12L 2+N+2 HDI PCB Manufacturer | High-Density 12-Layer PCB

What is a 12L 2+N+2 HDI PCB?

A 12L 2+N+2 HDI PCB refers to a twelve-layer Interconnessione ad alta densità (ISU) circuito stampato, featuring two core layers flanked by N signal layers and another two core layers. This configuration allows for high density interconnections, making it suitable for advanced electronic applications. The “2+N+2” designation indicates the arrangement of the core and signal layers.

Considerazioni di progettazione

Designing a 12L 2+N+2 HDI PCB involves several critical factors:

• Stacking strato: Proper alignment of the core and signal layers to ensure optimal electrical performance.
• Traccia e spazio: Minimal trace width and space of 3mil/3mil to accommodate fine features.
• Hole Sizes: Mechanical holes as small as 0.2mm and laser holes down to 0.1mm for precise component placement.
• Spessore del rame: Varied copper thickness with inner layers at 1OZ and outer layers at 0.5OZ to balance conductivity and flexibility.

Come funziona?

The functionality of a 12L 2+N+2 PCB HDI relies on its multilayer structure and the use of high-density interconnects. Each layer serves a specific purpose:

• Core Layers: Provide structural integrity and act as the foundation for signal layers.
• Signal Layers: Carry electrical signals between components.
• Trattamento superficiale: Immersion gold plus OSP ensures excellent solderability and long-term reliability by preventing oxidation.

Applications and Classifications

Questi PCB are primarily used in intelligent digital products where compact size and high performance are crucial. They can be classified based on their complexity and the number of layers, with the 12L 2+N+2 configuration being highly versatile for various applications.

Materials and Performance

Constructed from FR-4 ITEQ, these PCBs offer excellent thermal stability and mechanical strength. The blue/white color scheme aids in visual inspection and troubleshooting. The finished thickness of 1.6mm provides a robust yet flexible board suitable for intricate designs.

Struttura e caratteristiche

The unique structure of a 12L 2+N+2 HDI PCB includes:

• Twelve Layers: Two core layers, N signal layers, and another two core layers.
• High Density Interconnects: Allow for complex routing and minimal space usage.
• Trattamento superficiale: Immersion gold plus OSP enhances conductivity and protects against corrosion.

Processo di produzione

The manufacturing process involves several sophisticated steps:

1. Preparazione del materiale: Selecting high-quality FR-4 substrate and copper foils.
2. Stacking strato: Arranging the layers in a precise order to achieve the desired “2+N+2” configuration.
3. Bonding: Using heat and pressure to bond the layers together.
4. Incisione: Applying etchant to remove excess copper, leaving only the desired conductive paths.
5. Placcatura: Adding a thin layer of metal to improve conductivity and solderability.
6. Trattamento superficiale: Applying immersion gold plus OSP to protect against oxidation and enhance solderability.
7. Controllo di qualità: Conducting thorough inspections and tests to ensure each board meets stringent quality standards.

Casi d'uso e scenari

12L 2+N+2 HDI PCBs are ideal for use in intelligent digital products where miniaturization and high performance are critical. Le applicazioni comuni includono:

• Smartphone: Enabling slimmer designs without compromising on functionality or performance.
• Compresse: Providing reliable connectivity for high-speed data transfer and processing.
• Dispositivi indossabili: Supporting compact designs while maintaining robust performance and durability.
• Portable Media Players: Ensuring high-quality audio and video processing capabilities in a small form factor.

Insomma, the 12L 2+N+2 HDI PCB represents a pinnacle of innovation in PCB technology, offering unmatched density, prestazione, and reliability for the most demanding consumer electronic applications.