1. 製品の概要: What Is an Automotive Communication 2+N+2 HDI Board?
The車載通信 2+N+2 HDI ボード です 高密度相互接続 (HDI) プリント基板 engineered specifically for vehicle communication systems. This product adopts a14-層 stack-up structure withS1000-2M high-performance copper-clad laminate as the core substrate material. It achieves high-density, high-reliability interlayer interconnection through an advanced process combining2 laser drilling cycles そして3 lamination cycles.
Within the HDI PCB classification system, 2+n+2 denotes a specific build-up structure—adding 2 build-up layers on each side of the core substrate (N layer) using the sequential build-up (SBU) 方法. Compared to 1+N+1 (first-order HDI), 2+N+2 represents asecond-order HDI 解決, offering higher wiring density and more sophisticated interconnection capabilities.
UGPCB, as a professional PCBメーカー, delivers high-quality HDI PCB products that comply with the IPC-6012FA automotive applications addendum—the industry’s most stringent reliability standard for automotive electronics.
2. 製品分類: Scientific Positioning and Technology Tier
This product can be scientifically classified across multiple dimensions:
By IPC-6012 Performance Class: Class 3/A—the highest reliability tier for automotive electronics. IPC-6012F tightens through-hole resistance change after thermal cycling from 10% にmaximum of 5% for Class 3/A, and increases minimum barrel copper thickness from 25 µm to28 μm.
By HDI Order: Second-Order HDI (2+n+2)—a mid-complexity HDI solution positioned between first-order HDI (common in consumer electronics) and high-end any-layer HDI.
By Material Loss Tier: 中損失 (Df < 0.010).
By Application Domain: Automotive Electronics—in-vehicle communication, アダス, V2X, 等.
可燃性評価による: UL 94 V-0—the highest vertical burn rating, requiring self-extinguishment within 10 seconds with no flaming drips.
3. Core Parameters and Technical Specifications
| パラメーター | 仕様 | 参照標準 |
|---|---|---|
| ラミネート | S1000-2M (Shengyi Technology) | IPC-4101/126 |
| レイヤー数 | 14 レイヤー | - |
| 板厚 | 1.6 ± 0.16 mm | IPC-6012F |
| Minimum Laser Via Diameter | 0.10 mm | - |
| Minimum Mechanical Hole Diameter | 0.20 mm | - |
| 最小トレース幅 / 間隔 | 75 μm / 75 μm | IPC-2221C |
| アスペクト比 | 8:1 | IPC-2221 |
| ガラス転移温度 (TG) | 180℃ (DSC) | IPC-TM-650 2.4.25 |
| 熱分解温度 (TD) | 355℃ | Shengyi S1000-2M Datasheet |
| 誘電率 (Dk @ 1GHz) | 4.6 | Shengyi S1000-2M Datasheet |
| 損失係数 (Df @ 1GHz) | 0.013 | Shengyi S1000-2M Datasheet |
| 可燃性評価 | UL 94 V-0 | UL 94 標準 |
| 特殊加工 | 2 レーザー穴あけ加工, 3 Laminations | - |
Aspect Ratio Calculation is a critical process parameter in プリント基板の製造 that directly determines plating quality and through-hole reliability. IPC-2221 ガイドラインによる, Aspect Ratio = Board Thickness ÷ Drilled Hole Diameter. For this product: 1.6 mm ÷ 0.2 mm = 8:1. IPC-2221 recommends a maximum aspect ratio of 8:1 に 10:1 for conventional electrolytic plating processes. The 8:1 design ensures reliability while fully validating UGPCB’s process capability in high-aspect-ratio through-hole plating.
4. Material Deep Dive: S1000-2M High-Performance Substrate
S1000-2M is a high-performance FR-4.0 copper-clad laminate manufactured by Shengyi Technology. それはlead-free compatible high-Tg material.
キーパフォーマンスパラメーター (ソース: Shengyi Technology official datasheet and IPC-TM-650 test methods):
| パラメーター | 価値 | テスト方法 |
|---|---|---|
| TG (ガラス転移温度) | 180℃ (DSC) | IPC-TM-650 2.4.25 |
| TD (熱分解温度) | 355℃ | Shengyi Datasheet |
| T260 | > 60 分 | IPC-TM-650 |
| T288 | 30 分 | IPC-TM-650 |
| CTE (z軸, Tg未満) | 41 ppm/°C | IPC-TM-650 |
| CTE (z軸, Tg以上) | 208 ppm/°C | IPC-TM-650 |
| はく離強度 (after 288°C solder float) | 1.3 N/mm | IPC-TM-650 |
Core Advantages of S1000-2M:
- Mid-Loss Characteristics: のDFと 0.013 @ 1GHz, this material offers approximately28% lower dielectric loss compared to standard FR-4 (Df ≈ 0.018).
- 高い熱抵抗: Tg of 180°C and Td of 355°C meet the stringent requirement of continuous operation above 125°C in automotive environments.
- CAF (導電性陽極フィラメント) 抵抗: Suitable for high-multilayer PCBs and high-humidity environments.
- UL 94 V-0 可燃性評価: Self-extinguishes within 10 seconds with no flaming drips.
5. デザインの基本: 2+N+2 HDI Architecture Explained
5.1 What Is the 2+N+2 Structure?
The 2+N+2 HDI board is manufactured using the sequential build-up method:
- N Layer: The core substrate layer (multilayer core formed by inner-layer lamination)
- 2 Build-up Layers on Each Side: Constructed sequentially through 2 laser drilling cycles and 2 lamination cycles on both sides of the core
2 Laser Drilling Cycles respectively form the microvias for the first build-up layer (L1-L2, L13-L14) and the second build-up layer (L2-L3, L12-L13).
3 Lamination Cycles 含む: core layer lamination → first build-up layer lamination → second build-up layer lamination.
5.2 Microviaテクノロジー
- Laser Blind Vias: 0.10 mm diameter, formed using CO₂ or UV laser drilling
- Mechanical Buried Vias: 0.20 mm diameter, used for interlayer interconnection within the core
- Stacked/Staggered Via Design: Supports stacked or staggered microvia structures for maximum layout flexibility
5.3 Fine-Line Circuitry
Minimum trace width and spacing of 75 μm (約 3 ミル) comply with IPC-2221C requirements for fine-line design. This precision supports fan-out routing for 0.5 mm pitch BGAs.
5.4 インピーダンス制御
のdkで 4.6 @ 1GHz, S1000-2M enables characteristic impedance control at 50Ω, 90おお, and 100Ω through adjustment of trace width and dielectric thickness—meeting the signal integrity requirements of in-vehicle communication systems.
6. 作業原則: How Does an HDI Board Achieve High-Density Interconnection?
Traditional multilayer PCBs rely onスルーホール that penetrate the entire board thickness for layer-to-layer connections—consuming significant routing area.HDI PCB technology overcomes this limitation through several innovations:
1. ブラインドビアテクノロジー: Laser-drilled microvias connect only the outer layer to the adjacent inner layer (例えば。, L1-L2) without penetrating the entire board.
2. Buried Via Technology: Mechanically drilled vias are completely contained within the core layer (例えば。, L3-L12) and do not appear on the board surface.
3. Sequential Build-Up Method: Build-up layers are constructed sequentially, with each additional layer providing additional routing resources.
4. Stacked Via Interconnection: Blind vias on upper and lower layers can be stacked in alignment to create signal paths spanning multiple layers.
In a 14-layer 2+N+2 structure, a signal can travel from the surface layer (L1) through a 0.10 mm laser blind via to L2, then through a second-layer laser blind via to L3, then through a mechanical buried via within the core to L12, and finally through symmetrical build-up blind vias to the bottom layer (L14)—achievingsignal transmission across 14 layers without consuming surface-layer routing area.
7. 性能特性: Why Is This Board Ideal for Automotive Communication?
7.1 IPC-6012FA Automotive Standard Compliance
12月 2025, IPC (now the Global Electronics Association) officially releasedIPC-6012FA, のAutomotive Applications Addendum to IPC-6012F Qualification and Performance Specification for Rigid Printed Boards. This addendum applies to rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
IPC-6012F (released October 2023) represents the most significant tightening of automotive PCB reliability requirements in over a decade. Key changes include:
- Through-Hole Resistance Change: Tightened from 10% にmaximum of 5% for Class 3/A
- Barrel Copper Thickness: Increased from 25 µm to28 μm for Class 3/A
- IST (Interconnect Stress Testing): Changed from optional tomandatory, 最小限の500 サイクル for Class 3/A
- Stacked Microvias: Requiringseparate qualification at the stacked via level
7.2 Thermal Cycling Reliability
Automotive electronics face continuous operating temperaturesabove 125°C in engine compartments and EV battery-adjacent environments. With Tg of 180°C, Td of 355°C, T260 > 60 分, and T288 of 30 分, S1000-2M ensures dimensional stability and dielectric performance under extreme thermal conditions.
7.3 信号の完全性
In-vehicle communication systems (V2X, アダス, Automotive Ethernet) continue to push operating frequencies higher. のDFと 0.013 @ 1GHz, S1000-2M is a mid-loss material that supports10G–25G SerDes channels with excellent performance over link lengths up to 20 インチ.
7.4 Vibration Resistance
IPC-6012FA specifically addresses automotive vibration environments. The 14-layer HDI board’s multilayer laminated structure provides excellent mechanical strength. の組み合わせ 0.10 mm laser microvias and 0.20 mm mechanical holes ensures connection reliability under vibration.
8. 製造工程: From Raw Material to Finished Product
ステップ 1: Inner-Layer Core Fabrication
- Core material cutting → inner-layer circuit imaging → etching → AOI inspection
ステップ 2: First Lamination
- Stack multiple inner-layer cores with prepreg → high-temperature high-pressure lamination → core substrate (N layer) formation
ステップ 3: First Laser Drilling & メッキ
- First laser drilling on both sides of the core (forming L1-L2, L13-L14 microvias) → desmear → electroless copper deposition → electrolytic copper filling
ステップ 4: First Build-Up Lamination
- Laminate first build-up layer material on both sides of the core →Second Lamination
ステップ 5: Second Laser Drilling & メッキ
- Second laser drilling (forming L2-L3, L12-L13 microvias) → desmear → electroless copper deposition → electrolytic copper filling
ステップ 6: Second Build-Up Lamination
- Laminate second build-up layer material on both sides of the core →Third Lamination
ステップ 7: 機械による穴あけ
- Drill 0.20 mm mechanical through-holes and buried vias (within L3-L12 core)
ステップ 8: Outer-Layer Circuit Fabrication
- Outer-layer circuit imaging → etching → solder mask → surface finish (同意する, 等)
ステップ 9: 最終検査
- Electrical testing → 飛行探査機 testing → final AOI → reliability sampling (IST, サーマルサイクリング, 等)
9. アプリケーションシナリオ: Core Interconnection Solutions for In-Vehicle Communication Systems
1. 高度なドライバー支援システム (アダス)
ADAS requires multi-sensor fusion (ミリ波レーダー, リダー, カメラ). The 2+N+2 HDI board supports microstrip antenna integration and RF impedance control in radar modules with its high-density interconnection capability.
2. V2X (Vehicle-to-Everything) コミュニケーション
V2X modules demand integration of communication RF front-ends, baseband processing, and power management within compact spaces—making HDI PCB’s high-density characteristics an ideal choice.
3. Automotive Ethernet
10G/25G automotive Ethernet switches require stringent signal integrity control. S1000-2M’s mid-loss characteristics ensure low-loss transmission for high-speed signals.
4. Zonal Controllers
Next-generation vehicle architecture zonal controllers process massive data volumes. The 14-layer 2+N+2 HDI board provides ample routing layers and flexible interconnection structures.
5. Battery Management Systems (BMS)
EV battery management system PCBs must maintain long-term reliability in high-temperature, high-vibration environments—exactly the scenario addressed by S1000-2M material and IPC-6012FA standards.
10. UGPCBを選択する理由?
- IPC-6012FA Compliance: Strict adherence to the latest automotive PCB standard released December 2025
- Advanced HDI Manufacturing Capability: Supporting 2+N+2, 3+n+3, and any-layer HDI structures
- 認定された材料: S1000-2M certified to UL 94 V-0, compliant with IPC-4101/126 specifications
- エンドツーエンドの品質制御: Full-process inspection from raw materials to finished products, ensuring Class 3/A reliability
- 迅速な応答: Professional engineering team providing DFM (製造可能性のための設計) レビュー
📞 Request a Quote Today
UGPCB specializes in the R&D and manufacturing ofautomotive electronics HDI PCBs. 必要かどうか2+N+2 HDI boards, 14-layer high-multilayer PCBs, or otherautomotive communication PCB ソリューション, we provide one-stop services from design optimization to volume production.
📧 Send your Gerber files or technical requirements to: sales@ugpcb.com
🔗 Visit the UGPCB website for an instant quote
データソース宣言
The technical data and standard information cited in this document are derived from the following authoritative sources:
- IPC (Global Electronics Association) — IPC-6012Fリジッドプリント基板の認定および性能仕様 (10月 2023), IPC-6012FAAutomotive Applications Addendum (December 2025), IPC-2221Cプリント基板設計に関する一般規格 (8月 2025), IPC-4101Eリジッド・多層プリント基板用基材仕様, IPC-TM-650試験方法マニュアル
- Shengyi Technology — S1000-2M Product Datasheet and Technical Data Sheet
- UL (引き受けの研究所) — UL 94 V-0 Flammability Rating Standard
注記: All data is cited from publicly available official standard documents or manufacturer specifications to the greatest extent possible. Specific values may vary slightly due to test conditions and batch differences. Readers are advised to refer to the latest official documentation for the most current specifications.
