1. 製品の概要
の分野で 高密度相互接続 (HDI) プリント基板, の12-layer 2+N+2 board represents an important direction in advanced PCB manufacturing technology. UGPCB12-layer 2+N+2 HDI board uses ISOLA high-performance substrate material, with a finished board thickness of 2.0 mm, 1 oz copper on both outer and inner layers, a minimum via diameter of 0.1 mm, line width/spacing of 0.1 mm, BGA pad diameter of 0.15 mm, and electroless nickel/immersion gold (同意する) 表面仕上げ.
これ12-層 プリント基板 is a typical high-density interconnect 多層基板 suitable for electronic products with demanding requirements for signal integrity, routing density, と信頼性. として2+N+2 structure HDIボード, it features two buildup layers on each side, with N core layers in the middle, supporting stacked or staggered microvia structures.
2. 製品の定義
2.1 What Is a 2+N+2 HDI Board?
あ2+N+2 HDI board is a high-density interconnect printed circuit board manufactured using a sequential lamination process. The “2” in its name represents two buildup layers on each side, その間 “N” represents the number of core layers in the middle. For this product, the total layer count is 12, meaning a 2+8+2 structure — two buildup layers on each side and eight core layers in the middle.
これHDI PCB belongs to Type III (as defined by IPC-2226), a commonly used HDI stackup solution supporting medium pin-count, 高密度BGA 成分 ルーティング. The2+N+2 PCB stackup design significantly improves routing density, supports successful routing of ultra-fine-pitch BGAs with pitches as small as 0.4 mm, reduces overall layer count, and minimizes signal attenuation.
2.2 Applicable International Standards
デザイン, 製造業, and acceptance of this product strictly comply with the following IPC international standards:
- IPC-6012F - リジッドプリント基板の認定および性能仕様: This is the internationally recognized performance specification for rigid printed circuit boards, covering the entire process from material selection to finished product, including quality indicators, qualification, and performance requirements for each process step.
- IPC-2221C - プリント基板設計に関する一般規格: This is the foundation design standard for all documents in the IPC-2220 series, establishing generic requirements for printed board design.
- IPC-4101E - リジッド・多層プリント基板用基材仕様: This specification covers requirements for base materials (laminate or prepreg) used primarily for rigid or multilayer printed boards.
3. 設計ガイドライン
3.1 2+N+2 Stackup Structure Design
The12-layer 2+N+2 PCB stackup design follows the core design principles for HDI boards:
- Priority on ground planes: Ground planes are prioritized because they transmit signals in microstrip configurations.
- Low impedance and low noise: A ground-plane-based 12-layer プリント基板設計 achieves low ground impedance and low noise.
- High-speed signal routing: Intermediate layers between planes are used for high-speed signal traces, with tight coupling between signal layers.
- Adjacent plane and signal layers: Plane layers and signal layers should be placed on adjacent layers.
- Tight plane coupling: Large-area power and ground planes should be tightly coupled together.
3.2 Signal Integrity Design
IPC-2221Cによる, impedance tolerance and conductor layer isolation areas are critical considerations in 高速PCB設計. のために12-layer 2+N+2 HDI board, special attention should be paid to:
- インピーダンス制御: と 1 oz銅 (約 35 μm) on both outer and inner layers, precise line width/spacing control is required to achieve target impedance.
- Microvia structure: The 0.1 mm minimum via diameter falls within the microvia category (≤ 0.15 mm as defined by IPC-2221 and IPC-6012).
- BGA breakout: The 0.15 mm BGA pad combined with 0.1 mm line width/spacing supports successful breakout for 0.4 mm pitch BGAs.
4. 動作原理
The12-layer 2+N+2 HDI board operates based on the interconnection and signal transmission of multiple conductive layers. Its core operating mechanisms include:
4.1 Signal Transmission Paths
HDI boards achieve interlayer electrical connections through the following via types:
- ブラインドバイアス: Connect from an outer layer to a specific inner layer without penetrating the entire board thickness.
- 埋め込みビア: Exist only between inner layers.
- Stacked microvias: Multiple microvias stacked vertically to form a path through multiple buildup layers.
4.2 Power Distribution and Grounding
The power distribution network (PDN) の12-層PCB is optimized through:
- Large-area power planes tightly coupled with ground planes, forming effective decoupling capacitance.
- Ground layers serving as return paths for signals, reducing loop inductance.
- Signal layers tightly coupled with adjacent plane layers, reducing electromagnetic interference (エミ).
5. 主なアプリケーションとユースケース
5.1 Target Application Areas
The12-layer 2+N+2 HDI board, with its high-density interconnect capability and excellent electrical performance, is primarily used in the following areas:
| 応用分野 | Typical Products | Key Requirements |
|---|---|---|
| 5G Infrastructure | 5Gベースステーション, AAU, RRU | High frequency, 高速, 低損失 |
| データセンター | サーバー, スイッチ, ストレージデバイス | High-speed data transmission, 高い信頼性 |
| 高性能コンピューティング | AI アクセラレータ カード, HPC | High-density BGA, 信号の完全性 |
| Wired/Wireless Communications | Optical modules, ルーター, microwave equipment | High-frequency performance, low insertion loss |
| カーエレクトロニクス | アダス, 自動車レーダー (77 GHz) | 高い信頼性, temperature resistance |
| 航空宇宙と防御 | アビオニクス, レーダーシステム | Extreme environment reliability |
ISOLA materials such as TerraGreen® 400G are specifically suited for next-generation 5G infrastructure, data center systems, ハイパフォーマンスコンピューティング, wired/wireless communications, and AI applications, supporting extremely high data transmission rates exceeding 100 Gb/s.
5.2 Compatible Product Types
- High-end smartphone mainboards
- Communication base station RF boards
- High-performance server backplanes
- AI training/inference accelerator cards
- High-speed optical modules
- Automotive radar sensor boards
6. 製品分類
Based on standard PCB industry classification methods, この製品は科学的に次のように分類できます。:
6.1 By Product Structure
Rigid board — Manufactured using rigid substrate materials (FR4/ISOLA).
6.2 レイヤーカウントごとに
多層ボード — Featuring 12 導電層, bonded by insulating dielectric materials and interconnected through vias.
6.3 By Manufacturing Process
HDIボード (高密度相互接続ボード) — Featuring a 2+N+2 sequential lamination structure, classified as a second-order HDI board (2+C+2).
6.4 By IPC-2226 Stackup Type
Type III stackup — 2+N+2 or higher-order stacked/staggered microvia structures.
6.5 By IPC-6012 Quality Class
Available to meetクラス 2 (dedicated-service electronic products) またはクラス 3 (高信頼性電子製品) requirements as per customer specifications.
7. 使用材料
7.1 基板: ISOLA Series Materials
This product uses ISOLA high-performance copper-clad laminates. ISOLA is a leading material supplier in the high-frequency, high-speed PCB sector, with its products widely used in high-speed digital, high-frequency analog, RF/microwave, and other advanced circuit designs.
Typical properties of ISOLA materials (TerraGreen® 400G as an example):
| 財産 | 代表値 | テスト方法 |
|---|---|---|
| ガラス転移温度 (Tg DSC) | 200℃ | IPC-TM-650 2.4.25C |
| ガラス転移温度 (Tg DMA) | 215℃ | IPC-TM-650 2.4.24.4 |
| 分解温度 (Td @5% weight loss) | >380℃ | IPC-TM-650 2.4.24.6 |
| 誘電率 (DK) | 3.15 | IPC-TM-650 2.5.5.5 |
| 損失係数 (Df) | 0.0017 | IPC-TM-650 2.5.5.5 |
| ul可燃性評価 | UL 94 V-0 | UL File E41625 |
ISOLA materials comply with IPC-4101/134 and offer the following advantages:
- Halogen-free and RoHS compliant
- 優れたCAF (conductive anodic filament) 抵抗
- 低水分吸収
- Withstands up to 6 reflow cycles at 260°C
- FR-4 process compatible — can be processed using standard プリント基板装置
7.2 銅箔
- Inner and outer layer copper thickness: 1 オンス (約 35 μm)
- Copper foil type: HVLP3 (ultra-low profile) or RTF (逆処理された) copper foil available upon request
7.3 板厚
- Finished board thickness: 2.0 mm
8. 性能仕様
8.1 Key Electrical Specifications
| パラメーター | 仕様 | メモ |
|---|---|---|
| レイヤー数 | 12 レイヤー | 2+N+2 structure |
| 仕上がり板厚 | 2.0 mm | - |
| 外層の銅の厚さ | 1 オンス (35 μm) | Finished copper |
| 内層の銅の厚さ | 1 オンス (35 μm) | - |
| 最小ビア直径 | 0.1 mm | Laser-drilled microvia |
| 最小線幅 | 0.1 mm | - |
| Minimum Line Spacing | 0.1 mm | - |
| BGA Pad Diameter | 0.15 mm | サポート 0.4 mm pitch BGA |
| 表面仕上げ | 同意する (エレクトロレスニッケル/浸漬ゴールド) | IPC-4552 compliant |
8.2 Reliability Performance
IPC-6012F による, rigid printed boards must meet the following reliability requirements:
- Electrical performance: 絶縁抵抗, dielectric withstanding voltage, インピーダンス制御, 等.
- Mechanical performance: 皮の強度, 反り, 寸法安定性, 等.
- Environmental performance: サーマルサイクリング, humidity testing, salt spray testing, 等.
IPC-6012F has introduced several new requirements for microvia structure reliability, including copper wrap plating, intermediate target lands, microsection evaluation, inner layer plating, and dielectric spacing and reliability issues for microvia structures.
IPC-6012F has increased the minimum copper thickness requirement for plated-through hole barrel walls — raised to 28 μm for Class 3/A (previously 25 μm).
8.3 熱性能
ISOLA materials with Tg ≥ 200°C and Td > 380°C support lead-free soldering processes and multiple reflow cycles.
9. 製品構造
The2+N+2 HDI board via structure includes:
- Laser blind vias: From outer layers (L1/L12) to Layer 3/Layer 10 (buildup section), 0.1 mm diameter
- Laser blind vias: From Layer 3/Layer 10 to inner core layers
- Mechanical through vias: Through the core section (レイヤー 4-9)
- Stacked microvias: Blind vias can be stacked vertically for multi-layer connections
10. 製品の特徴
10.1 高密度相互接続機能
- 0.1 MMマイクロバイアス: Support ultra-high-density routing
- 0.1 mm line width/spacing: Enable fine-line design
- 0.15 mm BGA pads: サポート 0.4 mm pitch ultra-fine-pitch BGAs
10.2 優れた信号の完全性
- ISOLA low-loss material (Df は次のように低い 0.0017) ensures low high-frequency signal attenuation
- 2+N+2 structure supports precise impedance control
- Ground planes tightly coupled with signal layers reduce EMI
10.3 高い信頼性
- Complies with IPC-6012F Class 2/Class 3 要件
- ISOLA material with Tg ≥ 200°C and Td > 380℃
- ENIG surface finish provides excellent solderability and oxidation resistance
10.4 プロセスの互換性
- ISOLA materials are compatible with standard FR-4 process flows
- Supports sequential lamination
- Allows multiple reflow cycles
11. 製造工程の流れ
The 12-layer 2+N+2 HDI board manufacturing process is as follows:
11.1 Core Board Manufacturing (内層)
- 材料の切断: Cut ISOLA substrate per MI requirements
- Inner layer circuit formation: Apply photoresist → expose → develop → etch → strip to form inner layer circuit patterns
- 内層AOI: Automated optical inspection to ensure circuit quality
- 褐色酸化処理: Enhance adhesion between inner layer copper and prepreg
11.2 First Lamination
- Stackup: Stack inner layer cores with prepreg per the stackup structure
- ラミネート加工: Bond multiple layers into one unit under high temperature and pressure
11.3 First Drilling and Via Metallization
- レーザー掘削: Drill 0.1 MMマイクロバイアス
- デスミア: Remove carbonized residue from laser drilling
- Via metallization: Electroless copper deposition to form conductive layer on via walls
- Panel plating: Build up copper thickness on via walls
11.4 Buildup Layer (外層) 製造
- Outer layer circuit formation: Repeat inner layer circuit formation process
- Outer layer AOI: 自動光学検査
11.5 Second Lamination (必要に応じて)
- Secondary lamination: Multiple sequential lamination steps may be required for 2+N+2 structures
11.6 Final Finishing
- Outer layer drilling: Mechanical through-hole drilling
- Via metallization and plating: Through-hole metallization and copper build-up plating
- Outer layer circuits: 外層回路パターンの形成
- はんだマスク: Apply solder mask ink
- 表面仕上げ: 同意する (エレクトロレスニッケル/浸漬ゴールド) — electroless nickel (3–6 μm) + 浸漬ゴールド (0.05–0.1 μm) IPC-4552用
- 凡例の印刷: Silk-screen component designators and other markings
- プロファイルルーティング: ルーティング, Vカット, 等.
- 電気試験: 飛行プローブ または治具テスト
- 最終検査: Visual inspection and packaging
12. ENIG Surface Finish Advantages
この製品が使用しているのは、同意する (エレクトロレスニッケル/浸漬ゴールド) 表面仕上げ, offering the following core advantages:
| アドバンテージ | 説明 |
|---|---|
| 優れた表面平坦性 | Ideal for fine-pitch BGA and SMT assembly |
| Superior solderability | Supports multiple reflow cycles (3+ 回) |
| Long shelf life | 12+ months storage life |
| Strong oxidation resistance | Gold layer protects copper from oxidation |
| 良好な導電性 | Suitable for high-frequency signal transmission |
The ENIG process chemically deposits a nickel-phosphorus alloy layer (approximately 3–6 μm thickness) and a gold layer (approximately 0.05–0.1 μm thickness) on the PCB copper surface.
13. Why Choose UGPCB’s 12-Layer 2+N+2 HDI Board?
- International standard compliance: Strictly follows IPC-6012F, IPC-2221C, IPC-4101E, およびその他の国際規格
- プレミアム素材保証: Uses ISOLA high-performance substrate for high-frequency, high-speed performance
- Advanced manufacturing capability: Precision processing for 0.1 mm microvias and 0.1 mm line width/spacing
- Comprehensive quality control: Full-process quality management from incoming material inspection to final product testing
- Professional engineering support: Provides DFM (製造可能性のための設計) reviews and impedance design support
14. 見積もりを依頼する
UGPCB is committed to providing high-qualityHDI PCB manufacturing services to customers worldwide. Whether you need a12-layer 2+N+2 HDI board or other layer counts and structures of多層PCB, we offer professional technical support and competitive pricing.
How to Get a Quote:
- Submit design files: Send Gerber files, ドリルファイル, and stackup specifications to our sales team
- Specify technical requirements: Include impedance requirements, material preferences, 表面仕上げ, 量, 等.
- Engineering review: Our engineers will perform DFM checks to ensure manufacturability
- Receive a quote: Get a competitive price and lead time quickly
お問い合わせ
Send yourプリント基板 design files to our sales email or submit an inquiry through our website. Our technical team will respond within 24 時間.
データソースステートメント
The technical data and standard information cited in this document are sourced from the following authoritative organizations:
- IPC (エレクトロニクス産業をつなぐ協会) — IPC-6012Fリジッドプリント基板の認定および性能仕様 (9月 2023); IPC-2221Cプリント基板設計に関する一般規格 (December 2023); IPC-4101Eリジッド・多層プリント基板用基材仕様 (March 2017); IPC-4552無電解ニッケル/浸漬金の性能仕様 (同意する) プリント基板用めっき
- イゾラグループ — TerraGreen® 400G Product Data Sheet
- UL (引き受けの研究所) — UL 94 V-0 可燃性評価, UL File Number E41625
- Industry Technical Literature — HDI PCB stackup design and 2+N+2 structure technical documentation
