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La stecca ibrida ad alta frequenza include una piastra di base, che è piegato e posizionato sul primo strato di filo interno, il primo strato di filo esterno, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate follow. The substrate includes a second layer of solder resist ink. The substrate comprises a high-frequency area and an auxiliary area; the auxiliary area is fixed, and the high-frequency area inlay should be positioned accordingly.
Il modello di utilità fornisce una stecca ibrida ad alta frequenza, divided into two parts: un'area ad alta frequenza e un'area ausiliaria, providing mechanical support. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signal requirements.
High Frequency Hybrid Product Classification:
- Strati: 6
- Used Board: RO4350B + FR4
- Spessore: 1.6mm
- Misurare: 210mm x 280mm
- Trattamento superficiale: Gold-plated
- Apertura minima: 0.25mm
- Applicazione: Comunicazione
- Caratteristiche: High Frequency Mixed Pressure
We provide Communication motherboard Turnkey PCB Assembly services. UGPCB is your one-stop Turnkey PCB Assembly company.
