Thermal Expansion and Heat Dissipation
F4BT-1/2 boasts a low Z-axis coefficient of thermal expansion, ensuring excellent reliability for plated through-holes. بالإضافة إلى ذلك, its high thermal conductivity facilitates efficient heat dissipation in electronic devices.
Technical Specifications of F4BT-1/2
المظهر والأنواع
The appearance of F4BT-1/2 meets the specifications required by National and Military Standards for microwave PCB baseplates. Available types include F4BT294 and F4BT600, each designed to cater to specific application needs.
ثابت العزل الكهربائي والأبعاد
- ثابت العزل الكهربائي: The material offers a dielectric constant of 2.94 for F4BT294 and 6.0 for F4BT600, suitable for various high-frequency applications.
- أبعاد: Standard dimensions are 500600 مم و 430430 مم, with custom sizes available upon request.
سمك والتسامح
- خيارات سمك: يتراوح من 0.25 مم ل 4.0 مم, accommodating diverse design requirements.
- تسامح: ±0.02 mm to ±0.07 mm depending on thickness, ensuring precision in manufacturing.
القوة الميكانيكية
- الاعوجاج: Maximum warp values vary with thickness, demonstrating excellent dimensional stability.
- القطع/اللكم: Ensures clean cuts without burrs, with minimum space between punching holes ranging from 0.55 مم ل 1.10 مم, preventing delamination.
- قوة التقشير: Maintains robust adhesion, with normal state peel strength ≥17 N/cm and post-thermal stress peel strength ≥14 N/cm.
الخصائص الكيميائية والكهربائية
- الملكية الكيميائية: Suitable for chemical etching without altering dielectric properties; capable of through-hole plating with a Hot Air Level temperature limit of 263°C.
- الملكية الكهربائية: Exhibits high density, امتصاص رطوبة منخفضة, نطاق درجة حرارة التشغيل واسعة, favorable thermal conductivity, CTE, المقاومة السطحية, مقاومة الحجم, pin resistance, and high dielectric breakdown voltage.
This comprehensive overview highlights the superior characteristics of F4BT-1/2, making it an ideal choice for advanced electronic applications demanding high performance and reliability.
