RO4350B Produttore di PCB ibridi ceramici ad alta frequenza | 4Circuito a microonde RF L

Engineer Superior RF Performance: The UGPCB RO4350B Ceramic Hybrid High Frequency PCB Solution

In the era of 5G, radar, e comunicazioni satellitari, the performance of your PCB ad alta frequenza is critical to system success. Selecting a PCB laminate that offers exceptional RF characteristics, affidabilità, and cost-effectiveness is paramount for every RF engineer and procurement specialist. UGPCB, un leader Produttore di PCB E PCBA service provider, presents its advanced Ceramic Hybrid High Frequency PCB utilizing Rogers RO4350B and FR4 lamination technology. We deliver a complete solution from Progettazione di circuiti stampati A Assemblaggio PCB (PCB).

4-Layer Rogers Ceramic Hybrid High-Frequency PCB Layer Stack-up

1. Panoramica del prodotto & Definizione

IL RO4350B Ceramic Hybrid High Frequency PCB is a high-performance circuito stampato engineered for radio frequency (Rf) and microwave applications. It innovatively combines Rogers RO4350B ceramic-filled hydrocarbon laminate with standard FR4 epoxy glass material through PCB multistrato lamination technology. Questo “hybrid” approach allows critical RF circuits (per esempio., antenne, Filtri, amplifiers) to be routed on the low-loss RO4350B areas, while cost-sensitive digital control and power management circuits reside on the FR4 areas, achieving an optimal balance between performance and cost.

2. Core Material & Costruzione

Materiali: This product features a Rogers RO4350B + FR4 mixed laminate costruzione. RO4350B is a ceramic-filled thermoset polymer material known for its stable dielectric constant (Non so) e basso fattore di dissipazione (Df). FR4 is a standard epoxy glass weave laminate, valued for its economy and versatility.
Costruzione: This model is a standard 4-PCB a strati. In genere, the outer layers (L1 & L4), which host RF circuitry, use RO4350B dielectric, bonded to the inner FR4 core using prepreg. This structure ensures signal integrity in RF paths while reducing overall material cost.
Specifiche chiave & Conformità:
- Costante dielettrica (Non so): 3.48 @ 10 GHz. This stable value minimizes phase shift and impedance variance, crucial for controlled impedance PCB design.
- Conducibilità termica: 0.69 W/m · k. Superior to standard FR4, aiding heat dissipation from active RF components and improving long-term reliability.
- Punteggio di infiammabilità: UL 94 V-0. Meets the highest standard for flame retardancy.
- Finitura superficiale: Oro ad immersione (Essere d'accordo). Provides a flat, solderable surface, excellent oxidation resistance, and long shelf life, Ideale per high-frequency SMT assembly E Processi PCBA.
- Spessore finito: 1.0 mm
- Copper Weight: 1 oz (35 μm)

3. Considerazioni critiche sulla progettazione & Principio operativo

Controllo dell'impedenza: RF transmission lines (per esempio., microstrip, stripline) require precise impedance control (typically 50Ω or 75Ω). Designers must calculate trace width using the stable Dk of RO4350B (3.48) and dielectric thickness (0.762mm) to ensure minimal signal reflection.
Hybrid Zone Transition: Signal transitions between RO4350B and FR4 areas cause impedance discontinuities due to Dk mismatch. Optimal Disposizione del circuito stampato requires mitigation techniques like tapered traces, matching networks, or optimized via transitions.
Gestione termica: Despite its improved thermal conductivity (0.69 W/m · k), high-power RF designs may still require thermal vias, heatsinks, or metal-core substrates for effective PCB thermal management.
Principio operativo: Questo circuito acts as the physical substrate and transmission medium for RF signals. Its core function is to utilize the low-loss, low-dispersion properties of RO4350B to transmit electromagnetic signals with high efficiency and minimal distortion across target frequency bands (from hundreds of MHz to tens of GHz), while integrating control logic via the hybrid structure for complete system functionality.

4. Caratteristiche chiave & Vantaggi

Exceptional High-Frequency Performance: Low loss and stable Dk/Df ensure superior Integrità del segnale.
Optimized System Cost: Hybrid construction significantly reduces the use of premium material, offering a cost-effective PCB solution.
Alta affidabilità & Durata: V-0 flammability rating and robust thermal performance ensure stability in demanding environments.
Progetto & Assembly Friendly: Compatible with standard Fabbricazione di PCB E SMT assembly processes, streamlining PCBA production.

5. Processo di produzione

UGPCB adheres to a strict controllo di qualità regime for high frequency PCB manufacturing:
Preparazione del materiale & Inner Layer Imaging → Hybrid Lamination & Registration → Precision Drilling & Plating → Pattern Imaging & Etching → Impedance Control Testing → Solder Mask & Finitura superficiale (Essere d'accordo) → Electrical Testing & Final Audit → Shipping. Each step is specially controlled for high-frequency characteristics.

PCB Production Process

6. Applicazioni primarie & Casi d'uso

This product is ideal for applications demanding high frequency and signal fidelity:

Comunicazioni wireless: 5G base station antennas/RF modules, microwave backhaul, satellite communication terminals.
Elettronica automobilistica: Millimeter-wave radar (77 GHz), V2X telematics modules.
Aerospaziale & Difesa: Radar systems, electronic warfare (EW) attrezzatura, guidance systems.
Test & Misurazione: Nucleo RF circuit boards in network analyzers, spectrum analyzers, and high-frequency signal sources.

Partner with UGPCB for Your High-Frequency Projects

Whether you are an engineer engaged in RF PCB layout or a sourcing professional seeking a reliable circuit board supplier, UGPCB’s RO4350B Hybrid High Frequency PCB is your ideal solution. We provide not only high-quality Fabbricazione di PCB but also full-spectrum support from PCB design review to end-to-end PCBA services, accelerating your time-to-market.