High-Reliability 8-Layer Heavy Copper PCB | 2.0mm Thick FR-4 TG170

High-Reliability 8-Layer Rigid PCB Descripción general del producto & Definición

In the realm of high-speed, high-density electronic design, multilayer PCBs (Placas de circuito impreso) are indispensable. UGPCB 8-PCB rígido de capa, built with a substantial 2.0mm board thickness y 3OZ heavy copper foil, is engineered to withstand demanding electrical and physical environments. It serves not only as the foundation for electrical connectivity but as a critical component ensuring device stability and enhanced product reliability. For applications in industrial controls, power systems, or automotive electronics, this high-specification board is the optimal solution for complex, high-performance designs.

Especificaciones principales

• Recuento de capas: 8-PCB rígido de capa

• Finished Board Thickness: 2.0mm ±10%

• Materia prima: FR-4, Temperatura de transición vítrea (tg) ≥ 170°C

• Acabado superficial: Nivelación de soldadura por aire caliente sin plomo (HASL-LF)

• Peso del cobre: 3 onzas por pie cuadrado (≈105μm) for both inner and outer layers

• Máscara de soldadura & Platina: Green LPI Solder Mask, White Silkscreen Legend

Consideraciones críticas de diseño

When designing with this high-specification PCB, engineers must prioritize:

1. Gestión Térmica: Leverage the high current-carrying capacity of 3OZ heavy copper to optimize power and ground planes, reducing impedance and heat rise. Use thermal simulation in conjunction with the high heat resistance of FR-4 TG170 material.

2. Control de impedancia & Integridad de señal: The 8-layer stack-up allows effective separation of signal, fuerza, and ground layers. Precise calculation and control of trace impedance (p.ej., 50Ω single-ended, 100Ω differential) is essential to minimize reflection and crosstalk.

3. Mecánico & Electrical Reliability: El 2.0mm thick board enhances overall rigidity, suitable for applications with vibration or insertion stress. For high-voltage or high-current nodes, adjust trace width and clearance according to IPC-2221 standards and the 3OZ copper weight to ensure safety margins.

4. DFM (Diseño para la fabricación): Collaborate with UGPCB’s engineering team early to address specific requirements for heavy copper PCB y thick board PCB tratamiento, such as drilling parameters and plating uniformity, ensuring a high-yield manufacturing process.

How It Works & Estructura

An 8-PCB de capa is fabricated by laminating multiple conductive layers into a single unit using precise processes including inner-layer imaging, laminación, perforación, and plating. Electrical connections between layers are established via plated through-holes (PTH), blind vias, or buried vias. A typical stack-up example is:

Capa superior (Señal) — Prepreg — L2 (Suelo) — Core — L3 (Señal) — Core — L4 (Fuerza) — Core — L5 (Señal) — Prepreg — Bottom Layer (Señal)

This “sandwich” structure effectively isolates high-speed signals, provides solid reference planes, and ensures efficient power distribution.

Actuación & Características clave

1. Superior Electrical Performance: 3OZ heavy copper provides extremely low conductor resistance and excellent current-carrying capacity (over 3x that of standard 1OZ copper), reducing power loss and voltage drop.

2. Exceptional Thermal Reliability: FR-4 TG170 high Tg material withstands higher operating and soldering temperatures. Combined with the thermal conductivity of heavy copper, it significantly improves long-term reliability in high-temperature environments.

3. Enhanced Mechanical Stability: El 2.0mm thick board combined with rigid FR-4 offers superior resistance to bending and vibration, ideal for harsh operating conditions.

4. High Solder Joint Reliability: El HASL-LF surface finish provides a flat, coplanar pad surface with excellent solderability and extended shelf life, compliant with RoHS directives.

5. Interconexión de alta densidad (IDH) Capability: The 8-layer design offers ample routing space for complex circuits, facilitating device miniaturization and functional integration.

Production Process Overview

Engineering Review → Material Cutting (FR-4 TG170) → Inner Layer Imaging & Aguafuerte (3ONZ) → Oxide Treatment & Lamination → Mechanical Drilling & Copper Plating → Outer Layer Patterning & Enchapado (to 3OZ) → Solder Mask Application (Green LPI) & Platina (Blanco) → Lead-Free HASL Surface Finish → Electrical Testing & Inspección final (per IPC standards)

Each stage incorporates stringent quality control checkpoints to ensure every high-reliability multilayer PCB meets exact customer specifications.

Aplicaciones primarias & Casos de uso

This PCB is designed for high-power, high-stability applications:

• Industrial Control Systems: PLC, unidades de motor, and industrial power supplies requiring heavy copper PCBs for high current.

• Energía renovable & Power Systems: Solar inverters, UPS systems, and EV charging modules relying on high current capacity and thermal endurance.

• Electrónica automotriz: On-Board Chargers (OBC), Battery Management Systems (Bms), and DC-DC converters, dónde high Tg PCBs are essential for under-hood temperatures.

• Telecommunications Infrastructure: Base station power amplifier units and network backup power systems.

• High-End Test & Equipo de medición: Instruments requiring stable power delivery and low-noise performance.

Product Classification (Per IPC Standards)

1. Por recuento de capas: PCB multicapa (>4 capas), specifically an 8-layer circuit board.

2. By Rigidity: PCB rígido.

3. Por material base: FR-4 PCB, subset: PCB TG alto (Tg ≥ 170°C).

4. By Special Process: PCB de cobre pesado (per IPC-2152), Thick Board PCB.

5. By Application Class: Adecuado para Clase IPC 2 (Dedicated Service Electronic Products) y Clase 3 (High-Reliability Electronic Products) aplicaciones, incluido Industrial Grade PCB, Power Electronics PCB, y Automotive Grade PCB.