شعار UGPCB
Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, good PCB processability, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRAM, AP, PA, Dual CM, Fingerprint, and RF Module.
Specifications of SI10U
| Items | Conditions | وحدة | SI10U(S) |
|---|---|---|---|
| تيراغرام | DMA | درجة مئوية | 280 |
| TD | 5% wt. loss | درجة مئوية | >400 |
| CTE (X/Y-axis) | Before Tg | جزء في المليون/درجة مئوية | 10 |
| CTE (Z-axis) | α1/α2 | جزء في المليون/درجة مئوية | 25/135 |
| ثابت العزل الكهربائي (1GHz) | – | – | 2.5.5.9 |
| عامل التبديد (1GHz) | – | – | 2.5.5.9 |
| قوة التقشير | 1/3 أوقية, VLP Cu | ن / مم | 0.80 |
| Solder Dipping | @288 degree Celsius | دقيقة | >=30 |
| Young’s Modulus | 50 درجة مئوية | GPa | 26 |
| Young’s Modulus | 200 درجة مئوية | GPa | 23 |
| Flexural Modulus (50 درجة مئوية) | GPa | 32 | |
| Flexural Modulus (200 درجة مئوية) | GPa | 27 | |
| امتصاص الماء (أ) | % | 0.14 | |
| امتصاص الماء (85 degree Celsius/85%RH,168Hr) | % | 0.35 | |
| Flammability | UL-94 Rating | V-0 | |
| الموصلية الحرارية | ث/(m.K) | 0.61 | |
| لون | – | أسود |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
