UGPCB RO4350B Ceramic Hybrid High Frequency PCB – 4-Layer Mixing Board, Strict Dk 3.48, Stable Output

1. Panoramica del prodotto

In modern wireless communication and high-speed digital designs, signal integrity and system reliability depend heavily on the Materiale base PCB. UGPCB introduces the RO4350B ceramic hybrid high frequency PCB. This is a 4-layer board that combines Rogers RO4350B high-frequency laminate with standard FR-4 material using advanced mixing press technology.

This product inherits the stable dielectric constant (Non so 3.48) and low-loss properties of RO4350B. It also leverages the mechanical support and cost benefits of FR-4. It is an ideal solution for communication base stations, Strumenti, and RF front-end modules.

2. Product Definition and Classification

2.1 Definizione del prodotto

A RO4350B ceramic hybrid PCB ad alta frequenza uses both Rogers RO4350B high-frequency material and standard FR-4 within a single multilayer board stackup. The ceramic-filled hydrocarbon resin system ensures low-loss transmission for RF signals.

2.2 Classificazione scientifica

• Per materiale: Composite dielectric PCB ibrido (Hybrid Laminate PCB).

• By Application Frequency: PCB RF a microonde (typical operating range: 500 MHz to 10 GHz+).

• Per conteggio strati: 4-layer multilayer hybrid board.

3. Core Parameters and Design Essentials

Below are the key specifications for this UGPCB product. All data is strictly controlled to ensure consistency between design and fabrication.

Design Tips for Engineers:
In hybrid layer stackups, CTE mismatch (RO4350B CTE is lower than FR-4 CTE) can cause warpage during reflow. UGPCB engineers use symmetric stackup designs. We select compatible prepregs and control the lamination profile to keep warpage below 0.7%.

4. Principio di lavoro

Questo PCB serves two core functions: signal transmission and energy transfer.

Per segnali ad alta frequenza, the conductor (rame) and dielectric (RO4350B) form transmission lines (microstrip or stripline). The stable Dk (3.48) determines signal propagation speed. The low Df (0.0037) ensures minimal signal attenuation, preserving signal integrity.

5. Materials and Performance Analysis

5.1 Rogers RO4350B

• Composizione: Hydrocarbon resin system with ceramic fillers, reinforced with woven glass.

• Performance Benefits:

  • Frequency Stability: Dk shows minimal variation with frequency, ideal for broadband applications.

  • Insertion Loss: Significantly lower than standard FR-4, suitable for 5G and microwave circuits.

  • Lead-Free Compatible: Withstands 260°C assembly temperatures.

5.2 FR-4

• Composizione: Epoxy resin with glass fabric.

• Performance Benefits: High mechanical strength, Costo inferiore. Used for power planes, ground layers, and non-critical signals. This reduces overall material costs.

5.3 Lamina di rame

• Tipo: 1 OZ electrolytic copper. It provides good peel strength (tipico 5.0 lb/in).

5.4 Finitura superficiale (Oro ad immersione / Essere d'accordo)

• Why ENIG? Per PCB ad alta frequenza, ENIG offers a very flat surface. It minimizes skin effect losses for high-frequency signals. It also provides good solderability and oxidation resistance.

6. Caratteristiche strutturali

• Hybrid Laminate Structure: A typical 4-layer build uses a symmetric stackup. High-frequency signals route on the surface or RO4350B core layers. Power and ground are on FR-4 layers. This design ensures RF performance while using FR-4’s thermal stability.

• Through-Hole Reliability: The Z-axis CTE of RO4350B (32 ppm/° C.) is relatively close to copper’s CTE (around 17 ppm/° C.). During thermal cycles, the plated through-hole walls resist cracking. This greatly improves board lifetime.

7. Production Process Flow

UGPCB follows these critical steps for this hybrid product. This ensures material compatibility and high quality.

1. Incoming Inspection: Verify properties of RO4350B cores and FR-4 cores separately.

2. Inner Layer Imaging: Create inner layer circuits on each material.

3. Oxide Treatment: Apply special chemistry to RO4350B surfaces. This enhances bonding with prepregs.

4. Lay-Up (Critical Step): Precisely align RO4350B, prepregs, and FR-4 according to the symmetric stackup design.

5. Laminazione: Use a stepped temperature curve. Control resin flow. Minimize internal stress and warpage caused by CTE differences.

6. Perforazione & Desmear: Optimize drill bits and feed rates (RO4350B is brittle). Use plasma treatment to remove resin smear from hole walls.

7. Placcatura: Achieve reliable interlayer connections.

8. Outer Layer Imaging/Etching: Control line widths precisely to meet impedance targets.

9. Finitura superficiale: Apply Immersion Gold (Essere d'accordo).

10. Test: 100% electrical test + impedance coupon test + prova di stress termico.

8. Applicazioni tipiche

This hybrid PCB combines high-frequency performance with cost efficiency. It is widely used in these fields:

1. Communication Instruments: RF boards in signal analyzers and network analyzers.

2. Wireless Infrastructure: 5G base station antennas, amplificatori di potenza, control circuits in RRU/AAU.

3. Elettronica automobilistica: Signal processing boards for 77 GHz mmWave radar.

4. Automazione industriale: High-frequency data acquisition modules, microwave sensors.

5. Aerospaziale & Difesa: Modules for satellite communication receivers and radar systems.

9. Perché scegliere UGPCB?

• Precise Matching: We strictly control Dk within ±0.05 tolerance. We provide TDR impedance test reports. Electrical performance matches your design.

• Hybrid Press Expertise: We have mature processes for RO4350B+FR4 hybrid lamination. We solve delamination and warpage issues caused by CTE mismatch.

• Alta affidabilità: We use Immersion Gold (Essere d'accordo) finitura superficiale. It supports precision soldering. It meets the strict reliability demands of communication instruments.

Get Your Quote. Drive Your RF Products to Market.

Do you need a 4-layer high-frequency board that meets Dk 3.48 requirements while also balancing cost?

UGPCB uses genuine Rogers RO4350B material. We also have mature FR-4 hybrid pressing processes. We help you maintain signal integrity while optimizing your BOM cost.

Free Engineering Review
Impedance Testing Support
Fast Prototyping & Volume Production

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