UGPCB

18-Produttore di PCB Megtron-7 ad alte prestazioni Layer | 1.86mm di spessore | ENIG 2u”

Ultimin

In the era of high-speed data transfer and precision computing, the performance of the circuito stampato (PCB)—the core brain of electronic devices—determines the entire system’s capability. UGPCB introduces its high-performance 18-PCB rigido a strati based on Megtron-7 materiale, engineered to meet the most demanding electrical and physical challenges, serving as the essential foundation for your next-generation advanced equipment.

1.18-Layer Megtron-7 Rigid PCB Panoramica del prodotto & Definizione

This product is an 18-layer rigid high-layer count PCB with a precisely controlled thickness of 1.86mm and overall dimensions of 165mm x 120mm. It utilizes industry-leading Megtron-7 high-speed low-loss laminate and features a 2-microinch (ca. 0.05µm) Oro per immersione in nichel chimico (Essere d'accordo) finitura superficiale. This specification represents an advanced tier in ad alte prestazioni Produzione di PCB, designed for applications where signal integrity, gestione termica, and reliability are paramount.

18-Layer Megtron-7 Rigid PCB

2. Considerazioni critiche sulla progettazione

Designing a successful 18-layer PCB, especially with high-speed materials like Megtron-7, requires careful attention to several core aspects:

  1. Stack-up Design: A rational layer stack-up is critical for impedance control and crosstalk reduction. A typical 18-layer stack includes multiple signal, energia, and ground planes to ensure stable power distribution and clear signal return paths.

  2. Controllo dell'impedenza: High-speed signal transmission demands precise controlled impedance PCB progetto. Trace width and spacing must be calculated accurately based on the Dk (Costante dielettrica) e Df (Fattore di dissipazione) of Megtron-7. We offer professional impedance calculation and simulation services.

  3. Gestione termica: The 1.86mm board thickness and multi-layer structure necessitate effective thermal pathways in the design, such as using thermal vias to connect internal copper layers for efficient heat dissipation from components.

  4. Interconnessione ad alta densità (ISU) Considerations: While this is a standard through-hole design, careful planning of via types (blind, buried, through-hole) is essential at this layer count to minimize stub effects and optimize signal paths.

3. Come funziona & Struttura

UN PCB multistrato functions like a highly integrated, three-dimensional “road network.” Electrical signals travel on copper traces (“roads”) on the surface and internal layers, with vertical connections between layers established through plated through-holes (“interchanges”). Dedicated power and ground planes provide stable voltage reference and noise shielding for the entire system. Questo 18-PCB rigido a strati is formed through a precise lamination process, bonding multiple core layers and prepreg sheets into a single, robust unit with excellent electrical properties. Its sophisticated PCB board structure is the foundation for implementing complex circuit functionalities.

4. Materiali core & Key Performance

5. Product Classification

According to industry and IPC standards, this product is accurately classified as:

  1. Per conteggio strati: High-Layer Count PCB (typically defined as 10+ strati).

  2. By Material Type: High-Speed High-Frequency PCB / Low-Loss PCB.

  3. By Structure: PCB rigido.

  4. By Technology: Controlled Impedance PCB, ENIG Finished PCB.

  5. By Application Grade: Industrial Grade / Telecommunications Grade High-Performance PCB.

6. Caratteristiche chiave & Benefici

  1. Premium Material: Built on Megtron-7 high-speed laminate, providing the physical basis for superior electrical performance.

  2. High Complexity Capacity: IL 18-layer circuit board design allows for extremely complex and dense circuit layouts.

  3. Produzione di precisione: Strict tolerance control on the 1.86mm board thickness and consistent 2u” ENIG surface finish application.

  4. Engineered for Speed: Optimized throughout—from design and material selection to processing—for high-speed digital circuits E RF/microwave circuits.

7. Panoramica del processo di produzione

IL high-layer count PCB manufacturing process is highly precise: Material Cutting → Inner Layer Imaging & Etching → Automated Optical Inspection (AOI) → Lamination (Pressing multiple inner layer cores with prepreg) → Drilling → Hole Metallization (Desmear, Electroless & Electrolytic Copper Plating) → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → Surface Finish (Essere d'accordo) → Profile Routing → Electrical Testing → Final Inspection. Each step requires stringent control, particularly layer-to-layer registration and impedance control.

8. Applicazioni primarie & Casi d'uso

Questo high-performance PCB board is the ideal choice for the following advanced applications:

Why Choose UGPCB for Your 18-Layer Megtron-7 PCBs?

We deliver more than just a circuito; we provide a complete solution encompassing DFM (Progettazione per la produzione) review, produzione di precisione, E Test di affidabilità. We possess deep expertise in every detail of high-layer count Fabbricazione di PCB, ensuring your design is translated into reality with the highest quality and reliability.

Contact us today for a free technical assessment and a competitive quote for your project. Let UGPCB be the robust foundation for your high-end product’s success.

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