UGPCB

22-Fabricante de PCB de nivel de servidor de capa | PCB de cobre pesado con perforación de profundidad controlada | Soluciones expertas de UGPCB

ultimin

Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions

In today’s rapidly evolving landscape of data centers, inteligencia artificial, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server Placas de circuito impreso (PCB) is paramount. Leveraging deep technical expertise, UGPCB provides professional, customized, high-performance server PCB manufacturing and tarjeta de circuito impreso (Conjunto de placa de circuito impreso) one-stop solutions.

1. Descripción general del producto & Definición

A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, memoria, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, integridad del poder, and thermal performance.

The specifications you provide (Grosor del tablero: 2.8mm ±10%, 22 capas, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, alta densidad, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.

High-layer-count server PCB manufactured by UGPCB, installed inside a high-performance data center server

2. Design Essentials & Key Technologies

The success of such advanced Diseños de PCB hinges on mastering a range of cutting-edge technologies:

  1. Stack-up & Control de impedancia: The complex 22-layer stack-up requires precise calculation to achieve strict control de impedancia (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of Diseño de PCB de alta velocidad.

  2. Perforación trasera: This critical process removes the unused copper stub from high-speed signal vias (p.ej., for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.

  3. High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (df) and stable dielectric constant (Dk) ensure signal purity and low latency. A high Glass Transition Temperature (tg >170°C) guarantees material reliability under the prolonged high-temperature operation of servers.

  4. RTF (Reverse Treated Foil) Cobre: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.

  5. Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (p.ej., high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.

3. Actuación & Características estructurales

4. Proceso de producción & Control de calidad

UGPCB’s server producción de PCB follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (ACEPTAR) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, AOI (Inspección óptica automatizada), y más, ensuring every delivered PCB meets design specifications.

5. Escenarios de aplicación & Technical Classification

This high-performance server PCB is widely used in:

Scientific Classification:

Exit mobile version