製品の概要
UGPCB の導入 6‑layer 2+N+2 HDI PCB (モデル: 6L 2+N+2 HDI PCB). This high‑density interconnect プリント基板 is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, そして 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, 光モジュール, および同様のアプリケーション.
で プリント基板 業界, HDI (高密度相互接続) technology is the core enabler for shrinking component pitches and rising signal speeds. The 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, 信号の完全性, そして製造コスト.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC‑2226 standard and is classified asタイプIII within that system.
Breaking down the term:
- The first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, つまり, two inner core layers).
- The second “2” means two sequential build‑up layers below the core.
したがって, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
HDI Classification per IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| HDI Type | 構造 | Build‑up Layers (per side) | Minimum BGA Pitch | 典型的なアプリケーション |
|---|---|---|---|---|
| タイプI | 1+n+1 | 1 層 | 0.5mm | スマートフォン, mid‑density designs |
| Type II/III | 2+n+2 | 2 レイヤー | 0.4mm | ネットワーキング機器, high‑performance computing |
| タイプIII / エリック | 3+N+3 and above | 3+ レイヤー | 0.3mm and below | Flagship smartphones, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered 構成.
主要な技術仕様
| パラメーター | 仕様 |
|---|---|
| モデル | 6L 2+N+2 HDI PCB |
| 材料 | ITEQ IT150 |
| レイヤー数 | 6 レイヤー (2+N+2 second‑order HDI) |
| はんだマスク色 | 黒か白か (オプション) |
| 仕上がり板厚 | 1.0mm |
| 内層の銅の厚さ | 1 オズ (~35μm) |
| 外層の銅の厚さ | 0.5 オズ (~17.5μm) |
| 最小トレース / 間隔 | 2.5ミル / 2.5ミル (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2mm |
| Minimum Laser Drill | 0.1mm |
| 表面仕上げ | イマージョンゴールド + OSP |
| 主な用途 | 通信機器 |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 です medium‑Tg, halogen‑free, multifunctional epoxy ラミネート. It sits between standard FR-4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (TG >150DSCによる℃), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, ストレージ, and networking applications.
キーパフォーマンスパラメーター
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| 財産 | テスト方法 | 代表値 | ユニット |
|---|---|---|---|
| ガラス転移温度 (TG) | DSC (IPC‑2.4.25) | 155 | ℃ |
| 分解温度 (TD, 5% WT損失) | TGA (IPC‑2.4.24.6) | 365 | ℃ |
| Z 軸 CTE (A1, Tg未満) | IPC‑2.4.24 | 35–40 | ppm/°C |
| Z 軸 CTE (A2, Tg以上) | IPC‑2.4.24 | 220–240 | ppm/°C |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | ppm/°C |
| 誘電率 (DK) @ 1GHz | IPC‑2.5.5.13 | 4.2-4.5 | - |
| 損失係数 (Df) @ 1GHz | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC-TM-650 | >60 | Minutes |
| 水分吸収 | IPC‑2.6.2.1 | 0.12 | % |
| 可燃性評価 | UL94 | V-0 | 評価 |
| UL MOT (Max Operating Temp) | - | 130 | ℃ |
材料上の利点
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155℃. Under lead‑free reflow peaks of260℃, this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. 優れたCAF抵抗
CAF (導電性陽極フィラメント) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18L / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (Cl) そして臭素 (Br) content are each below 0.09% 重量で. Total Cl+Br is below 0.15% (1500ppm).
設計ガイドライン
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2mm), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1mm) and fill with copper.
- Outer layer circuits – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
これtwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
This product achieves 2.5ミル/2.5ミル (~63.5μm/63.5μm) trace width and spacing. This exceeds the HDI設計 Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pitch BGA breakout with ample routing channels.
- Flexible signal routing for high‑density 成分 配置.
- Reduced layer count, which lowers overall PCB cost.
Microviaテクノロジー
この製品には、hybrid drilling approach:
- 機械掘削 – Minimum diameter 0.2mm, used for through‑holes and buried vias in the core.
- レーザー掘削 – Minimum diameter 0.1mm (4ミル) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingパッド経由 designs for fine‑pitch BGAs.
動作原理
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by 機械的穴あけ + メッキ, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by レーザー穴あけ + メッキ, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
これstepped interconnect structure shortens signal paths and reduces parasitic via effects. 結果として, it preserves high‑speed signal integrity.
パフォーマンス上の利点
熱信頼性
ITEQ IT150’sTD (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 分 without delamination. This ensures material integrity through multiple reflow cycles.
信号の完全性
1GHzで, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
機械的強度
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
製品分類
This product is classified across multiple dimensions:
| Classification System | カテゴリ |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+n+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | リジッドPCB |
| レイヤー数 | 6‑layer multilayer board |
| マテリアルシステム | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| 表面仕上げ | イマージョンゴールド + OSP hybrid finish |
| アプリケーションドメイン | Communication‑grade PCB |
製造工程の流れ
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
ステップ 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
ステップ 2: First Build‑Up
ラミネート加工 (コア + プリプレグ + 銅箔) → First lamination → First‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
ステップ 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1mm) → Desmear → Electroless copper + plating → Circuit patterning
ステップ 4: Outer Layer and Finishing
機械掘削 (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5ミル/2.5ミル) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
アプリケーションシナリオ
This product is primarily designed for通信機器:
5G通信インフラストラクチャ
- 5Gベースステーション (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- 光トランシーバー.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA ルーティング. It enables complex signal interconnects within limited board space.
UGPCBを選択する理由?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows IPC‑6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment プリント基板の製造.
今すぐ見積もりをリクエストする
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
データソース宣言
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC‑2226 - Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
- IPC‑6012E/F - リジッドプリント基板の認定および性能仕様
- IPC/JPCA‑2315 - Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC-TM-650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, その他)
- JPCA‑ES‑01‑2003 - Halogen‑Free Copper‑Clad Laminate Standard
- UL94 - 機器・家電部品用プラスチック材料の可燃性安全基準
