6-Layer High-Frequency Hybrid PCB | Core Blind/Buried Vias & Relleno de resina | UGPCB Advanced Manufacturing

Professional Definition: What is a 6-Layer High-Frequency Hybrid PCB?

In the fields of 5G communications, radar automotriz, and high-end computing, estándar FR-4 PCBs often fall short in meeting the demands for high-frequency, de alta velocidad, and high-stability signal transmission. This is where the De alta frecuencia PCB híbrido becomes critical.

A 6-layer high-frequency hybrid PCB is a multilayer circuit board that integrates different performance-grade high-frequency laminate materiales (such as Rogers) with standard or specialized materials through precision lamination. Este hybrid construction strategically places materials to optimize electrical, térmico, and cost performance across different circuit layers. It serves as the core hardware foundation for complex RF microwave circuits and high-speed digital designs.

Product Deep Dive: UGPCB’s High-Performance 6-Layer Hybrid Board

1. Especificaciones principales & Ciencia material

• Capa & Construcción: 6 capas. This represents an optimal balance between complexity, actuación, y costo, suitable for integrating digital control and RF front-end circuits.

• Material Stack-up (Hybrid Core): Rogers 4350B + Rogers 4450F + IT180A. This is the essence of the design.

  • Rogers 4350b: An industry-standard high-frequency circuit board material known for its stable Constante dieléctrica (Dk) and low Factor de disipación (df), making it ideal for RF signal layers.

  • Rogers 4450F: A prepreg (PÁGINAS) with high glass transition temperature (tg) and excellent thermal stability, used for bonding layers and ensuring reliability of the hybrid stack-up under thermal stress.

  • IT180A: A high-performance, mid-loss thermoset material often used for inner signal or power plane layers where good signal integrity is required at a managed cost. This hybrid approach applies the best material where it’s needed most.

• Espesor & Peso del cobre: Estándar 1.6milímetros thickness for good mechanical rigidity. Copper weight is 1/H/H/H/H/1 oz, indicating 1 oz copper foil for outer layers y 0.5 onz (H oz) copper for inner layers. This facilitates fine-line etching and optimized impedance control.

• Acabado superficial: Níquel electrozados con electricidad de oro de paladio (ENÉPICO): 120 μin Ni, 2 μin Pd, 2 μin Au. This is a premium finish offering excellent solderability, wire-bond capability, and corrosion resistance. It is particularly suited for sustratos CI and assemblies requiring multiple reflow cycles or gold wire bonding.

2. Consideraciones de diseño & Principio operativo

• Consideraciones de diseño:

  1. Control de impedancia & Integridad de señal: Utilizing the stable Dk of Rogers materials, combined with precise stack-up design and trace width/spacing control, enables tight PCB impedance control (p.ej., 50Ω single-ended, 100Ω differential), which is crucial for high-speed PCB signal integrity.

  2. Stack-up Planning: High-speed RF traces are typically routed on the Rogers material layers, while power, suelo, and lower-frequency digital signals are placed on IT180A layers. A symmetrical stack-up (as in this design) helps prevent warpage.

  3. Gestión Térmica: The superior thermal conductivity of Rogers materials, combined with strategic ground vias and thermal relief designs, aids in dissipating heat from high-power RF components.

• Principio operativo: This PCB acts as the “skeleton” and “highway system” of an electronic device. Its core function is to mount and interconnect components (RF chips, CPU, condensadores, etc.). High-frequency signals travel via PCB de microondas transmission lines on the Rogers layers with minimal loss and distortion; power is distributed stably through inner-layer copper planes; and complex interconnections are achieved via blind and buried vias, shortening paths and enhancing electrical performance.

3. Four Advanced Processes: Ensuring Reliability & Actuación

1. Core Blind/Buried Vias: These vias connect adjacent layers within a core (p.ej., Rogers laminate) without penetrating the entire board. This significantly increases routing density in Interconexión de alta densidad (IDH) PCB, reduces parasitic effects, and improves high-frequency performance.

2. Resin Filled Vias: After plating, through-holes or blind/buried vias are filled with epoxy resin. This prevents chemical entrapment, provides a flat surface for fine-line patterning of subsequent layers, and enhances via reliability.

3. A través de (VIP): A via is placed directly within a component pad, then filled and planarized with resin and copper. This is a hallmark of advanced PCB HDI, enabling further miniaturization and higher component density.

4. Metalized Edge (Edge Plating): A continuous metal layer (typically copper) is plated along the board edge. This provides excellent EMI shielding, protects internal circuits, and strengthens the edge for connector mating and mechanical wear.

4. Key Performance Characteristics

• Superior High-Frequency Performance: Low loss, stable Dk for pristine signal transmission in PCB de RF.

• Excelente integridad de la señal: Precision impedance control meets Diseño de PCB de alta velocidad requisitos.

• Interconexión de alta densidad (IDH): Blind/buried vias and VIP technology support PCB de alta densidad layouts.

• Confiabilidad mejorada: Robust hybrid construction, ENEPIG finish, and metalized edges suit demanding environments.

• Improved Thermal & Shielding Performance: Good thermal conductivity and effective EMI suppression.

5. Scientific Classification

• Por recuento de capas: PCB multicapa

• By Material Type: Híbrido / Mixed Material PCB

• By Technology: Advanced HDI PCB

• Por aplicación: RF Microwave PCB / High-Speed Digital PCB

6. Standard Production Flow

Engineering Design → Material Prep & Shearing → Rogers Material Laser Drilling (Vías ciegas) → Desmear & Metallization → Inner Layer Imaging & Etching → Core Lamination (Hybrid Bonding) → Mechanical Drilling → Relleno de resina & Curing → Outer Layer Imaging → ENEPIG Surface Finish → Metalized Edge Plating → Solder Mask & Silkscreen → Electrical Test & Inspección final.

7. Aplicaciones primarias (Casos de uso)

This product is ideal for high-reliability electronic projects with stringent demands:

• 5G Communication Infrastructure: PCB de RF within AAUs (Active Antenna Units) and remote radio units.

• Electrónica automotriz: Radar PCBs for ADAS and autonomous vehicles (p.ej., 77GHz radar).

• Aeroespacial & Defense: High-Reliability PCBs in radar systems, comunicaciones por satélite, and EW equipment.

• High-End Test & Medición: Core boards for network analyzers and spectrum analyzers.

• Informática de alto rendimiento & Centros de datos: Backplanes or motherboards for high-speed servers/switches.

Why Choose UGPCB for Your 6-Layer High-Frequency Hybrid PCB?

In advanced fabricación de PCB, consistency and attention to detail determine success. UGPCB possesses deep expertise across the entire complex process chain—from Rogers material processing y laser drilling a resin filling y ENEPIG plating. We deliver not just boards that meet specifications, but robust PCB solutions that ensure your product’s successful volume production.

Contact us today for dedicated technical support and a competitive quote for your 5G PCB, automotive radar PCB, o high-frequency module PCB project. Let UGPCB be your trusted partner for de alta frecuencia, high-speed PCB fabrication.