Panoramica del prodotto
UGPCB introduce il 6‑layer 2+N+2 HDI PCB (Modello: 6Scheda elettronica L 2+N+2 HDI). This high‑density interconnect circuito stampato is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, E 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, moduli ottici, e applicazioni simili.
Nel PCB industria, ISU (Interconnessione ad alta densità) technology is the core enabler for shrinking component pitches and rising signal speeds. IL 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, Integrità del segnale, e costo di produzione.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC‑2226 standard and is classified asTipo III within that system.
Breaking down the term:
- IL first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, i.e., two inner core layers).
- IL second “2” means two sequential build‑up layers below the core.
Così, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
HDI Classification per IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| HDI Type | Struttura | Build‑up Layers (per lato) | Minimum BGA Pitch | Applicazioni tipiche |
|---|---|---|---|---|
| Tipo I. | 1+N+1 | 1 strato | 0.5mm | Smartphone, mid‑density designs |
| Type II/III | 2+N+2 | 2 strati | 0.4mm | Attrezzatura di networking, high‑performance computing |
| Tipo III / ELIC | 3+N+3 and above | 3+ strati | 0.3mm and below | Flagship smartphones, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered configurazioni.
Specifiche tecniche principali
| Parametro | Specifica |
|---|---|
| Modello | 6Scheda elettronica L 2+N+2 HDI |
| Materiale | ITEQ IT150 |
| Conta dei strati | 6 strati (2+N+2 second‑order HDI) |
| Colore maschera di saldatura | Black or White (opzionale) |
| Spessore del pannello finito | 1.0mm |
| Spessore del rame dello strato interno | 1 OZ (~35μm) |
| Spessore del rame dello strato esterno | 0.5 OZ (~17.5μm) |
| Traccia minima / Spaziatura | 2.5mil / 2.5mil (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2mm |
| Minimum Laser Drill | 0.1mm |
| Finitura superficiale | Oro ad immersione + OSP |
| Applicazione primaria | Attrezzatura di comunicazione |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 è un medium‑Tg, halogen‑free, multifunctional epoxy laminato. It sits between standard FR‑4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (Tg >150° C di DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, magazzinaggio, and networking applications.
Parametri delle prestazioni chiave
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| Proprietà | Metodo di prova | Valore tipico | Unità |
|---|---|---|---|
| Temperatura di transizione vetrosa (Tg) | DSC (IPC‑2.4.25) | 155 | ° C. |
| Temperatura di decomposizione (Td, 5% perdita in peso) | TGA (IPC‑2.4.24.6) | 365 | ° C. |
| CTE dell'asse Z (A1, sotto la Tg) | IPC‑2.4.24 | 35–40 | ppm/° C. |
| CTE dell'asse Z (A2, sopra Tg) | IPC‑2.4.24 | 220–240 | ppm/° C. |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | ppm/° C. |
| Costante dielettrica (Non so) @1GHz | IPC‑2.5.5.13 | 4.2–4.5 | - |
| Fattore di dissipazione (Df) @1GHz | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC‑TM‑650 | >60 | Minutes |
| Assorbimento di umidità | IPC‑2.6.2.1 | 0.12 | % |
| Punteggio di infiammabilità | Ul94 | V‑0 | Valutazione |
| UL MOT (Max Operating Temp) | - | 130 | ° C. |
Vantaggi materiali
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155° C.. Under lead‑free reflow peaks of260° C., this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. Eccellente resistenza al CAF
CAF (Filamento anodico conduttivo) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18L / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (Cl) e bromo (Br) content are each below 0.09% in peso. Total Cl+Br is below 0.15% (1500ppm).
Linee guida per la progettazione
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2mm), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1mm) and fill with copper.
- Outer layer circuits – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
Questotwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
Questo prodotto raggiunge 2.5mil/2,5mil (~63.5μm/63.5μm) larghezza e spaziatura della traccia. This exceeds the Progettazione HDI Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pitch BGA breakout with ample routing channels.
- Flexible signal routing for high‑density componente posizionamento.
- Reduced layer count, which lowers overall PCB cost.
Tecnologia microvia
Questo prodotto utilizza ahybrid drilling approach:
- Perforazione meccanica – Minimum diameter 0.2mm, used for through‑holes and buried vias in the core.
- Perforazione laser – Minimum diameter 0.1mm (4mil) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingtramite‑in‑pad designs for fine‑pitch BGAs.
Principio di funzionamento
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by perforazione meccanica + placcatura, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by foratura laser + placcatura, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
Questostepped interconnect structure shortens signal paths and reduces parasitic via effects. Di conseguenza, it preserves high‑speed signal integrity.
Vantaggi prestazionali
Affidabilità termica
ITEQ IT150’sTd (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 minuti without delamination. This ensures material integrity through multiple reflow cycles.
Integrità del segnale
A 1 GHz, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
Resistenza meccanica
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
Classificazione del prodotto
This product is classified across multiple dimensions:
| Classification System | Categoria |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+N+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | PCB rigido |
| Conta dei strati | 6Pannello multistrato a ‑strato |
| Sistema materiale | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| Finitura superficiale | Oro ad immersione + OSP hybrid finish |
| Dominio dell'applicazione | Communication‑grade PCB |
Flusso del processo di produzione
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
Fare un passo 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
Fare un passo 2: First Build‑Up
Laminazione (nucleo + pre -preg + lamina di rame) → First lamination → First‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Fare un passo 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
Fare un passo 4: Outer Layer and Finishing
Perforazione meccanica (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5mil/2,5mil) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
Scenari di applicazione
This product is primarily designed forAttrezzatura di comunicazione:
5G Infrastruttura di comunicazione
- 5Stazioni base G. (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- Ricetrasmettitori ottici.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA instradamento. It enables complex signal interconnects within limited board space.
Perché scegliere UGPCB?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows IPC‑6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment Produzione di PCB.
Richiedi un preventivo oggi
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
Dichiarazione dell'origine dei dati
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC‑2226 - Sectional Design Standard for High Density Interconnect (ISU) Schede stampate
- IPC‑6012E/F - Specifiche di qualificazione e prestazione per circuiti stampati rigidi
- IPC/JPCA‑2315 - Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC‑TM‑650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, e altri)
- JPCA‑ES‑01‑2003 - Halogen‑Free Copper‑Clad Laminate Standard
- Ul94 - Norma per la sicurezza dell'infiammabilità dei materiali plastici per parti di dispositivi ed apparecchi
