TG150 PCB | High-Tg 4-Layer Immersion Gold Circuit Board | 0.08mm Fine Line Specialist

TG150 PCB Circuit Board Introducción: Meeting the Thermal Challenge in Modern Electronics

In high-speed communications, automotor, aeroespacial, and advanced industrial controls, electronic devices face increasingly harsh operating environments. Elevated temperatures can cause standard PCB substrates (p.ej., standard FR-4) to reach their glass transition, leading to softening, deformation, and critical performance loss, jeopardizing system reliability. Selecting a high-Tg placa de circuito impreso is essential for ensuring long-term stability in these demanding applications.

1. Descripción general del producto: What is a TG150 PCB?

A TG150 PCB is a placa de circuito impreso fabricated using a laminate material with a glass transition temperature (tg) de 150°C. The Tg is a crucial metric for a PCB substrate’s thermal endurance. Compared to common TG130 PCB laminates, TG150 material maintains superior physical rigidity and stable electrical properties under high temperatures. UGPCB 4-layer TG150 circuit board combines this high-performance material with an Oro de inmersión (ACEPTAR) acabado superficial and supports 0.08mm fine-line circuitry y 0.2mm micro-drilling, making it a high-reliability PCB multicapa solution for advanced applications.

2. Core Material and Enhanced Performance of TG150 PCB

• Materia prima: A high-performance epoxy or modified FR-4 formulation, specially engineered to consistently achieve a Tg of 150°C or higher.

• Key Performance Advantages (VS. TG130 PCBs):

  • Exceptional Thermal Stability: The increase from 130°C to 150°C Tg significantly enhances the board’s resistance to deformation at high temperatures, improving its ability to withstand high-temperature assembly processes like lead-free soldering.

  • Superior Moisture and Chemical Resistance: A denser molecular structure reduces moisture absorption in humid environments, minimizing losses in insulation resistance (Y) e integridad de la señal, while offering better resistance to chemical exposure.

  • Improved Mechanical Strength and Dimensional Stability: High Tg PCBs exhibit lower Z-axis expansion coefficients and stronger bond strength during thermal cycling, reducing risks like via cracking and delamination.

  • Stable Electrical Characteristics: Constante dieléctrica (Dk) y factor de disipación (df) remain more stable at elevated operating temperatures, ensuring higher signal integrity for PCB de alta frecuencia.

3. Structure and Design Specifications of Our TG150 PCB

PCB Stack-up

This product is a standard 4-capa placa PCB. A typical stack-up is Signal Layer – Ground Plane – Power Plane – Signal Layer, providing a complete return path for high-speed signals and effective EMI control.

Key Design Capabilities & Presupuesto

Minimum Trace Width/Space: 0.08milímetros / 0.1milímetros. This represents advanced fine-line fabricación de PCB capability, essential for routing high-density ICs (p.ej., BGA packages).

Drill Diameter: 0.2milímetros. Soporte micro-via drilling, facilitating higher density interconnects and saving board space.

Acabado superficial: Oro de inmersión (ACEPTAR). Provides a flat surface, excellent solderability, and long shelf life, ideal para componentes de paso fino (p.ej., MFP, BGA).

4. Manufacturing Process and Quality Control

UGPCB TG150 PCB manufacturing process strictly adheres to international standards like IPC-6012 (Qualification and Performance Specification for Rigid PCBs). The process includes:
Material Preparation → Inner Layer Imaging → Etching → Lamination → Drilling (0.2milímetros) → Desmear & Plating → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing → Electrical Testing → Final Inspection.
At each stage, we employ advanced equipment (p.ej., LDI imaging, inspección AOI) and rigorous reliability testing (p.ej., estrés térmico, ionic contamination) to ensure the quality of every high-Tg circuit board.

5. Product Classification and Typical Applications

1. Clasificación Técnica:

   • By Tg: Mid-High Tg PCB (Tg ≥ 150°C).

   • Por recuento de capas: PCB multicapa (4-Layer Board).

   • Por tecnología: Precision PCB (IDH-ready capability).

   • By Finish: ENIG PCB, Fine-Line PCB.

2. Ideal Application Scenarios:

   • Electrónica automotriz: Engine Control Units (CUBRIR), sistemas de infoentretenimiento, power management modules – requiring tolerance under-hood temperatures.

   • Telecommunications Equipment: 5G base station PAs, optical modules, network switches – where high power generates sustained heat.

   • Controles industriales: Servo drives, PLC, industrial PCs – for reliable operation in hot factory environments.

   • Electrónica de potencia: High-power switch-mode power supplies (SMPS), inverters – where power components generate significant heat.

   • Aeroespacial & Defense: Electronic systems with extreme demands for reliability and environmental resilience.

6. Why Choose UGPCB for Your TG150 PCBs?

• Materiales certificados: We use verified, traceable TG150 PCB laminates from reputable suppliers.

• Precision Manufacturing: Our expertise in multilayer PCB fabrication y ENIG processing ensures high yield for 0.08mm fine-line designs.

• Guaranteed Specifications: All technical parameters (Tg 150°C, 0.2mm drills) are rigorously validated against datasheets.

• Soporte de extremo a extremo: We provide full technical support from diseño de PCB revisar y control de impedancia to rapid prototyping and volume production.

7. Tomar medidas: Secure Your Design with a Robust Foundation

Don’t let thermal limitations hinder your product innovation. Choosing UGPCB’s high-reliability TG150 PCB means investing in exceptional stability, durabilidad, y rendimiento.

Llamado a la acción

*(Sugerencia de imagen: High-quality close-up photo of a populated TG150 PCB used in a telecom orautomotive application.)*
todo toma: High-density assembled 4-layer TG150 PCB with ENIG finish for automotive or telecom applications

Is your next project facing thermal reliability challenges?
Do you need a PCB that can withstand rigorous environmental stress?

Contact the UGPCB expert team today!
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